Patents by Inventor David E. Berkstresser

David E. Berkstresser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5603816
    Abstract: A target, target backing plate, and cover plate form a target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used.The target plate assembly completely covers and seals against a top opening of a sputtering processing chamber. Cooling liquid connections are provided only from the perimeter of the target assembly. When a top vacuum chamber seals the side opposite the pressure chamber, the pressure on both sides of the target assembly is nearly equalized.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: February 18, 1997
    Assignee: Applied Materials, Inc.
    Inventors: Richard E. Demaray, Manuel Herrera, David E. Berkstresser
  • Patent number: 5595337
    Abstract: A target, target backing plate, and cover plate form a target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: January 21, 1997
    Assignee: Applied Materials, Inc.
    Inventors: Richard E. Demaray, Manuel Herrera, David E. Berkstresser
  • Patent number: 5565071
    Abstract: A target plate assembly completely covers and seals against a top opening of a sputtering processing chamber. Cooling liquid connections are provided only from the perimeter of the target assembly. When a top vacuum chamber seals the side opposite the pressure chamber, the pressure on both sides of the target assembly is nearly equalized. Large thin target assemblies, such as large flat plates used for flat panel displays can be sputtered effectively and uniformly without adverse sputtering effects due to target deflection or cooling deficiencies.A target, target backing plate, and cover plate form the target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: October 15, 1996
    Assignee: Applied Materials, Inc.
    Inventors: Richard E. Demaray, David E. Berkstresser, Manuel J. Herrera
  • Patent number: 5518593
    Abstract: A shield in a PVD vacuum processing chamber having a configuration which minimizes or eliminates particulates originating from flaking or peeling off from the shield and from arcing between the biased target and surrounding grounded pieces is disclosed. The shield has an "h" cross section with the lower arch of the "h" facing a heater assembly which heats the shield to a temperature approximately equivalent to the temperature of the sputter deposited material. The surface of the shield is polished to promote the release of H.sub.2 O molecules from its surface during the time when a vacuum is initially being pumped. The inside surface of the shield (facing a heater assembly) is treated to have a higher coefficient of surface emissivity than the outer surface to retain more energy and provide more efficient heating.
    Type: Grant
    Filed: September 8, 1994
    Date of Patent: May 21, 1996
    Assignee: Applied Komatsu Technology, Inc.
    Inventors: Akihiro Hosokawa, Richard E. Demaray, David E. Berkstresser
  • Patent number: 5487822
    Abstract: A target plate assembly completely covers and seals against a top opening of a sputtering processing chamber. Cooling liquid connections are provided only from the perimeter of the target assembly. When a top vacuum chamber seals the side opposite the pressure chamber, the pressure on both sides of the target assembly is nearly equalized. Large thin target assemblies, such as large flat plates used for flat panel displays can be sputtered effectively and uniformly without adverse sputtering effects due to target deflection or cooling deficiencies. A target, target backing plate, and cover plate form the target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another.
    Type: Grant
    Filed: April 29, 1994
    Date of Patent: January 30, 1996
    Assignee: Applied Materials, Inc.
    Inventors: Richard E. Demaray, David E. Berkstresser, Manuel J. Herrera
  • Patent number: 5433835
    Abstract: A target, target backing plate, and cover plate form a target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used. The target plate assembly completely covers and seals against a top opening of a sputtering processing chamber. Cooling liquid connections are provided only from the perimeter of the target assembly. When a top vacuum chamber seals the side opposite the pressure chamber, the pressure on both sides of the target assembly is nearly equalized.
    Type: Grant
    Filed: November 24, 1993
    Date of Patent: July 18, 1995
    Assignee: Applied Materials, Inc.
    Inventors: Richard E. Demaray, Manuel Herrera, David E. Berkstresser
  • Patent number: 5352294
    Abstract: Centering pins mounted to a susceptor in a vacuum chamber align a glass substrate with respect to the susceptor on which it is supported, and with respect to a shadow frame which overlies the periphery of the substrate and protects the edge and underside of the substrate from undesired processing.Shaped pins loosely mounted in openings in the susceptor so that the pins extend above the upper surface of the susceptor support the centered glass substrate during the transporting stages, but recess into the susceptor during processing.
    Type: Grant
    Filed: January 28, 1993
    Date of Patent: October 4, 1994
    Inventors: John M. White, David E. Berkstresser, Carl T. Petersen
  • Patent number: 4526392
    Abstract: A rear steered vehicle with improved handling and stability described by having a single front driven wheel and a pair of steered rear wheels. Cornering ability is improved while maintaining a narrow overall width by allowing the rider, front wheel, and frame to lean "into" turns thereby shifting the vehicle's center of gravity to the inside of a turn. Stability at all speeds is improved over other rear steered vehicles by the steering design which rotates the two rear wheels on separate steering axes and the lack of mechanical connection between "leaning" and "steering." This allows the correct ratio of steering and leaning at all speeds. In practice, the rider will "lean" into a turn at any speed and the rear steering geometry will react to the weight transfer and steer the correct amount to maintain stability without additional input from the rider.
    Type: Grant
    Filed: November 15, 1982
    Date of Patent: July 2, 1985
    Inventor: David E. Berkstresser