Abstract: Specific embodiments of the present invention are directed to a chemical mechanical planarization apparatus which comprises a platen assembly for holding an object to be planarized, and a polishing pad having a surface size at least as large as a surface size of the object, the polishing pad being movable relative to the object. A table has a surface supporting the polishing pad and including a plurality of grooves forming a patterned surface. In some embodiments, the grooves form a repeated pattern on the surface of the table. The pattern may include a plurality of platelets having the same shape and size. The platelets may be hexagonal and vertically compliant. The surface of the table is harder than the polishing pad.

Abstract: Specific embodiments of the present invention are directed to a method of forming a polishing pad having a smaller diameter than an object to be planarized and to be used for planarizing the object by chemical-mechanical planarization. The method comprises placing a polishing surface of the polishing pad in contact with an abrasive surface of a conditioning object having a shape identical to the object to be planarized. The polishing surface of the polishing pad is engaged with the abrasive surface of the conditioning object under conditions substantially equal to the conditions to be applied for planarizing the object. The polishing surface is observed, and is disengaged from the abrasive surface of the conditioning object when abrasion of a center region of the polishing surface of the polishing pad by the abrasive surface of the conditioning object is initially detected.

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter than the object to be planarized. The shaft is rotatable to spin the polishing head and polishing pad around the shaft axis. An orbit housing has, spaced from an orbital axis, an eccentric hole through which the shaft is rotatably disposed. The orbit housing is rotatable to orbit the shaft, the polishing head, and the polishing pad around the orbital axis. In some embodiments, the object is rotated at an object rotational speed and the polishing pad is rotated around the orbital axis at an orbiting speed. A ratio of the greater of the object rotational speed and the orbiting speed to the lesser of the object rotational speed and the orbiting speed is a non-integer.

Abstract: Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a shaft having a shaft axis and being connected with a polishing head which is coupled to a polishing pad. The polishing pad has a smaller diameter than the object to be planarized. The shaft is rotatable to spin the polishing head and polishing pad around the shaft axis. A channel extends along the shaft axis through the shaft and the polishing head. A supply tube is configured to deliver a polishing chemical through the channel to the polishing pad. In some embodiments, the polishing pad is an annular pad having an opening for flowing the polishing chemical therethrough to a region between the polishing pad and the object. A sensor is provided for monitoring a level of the polishing chemical in the channel of the shaft. A pump is provided for pumping the polishing chemical through the supply tube to the channel of the shaft.

Abstract: The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus for polishing an object comprises a pad having a polishing surface to be placed on a target surface of the object to be polished. A pad drive member is connected to the pad to move the pad relative to the object to change a position of the polishing surface of the pad on the target surface of the object. A drive support is movably coupled with the pad drive member to support the pad drive member for rotation relative to the drive support around a pivot point which is disposed substantially on the target surface of the object during polishing.

Abstract: A method of polishing semiconductor wafers. The method includes spacing the polishing pad from the center of the wafer by a selected offset distance (406) and translating the polishing pad in a manner wherein the translation speed varies as the pad is moved across the surface of the wafer (414). A method (FIGS. 7 and 9) for calibrating a polishing apparatus includes iteratively selecting an offset distance, performing a polish, inspecting the resulting removal profile, and repeating until a desired characteristic (FIG. 6C) in the removal profile is attained.

Abstract: In a chemical-mechanical planarization apparatus, a pad spindle includes a pad chuck operative for selective attachment and detachment of a polishing pad. The pad chuck includes a plurality of pivoting links which cooperate to provide a clamping action to retain the polishing pad. A detachment station engages the pivoting links to detach the polishing pad.

Abstract: A system provides a polishing pad for chemical mechanical planarization of an object larger in diameter than the polishing pad. The system comprises a magazine including a bottom for exposing at least a portion of a puck which holds a polishing pad, and a transfer apparatus for transferring the puck from the magazine in the first region to a pickup stand in a second region. The transfer apparatus includes a puck support being movable to retrieve the puck from the bottom of the magazine by coupling a capture portion of the puck support with an exposed portion of the puck and moving the puck with the puck support away from the magazine.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: A method of polishing semiconductor wafers. The method includes spacing the polishing pad from the center of the wafer by a selected offset distance (406) and translating the polishing pad in a manner wherein the translation speed varies as the pad is moved across the surface of the wafer (414). A method (FIGS. 7 and 9) for calibrating a polishing apparatus includes iteratively selecting an offset distance, performing a polish, inspecting the resulting removal profile, and repeating until a desired characteristic (FIG. 6C) in the removal profile is attained.

Abstract: The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support operatively coupled to the edge support, the back support having at least one surface for supporting a back side of the object during planarization. The surface for supporting the back side provides a substantially friction free interface between the surface and the back side of the object to allow the object to move across the surface of the back support. In some embodiments, an edge support is movably coupled to an edge of an object for supporting and positioning the object during planarization.

Abstract: A chemical mechanical polishing method and apparatus (100) includes a control mechanism (190) having control programs for operating the apparatus in accordance with the invention. The apparatus includes a memory store (192) for containing an offset distance and an additional memory store for containing a velocity profile. A polish operation is achieved either by providing a polishing path based on the offset distance. A method (FIG. 7) and system (FIG. 8) for calibrating a polishing apparatus includes iteratively selecting an offset distance, performing a polish, inspecting the resulting removal profile, and repeating until a desired characteristic in the removal profile is attained.

Abstract: An apparatus for chemical mechanical planarization (100). The apparatus has a platen assembly for holding an object (e.g., wafer, disk, flat panel, glass) to be planarized. The apparatus (100) also has a polishing head coupled to a polishing pad, which has a smaller diameter than the object. The polishing head is movable (e.g., pivotable, rotatable, translational) from a first region overlying the platen assembly to a second region, which is outside the first region. A removable substrate is coupled between the polishing pad and the polishing head. The removable substrate is removably coupled to a coupling on the polishing head. The apparatus also has a first magazine (511) disposed in the second region, where the first magazine houses at least one substrate comprises a first polishing pad to be placed on the coupling on the polishing head. A second magazine (513) housing at least one substrate comprising a second polishing pad may be provided in the second region.

Abstract: A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a wafer carrier disposed partially within the lower portion of the spindle. The wafer carrier has a convex spherical surface formed on a surface opposite the concave spherical surface of the spindle. In addition, a drive cup is included that is disposed between the spindle and the wafer carrier. The drive cup has a concave inner surface and a convex outer surface, and allows the wafer carrier to be tilted about a predefined gimbal point. In this manner, torque can be applied without affecting the gimbal action.

Abstract: A chemical-mechanical polishing apparatus (100, 200) comprising a polishing pad assembly. The polishing pad assembly (300) comprises a removable cap (318) to be rotatably coupled to a drive device of a chemical mechanical polishing apparatus and a polishing pad comprising a fixed abrasive disposed on the removable cap. The removable cap (318) and the polishing pad being a detached unit to be attached to or removed from the drive device.

Abstract: The invention is an apparatus and method for measuring drainage time of a papermaking stock suspension. The apparatus will automatically measure drainage times of a plurality of samples which will preferably be of differing basis weights. It consists of a sheet mold reservoir and dropleg which index against or away from a table having spaced apart sheet forming locations. Operation of the apparatus is determined by a programmable controller which causes stock to be automatically transferred to the sheet mold and the reservoir and dropleg to be automatically and appropriately positioned. After a sheet is formed the table automatically indexes to the next forming position where the cycle is repeated. The method involves plotting a series of at least three points to determine the slope of drainage time versus the basis weight of the sheets formed. This can be used as an indicator of the drainage characteristics of a stock of given basis weight on the forming section of a paper machine.

Abstract: Articles are formed of materials which have at least one layer comprising a mixture of thermoplastic and other fibers. This latter layer may be thermobonded together and then densified along at least a section of the eventual peripheral edge margin of an article to be formed from the material. Thermoplastic material containing cover sheets may also be secured to the core and densified in this manner. The entire eventual peripheral edge margin of the article is typically densified. The material is cut within the densified region or slightly outside the densified region to provide a soft peripheral edge. Absorbent materials may be thermobonded within the layer and surrounded by a densified edge to fix them within the article. The composite materials are used in manufacturing infant car seat liners and other articles. In addition, sections of the material may be densified and provided with weakened areas, such as perforations, to enable users to selectively separate the articles along the perforations.

Abstract: A tray classifier in which the trays are locked together easily, and stay locked together while being shaken, but are movable with respect to each other if the trays came in contact with an object. The trays have upper and lower locking surfaces which nest with the locking surfaces of the stack locking member of an adjacent upper or lower tray.

Abstract: A seed sowing system and method employing photoelectric sensing equipment to detect singulated seeds and to actuate stepping equipment that ensures separate delivery of seeds to individual planting loci. The seed may come to the sensing equipment via a singulator and a low-pressure air stream. The photoelectric sensor is actuated each time the air stream carries a seed past a certain locus, and the sensor, in turn, actuates a cyclic stepping device by which each seed in a cycle is delivered into a different delivery tube and from there is deposited in a separate receptacle of a shutter. The stepping device is interconnected electronically with shutter indexing mechanism, by which the shutter is advanced and reindexed after each row of its seed-receiving openings has received its seeds, which may come from a single cycle or from a plurality of cycles.