Semiconductor wafer dicing saw
FIG. 1 is a top, left front perspective view of a semiconductor wafer dicing saw showing our new design;
FIG. 2 is a right side elevational view thereof, the left side view being a mirror image;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top, left perspective view of a second embodiment of FIG. 1, the difference being inclusion of a camera, blade housing and chuck;
FIG. 7 is a top plan view of FIG. 6;
FIG. 8 is a right side elevational view of FIG. 6;
FIG. 9 is a left side elevational view of FIG. 6;
FIG. 10 is a bottom plan view of FIG. 6; and,
FIG. 11 is a rear elevational view of FIG. 6.
The broken line showing of camera, blade housing and chuck in FIGS. 1-3 and 5 is for illustrative purposes only and forms no part on the claimed design for the embodiment of FIGS. 1-5.
Type: Grant
Filed: Jun 25, 1996
Date of Patent: Jul 29, 1997
Inventors: John N. Boucher (Longwood, FL), David E. Bajune (Sanford, FL)
Primary Examiner: Antoine Duval Davis
Law Firm: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
Application Number: 0/56,175
International Classification: 1509;