Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: Embodiments of the invention provide methods and apparatus for in situ feature height measurement of an object being planarized. In one embodiment, a method of planarizing an object comprises polishing a surface of the object to be planarized using a polishing pad having a cavity; and directing an incident light from the cavity of the polishing pad to optically measure feature heights of surface features on the surface of the object to obtain measurement data during the polishing of the surface using the polishing pad. The feature heights are relative height differences of the features measured by directing the incident light at the surface of the object from the cavity and observing a reflected light intensity of a reflected light from the features on the surface to the cavity.

Abstract: Embodiments of the present invention are directed to polishing an object with polishing pad conditioning. In one embodiment, a method for polishing an object comprises placing a contact portion of a polishing pad in contact with a target surface of the object to be planarized over a contact area which is smaller in area than the target surface; conditioning a noncontact portion of the polishing pad which is not in contact with the target surface of the object; and moving the polishing pad relative to the target surface of the object to move the noncontact portion in contact with the target surface of the object and move the contact portion out of contact with the target surface of the object.

Abstract: A method for preparing a semiconductor wafer for whole wafer backside inspection is disclosed. The frontside of the wafer is covered with a protective frontside substrate and the backside portion of the wafer is thinned using conventional techniques. The whole wafer backside is then polished and a backside substrate, preferably of transparent material is juxtaposed to the backside of the wafer, such as with an adhesive or with a frame. The frontside substrate is then removed, exposing electronic devices for device inspection. The backside of the wafer is maintained open or available to backside inspection such as emission microscopy techniques used to detect defects which emit light.

Abstract: Embodiments of the invention as directed to supporting a polishing pad that can be easily replaced. In one embodiment, a method for polishing an object comprises coupling a polishing head to a substrate for holding a polishing pad which is smaller in area than the object; applying a resilient mechanical force to the perimeter of the substrate with the polishing head to hold the substrate in place during a polishing operation; placing the polishing pad in contact with the object; and rotating the polishing pad with the polishing head.

Abstract: A device for supporting and securing thin wafers comprising a housing having an upper shelf extending radially inwardly from the housing and a lower shelf extending radially inwardly from the upper shelf. An upper seal is disposed within the upper shelf and an inspection windowpane is disposed within the lower shelf. A vacuum is provided between the inspection windowpane and the upper seal to secure the wafer to the inspection windowpane and to secure the inspection windowpane to the housing. A ring-shaped frame assembly may further support and secure the wafer.

Abstract: Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process one or more substrates therein. The plurality of modules are controllable separately by individual controllers associated separately with the modules. One of the modules is disengaged from the docking station, and is mechanically removed to free the module from the docking station, while the other modules are still operable to process the one or more substrates therein.

Abstract: A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a wafer carrier disposed partially within the lower portion of the spindle. The wafer carrier has a convex spherical surface formed on a surface opposite the concave spherical surface of the spindle. In addition, a drive cup is included that is disposed between the spindle and the wafer carrier. The drive cup has a concave inner surface and a convex outer surface, and allows the wafer carrier to be tilted about a predefined gimbal point. In this manner, torque can be applied without affecting the gimbal action.

Abstract: A device for supporting and securing thin wafers comprising a housing having an upper shelf extending radially inwardly from the housing and a lower shelf extending radially inwardly from the upper shelf. An upper seal is disposed within the upper shelf and an inspection windowpane is disposed within the lower shelf. A vacuum is provided between the inspection windowpane and the upper seal to secure the wafer to the inspection windowpane and to secure the inspection windowpane to the housing. A ring-shaped frame assembly may further support and secure the wafer.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: A method for preparing a semiconductor wafer for whole wafer backside inspection is disclosed. The frontside of the wafer is covered with a protective frontside substrate and the backside portion of the wafer is thinned using conventional techniques. The whole wafer backside is then polished and a backside substrate, preferably of transparent material is juxtaposed to the backside of the wafer, such as with an adhesive or with a frame. The frontside substrate is then removed, exposing electronic devices for device inspection. The backside of the wafer is maintained open or available to backside inspection such as emission microscopy techniques used to detect defects which emit light.

Abstract: Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process one or more substrates therein. The plurality of modules are controllable separately by individual controllers associated separately with the modules. One of the modules is disengaged from the docking station, and is mechanically removed to free the module from the docking station, while the other modules are still operable to process the one or more substrates therein.

Abstract: Specific embodiments of the present invention provide a method for chemical-mechanical planarization of an object. The method comprises performing a first planarization of the object using a first polishing pad having a smaller surface area than the object being planarized in a processing module; and cleaning the object in the processing module. In some embodiments, cleaning the object comprises scrubbing the object. The object may be scrubbed using a PVA sponge. Cleaning the object may comprise applying ultrasonic energy to the object. The ultrasonic energy may be applied to the object using an ultrasonic wand, ultrasonic shower, or an ultrasonic nozzle. In specific embodiments, the object is precleaned in the processing module, and the object is cleaned in a separate cleaning module. Prior to cleaning the object in the processing module, a second planarization of the object may be performed using a second polishing pad having a smaller surface area than the object being planarized in the processing module.

Abstract: Embodiments of the present invention provide a chemical-mechanical planarization method for planarizing a wafer. The method comprises polishing a surface of the wafer to be planarized, and optically measuring feature heights of features on the surface of the wafer to obtain measurement data during said polishing of the surface. In some embodiments, the feature heights are measured by directing incident light at the surface of the wafer and observing a reflected light intensity of light reflected from the surface. In specific embodiments, the method includes adjusting, in real time, parameters controlling said polishing of the surface in response to the measurement data. The parameters may include a spinning speed of the polishing pad used to polish the surface, an orbiting speed of the polishing pad, a rotational speed of the wafer, a position of the polishing pad, a force between the polishing pad and the object, or the like.

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a platen assembly for holding an object having a target surface to be planarized. A polishing pad is configured to contact the object during planarization with a contact portion over a contact area which is smaller in area than the target surface. The polishing pad has a noncontact portion which is not in contact with the object during planarization. The polishing pad is movable relative to the object to move the noncontact portion in contact with the object and move the contact portion out of contact with the object. A conditioner is configured to condition the noncontact portion of the polishing pad. The noncontact portion of the polishing pad may be conditioned continuously during planarization of the object by the polishing pad. An abrasive may be delivered to the contact area between the polishing pad and the target surface of the object.

Abstract: A system for chemical mechanical planarization comprises a platen assembly for holding an object to be planarized and a polishing head comprising a puck holder assembly for coupling to a substrate for holding a polishing pad. The polishing pad is smaller in surface area than the object. The polishing head is movable from a first region overlying the platen assembly to a second region. The puck holder assembly comprises a backing surface for positioning the substrate, and a clamp ring positioned proximate to the backing surface for supplying mechanical force to the substrate to hold the substrate in place during a polishing operation. A spring mechanism is disposed in the housing for resiliently biasing the clamp ring toward the substrate.

Abstract: The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object comprises a pad having a polishing surface to be placed on a target surface of the object to be polished. A pad drive member is connected to the pad to move the pad relative to the object to change a position of the polishing surface of the pad on the target surface of the object. The pad comprises a backing material having a modulus of elasticity of at least about 300,000 psi. In specific embodiments, the pad includes grooves on the polishing surface. The pad has a thickness between about 0.05 and about 0.1 inch. The pad back material comprises a ceramic material. A compliant layer may be disposed between the pad and the pad drive member. The compliant layer comprises an elastomeric material.

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a platen assembly for holding an object having a target surface to be planarized. A polishing pad is configured to contact the object during planarization with a contact portion over a contact area which is smaller in area than the target surface. The polishing pad has a noncontact portion which is not in contact with the object during planarization. The polishing pad is movable relative to the object to move the noncontact portion in contact with the object and move the contact portion out of contact with the object. A conditioner is configured to condition the noncontact portion of the polishing pad. The noncontact portion of the polishing pad may be conditioned continuously during planarization of the object by the polishing pad. An abrasive may be delivered to the contact area between the polishing pad and the target surface of the object.

Abstract: A system provides a polishing pad to a polishing head for chemical mechanical planarization of an object which is larger in diameter than the polishing pad. The system comprises a polishing head and a plurality of magazines disposed in a first region. Each magazine houses at least one removable puck for holding a polishing pad. At least one of the magazines is configured to feed the pucks from a bottom thereof to be retrieved by the transfer apparatus. The puck is configured be removably coupled to a coupling on the polishing head and to be disposed between the polishing pad and the polishing head. A transfer apparatus is provided for transferring the pucks from the magazines in the first region to a pickup stand in a second region. The polishing head is movable to the second region to pick up the pucks from the pickup stand.