Abstract: Provided are battery packs and interface modules for electrically interconnecting electrochemical cells in the packs and for providing heat distribution with the packs. An interface module interfaces one side of all electrochemical cells in a battery pack. The interface module may have a substantially planar shape such that the space occupied by the module in the battery pack is minimal. Most, if not all, conductive components of the interface module may be formed from the same sheet of metal. In some embodiments, the interface module includes multiple bus bars such that each bus bar interconnects two or more terminals of different electrochemical cells in the battery pack. Each bus bar may have a separate voltage sense lead extending from the bus bar to a connecting portion. The bus bars may be flexibly supported within the module. The interface module may also include multiple thermistors disposed on different bus bars.

Abstract: Provided are battery packs and interface modules for electrically interconnecting electrochemical cells in the packs and for providing heat distribution with the packs. An interface module interfaces one side of all electrochemical cells in a battery pack. The interface module may have a substantially planar shape such that the space occupied by the module in the battery pack is minimal. Most, if not all, conductive components of the interface module may be formed from the same sheet of metal. In some embodiments, the interface module includes multiple bus bars such that each bus bar interconnects two or more terminals of different electrochemical cells in the battery pack. Each bus bar may have a separate voltage sense lead extending from the bus bar to a connecting portion. The bus bars may be flexibly supported within the module. The interface module may also include multiple thermistors disposed on different bus bars.

Abstract: Provided are battery packs and interface modules for electrically interconnecting electrochemical cells in the packs and for providing heat distribution with the packs. An interface module interfaces one side of all electrochemical cells in a battery pack. The interface module may have a substantially planar shape such that the space occupied by the module in the battery pack is minimal. Most, if not all, conductive components of the interface module may be formed from the same sheet of metal. In some embodiments, the interface module includes multiple bus bars such that each bus bar interconnects two or more terminals of different electrochemical cells in the battery pack. Each bus bar may have a separate voltage sense lead extending from the bus bar to a connecting portion. The bus bars may be flexibly supported within the module. The interface module may also include multiple thermistors disposed on different bus bars.

Abstract: Provided are battery packs and interface modules for electrically interconnecting electrochemical cells in the packs and for providing heat distribution with the packs. An interface module interfaces one side of all electrochemical cells in a battery pack. The interface module may have a substantially planar shape such that the space occupied by the module in the battery pack is minimal. Most, if not all, conductive components of the interface module may be formed from the same sheet of metal. In some embodiments, the interface module includes multiple bus bars such that each bus bar interconnects two or more terminals of different electrochemical cells in the battery pack. Each bus bar may have a separate voltage sense lead extending from the bus bar to a connecting portion. The bus bars may be flexibly supported within the module. The interface module may also include multiple thermistors disposed on different bus bars.

Abstract: In an example, the present invention provides a method for forming a film of material for a solid state battery or other energy storage device. The method includes providing a first precursor species, and providing a second precursor species. The method also includes transferring the first precursor species through a first nozzle and outputting the first precursor species in a first molecular form and transferring the second precursor species through a second nozzle and outputting the second precursor species in a second molecular form. The method includes causing formation of first plurality of particles, ranging from about first diameter to about a second diameter, by intermixing the first precursor species with the second precursor species. The method also includes cooling the first plurality of particles at a rate of greater than 100° C./s to a specified temperature.

Abstract: An apparatus is provided that includes a chamber wall section prone to deflection, a stationary section providing a sealing surface, and a flexible bellows attached to the chamber wall section and the stationary section. A system is also provided that includes a chamber including a chamber wall having an opening, a door disposed to seal the opening, a sealing surface adjacent the opening and isolated from the chamber wall, and a seal between the sealing surface and the chamber wall. Numerous other aspects are provided.

Abstract: Provided are battery packs and interface modules for electrically interconnecting electrochemical cells in the packs and for providing heat distribution with the packs. An interface module interfaces one side of all electrochemical cells in a battery pack. The interface module may have a substantially planar shape such that the space occupied by the module in the battery pack is minimal. Most, if not all, conductive components of the interface module may be formed from the same sheet of metal. In some embodiments, the interface module includes multiple bus bars such that each bus bar interconnects two or more terminals of different electrochemical cells in the battery pack. Each bus bar may have a separate voltage sense lead extending from the bus bar to a connecting portion. The bus bars may be flexibly supported within the module. The interface module may also include multiple thermistors disposed on different bus bars.

Abstract: In an example, the present invention provides a method for forming a film of material for a solid state battery or other energy storage device. The method includes providing a first precursor species, and providing a second precursor species. The method also includes transferring the first precursor species through a first nozzle and outputting the first precursor species in a first molecular form and transferring the second precursor species through a second nozzle and outputting the second precursor species in a second molecular form. The method includes causing formation of first plurality of particles, ranging from about first diameter to about a second diameter, by intermixing the first precursor species with the second precursor species. The method also includes cooling the first plurality of particles at a rate of greater than 100° C./s to a specified temperature.

Abstract: An apparatus is provided that includes a chamber wall section prone to deflection, a stationary section providing a sealing surface, and a flexible bellows attached to the chamber wall section and the stationary section. A system is also provided that includes a chamber including a chamber wall having an opening, a door disposed to seal the opening, a sealing surface adjacent the opening and isolated from the chamber wall, and a seal between the sealing surface and the chamber wall. Numerous other aspects are provided.

Abstract: A method is provided that includes isolating a sealing surface from a chamber wall of a chamber and sealing the chamber between the sealing surface and the chamber wall. An apparatus is provided that includes a chamber wall section prone to deflection, a stationary section providing a sealing surface, and a flexible bellows attached to the chamber wall section and the stationary section. A system is also provided that includes a chamber including a chamber wall having an opening, a door disposed to seal the opening, a sealing surface adjacent the opening and isolated from the chamber wall, and a seal between the sealing surface and the chamber wall. Numerous other aspects are provided.

Abstract: A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.

Abstract: Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member having a convex sealing face and a backside. In another embodiment, a chamber having an apparatus for sealing a substrate transfer passage is provided that includes a chamber body having an interior volume, at least one substrate access defined through the chamber body configured to allow passage of a large area substrate therethrough, and a door member having a convex sealing face moveable between a first position that covers the substrate transfer port and a second position clear of the substrate transfer port. In yet another embodiment, the chamber body may be a load lock chamber.

Abstract: A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.

Abstract: A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.

Abstract: A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.

Abstract: The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.

Abstract: The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.

Abstract: The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.

Abstract: A target, target backing plate, and cover plate form a target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used.The target plate assembly completely covers and seals against a top opening of a sputtering processing chamber. Cooling liquid connections are provided only from the perimeter of the target assembly. When a top vacuum chamber seals the side opposite the pressure chamber, the pressure on both sides of the target assembly is nearly equalized.

Abstract: Centering pins mounted to a susceptor in a vacuum chamber align a glass substrate with respect to the susceptor on which it is supported, and with respect to a shadow frame which overlies the periphery of the substrate and protects the edge and underside of the substrate from undesired processing.Shaped pins loosely mounted in openings in the susceptor so that the pins extend above the upper surface of the susceptor support the centered glass substrate during the transporting stages, but recess into the heated susceptor during processing.