Abstract: A micro-machined ultrasonic transducer (MUT) substrate that reduces or eliminates the lateral propagation of acoustic energy includes holes, commonly referred to as vias, formed in the substrate and proximate to a MUT element. The vias in the MUT substrate reduce or eliminate the propagation of acoustic energy traveling laterally in the MUT substrate. The vias can be doped to provide an electrical connection between the MUT element and circuitry present on the surface of an integrated circuit substrate over which the MUT substrate is attached.

Abstract: A system, a method, and a computer program product for determining tactile cueing of a flight control input apparatus includes an interface for receiving observed parameters relating to the flight envelope of an aircraft. Upstream processing elements receive the observed states, convert dimensional aircraft state parameters into nondimensional aircraft state parameters, and provide the data to neural networks. The neural networks receive combinations of observed parameters and nondimensional aircraft state parameters and predict flight envelope limiting parameters. The neural networks are trained to predict the limiting parameters. A downstream processing element determines the most limiting flight envelope limiting parameter provided from the neural networks, therefore providing a tactile cueing position for a flight control input apparatus.

Abstract: A semi-invasive ultrasound imaging system for imaging biological tissue includes a transesophageal probe or a transnasal, transesophageal probe connected to a two-dimensional ultrasound transducer array, a transmit beamformer, a receive beamformer, and an image generator. The two-dimensional transducer array is disposed on a distal portion of the probe's elongated body. The transmit beamformer is connected to the transducer array and is constructed to transmit several ultrasound beams over a selected pattern defined by azimuthal and elevation orientations. The receive beamformer is connected to the transducer array and is constructed to acquire ultrasound data from the echoes reflected over a selected tissue volume. The tissue volume is defined by the azimuthal and elevation orientations and a selected scan range. The receive beamformer is constructed to synthesize image data from the acquired ultrasound data.

Abstract: A split detent tactile cueing vehicle control system (10) for a vehicle (11) is provided including an active control inceptor system (12). The active system (12) includes a control inceptor (22) having a plurality of positions and a position sensor (42) that generates a control inceptor position signal. The tactile cueing system (10) also includes a plurality of vehicle performance sensors that generate a plurality of vehicle performance signals. A flight controller (20) is electrically coupled to the position sensor (42) and the plurality of vehicle performance sensors, and generates a control inceptor actuation signal by applying a tactile cueing model having a split detent and in response to the position signal and the plurality of vehicle performance signals. A method of performing the same is also provided.

Abstract: A system, a method, and a computer program product for determining tactile cueing of a flight control input apparatus includes an interface for receiving observed parameters relating to the flight envelope of an aircraft. Upstream processing elements receive the observed states, convert dimensional aircraft state parameters into nondimensional aircraft state parameters, and provide the data to neural networks. The neural networks receive combinations of observed parameters and nondimensional aircraft state parameters and predict flight envelope limiting parameters. The neural networks are trained to predict the limiting parameters. A downstream processing element determines the most limiting flight envelope limiting parameter provided from the neural networks, therefore providing a tactile cueing position for a flight control input apparatus.

Abstract: A micro-machined ultrasonic transducer (MUT) substrate that reduces or eliminates the lateral propagation of acoustic energy includes holes, commonly referred to as vias, formed in the substrate and proximate to a MUT element. The vias in the MUT substrate reduce or eliminate the propagation of acoustic energy traveling laterally in the MUT substrate. The vias can be doped to provide an electrical connection between the MUT element and circuitry present on the surface of an integrated circuit substrate over which the MUT substrate is attached.

Abstract: ABSTRACT A split detent tactile cueing vehicle control system (10) for a vehicle (11) is provided including an active control inceptor system (12). The active system (12) includes a control inceptor (22) having a plurality of positions and a position sensor (42) that generates a control inceptor position signal. The tactile cueing system (10) also includes a plurality of vehicle performance sensors that generate a plurality of vehicle performance signals. A flight controller (20) is electrically coupled to the position sensor (42) and the plurality of vehicle performance sensors, and generates a control inceptor actuation signal by applying a tactile cueing model having a split detent and in response to the position signal and the plurality of vehicle performance signals. A method of performing the same is also provided.

Abstract: Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.

Abstract: An ultrasound system and method for intravascular imaging is disclosed. The ultrasound system includes an intravascular catheter with an ultrasound transducer array, a transmit beamformer, a receive beamformer, and an image generator. The intravascular catheter has an elongated body made for insertion into a blood vessel and connected to a catheter handle. The catheter includes a catheter core located inside a steerable guide sheath, both having a proximal part and a distal part. The catheter includes an articulation region connected to a positioning device for positioning the transducer array to have a selected orientation relative to an examined tissue region. For each orientation of the transducer array, the transmit and receive beamformers acquire ultrasound data over an image plane of the examined tissue region.

Abstract: An AC biasing arrangement for a micro-machined ultrasonic transducer (MUT) is disclosed. The AC biasing arrangement allows the sensitivity of each MUT element in an array to be adjusted without collapsing the MUT membrane. The sensitivity of the MUT element can be adjusted by varying the frequency of the AC bias signal supplied to the MUT element. An alternative embodiment of the invention adds a second AC bias signal having a phase opposite the phase of the first AC bias signal. This arrangement provides a neutral bias signal, thereby removing the large amplitude bias signal from the MUT element.

Abstract: An ultrasonic transducer array comprising individual transmit MUT elements and receive MUT elements includes the transmit MUT elements and the receive MUT elements distributed in two dimensions over the array. By using different MUT elements for transmit and receive operation, each MUT element can be independently optimized for either transmit operation or receive operation. Furthermore, by independently optimizing the MUT elements for either transmit or receive operation, the same bias voltage can be applied to the MUT elements, thereby simplifying the bias circuitry associated with the MUT transducer array. Alternatively, because the MUT elements are independently optimized for transmit and receive, different bias voltages can be applied to the transmit and receive elements, thus providing further optimization of the elements.

Abstract: Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.

Abstract: A semi-invasive ultrasound imaging system for imaging biological tissue includes a transesophageal probe or a transnasal, transesophageal probe connected to a two-dimensional ultrasound transducer array, a transmit beamformer, a receive beamformer, and an image generator. The two-dimensional transducer array is disposed on a distal portion of the probe's elongated body. The transmit beamformer is connected to the transducer array and is constructed to transmit several ultrasound beams over a selected pattern defined by azimuthal and elevation orientations. The receive beamformer is connected to the transducer array and is constructed to acquire ultrasound data from the echoes reflected over a selected tissue volume. The tissue volume is defined by the azimuthal and elevation orientations and a selected scan range. The receive beamformer is constructed to synthesize image data from the acquired ultrasound data.

Abstract: A semi-invasive ultrasound imaging system for imaging biological tissue includes a transesophageal probe or a transnasal, transesophageal probe connected to a two-dimensional ultrasound transducer array, a transmit beamformer, a receive beamformer, and an image generator. The two-dimensional transducer array is disposed on a distal portion of the probe's elongated body. The transmit beamformer is connected to the transducer array and is constructed to transmit several ultrasound beams over a selected pattern defined by azimuthal and elevation orientations. The receive beamformer is connected to the transducer array and is constructed to acquire ultrasound data from the echoes reflected over a selected tissue volume. The tissue volume is defined by the azimuthal and elevation orientations and a selected scan range. The receive beamformer is constructed to synthesize image data from the acquired ultrasound data.

Abstract: A system for attaching an acoustic element to an integrated circuit includes various ways in which to connect piezoelectric ceramic or micro-machined ultrasonic transducer (MUT) elements to an integrated circuit (IC), thus reducing the number of conductors required to connect the acoustic element to the IC by combining the signals in the IC. In another aspect of the invention, the transducer elements include an electrically conductive acoustic layer comprising a backing layer and/or a de-matching layer that is connected to an IC.

Abstract: A thermal management system for a portable battery powered electronic device, and particularly, a portable battery powered ultrasound device, which controls the temperature of the device such that the external surface temperature satisfies medical safety regulatory requirements, and such that the heat generated by the device does not reduce battery life, reduce component life, decrease reliability of the device, or cause device shutdown because of overheating. A thermal management system monitors the respective temperatures of various system components, and, based on the monitored temperatures, performs control to cool the ultrasound system, maintaining the external surface temperature below the safety regulated temperatures and ensuring reliability of system components.

Abstract: An AC biasing arrangement for a micro-machined ultrasonic transducer (MUT) is disclosed. The AC biasing arrangement allows the sensitivity of each MUT element in an array to be adjusted without collapsing the MUT membrane. The sensitivity of the MUT element can be adjusted by varying the frequency of the AC bias signal supplied to the MUT element. An alternative embodiment of the invention adds a second AC bias signal having a phase opposite the phase of the first AC bias signal. This arrangement provides a neutral bias signal, thereby removing the large amplitude bias signal from the MUT element.

Abstract: A system for attaching an acoustic element to an integrated circuit includes various ways in which to connect piezoelectric ceramic or micro-machined ultrasonic transducer (MUT) elements to an integrated circuit (IC), thus reducing the number of conductors required to connect the acoustic element to the IC by combining the signals in the IC. In another aspect of the invention, the transducer elements include an electrically conductive acoustic layer comprising a backing layer and/or a de-matching layer that is connected to an IC.

Abstract: A micro-machined ultrasonic transducer (MUT) substrate that reduces or eliminates the lateral propagation of acoustic energy includes holes, commonly referred to as vias, formed in the substrate and proximate to a MUT element. The vias in the MUT substrate reduce or eliminate the propagation of acoustic energy traveling laterally in the MUT substrate. The vias can be doped to provide an electrical connection between the MUT element and circuitry present on the surface of an integrated circuit substrate over which the MUT substrate is attached.

Abstract: The invention is a wafer having variable acoustic properties. The wafer may be used as a substrate over which to form an ultrasonic transducer, an IC, or may be used as a circuit board. An ultrasonic transducer formed on the wafer may include piezoelectric ceramic transducer elements or MUT elements. By controlling the acoustic impedance of the wafer upon which the integrated control circuitry for an ultrasonic transducer is formed, the acoustic impedance of the wafer can be matched to the acoustic impedance requirements of the ultrasonic transducer. Furthermore, by the addition of internal voids, the wafer reduces or eliminates the lateral propagation of acoustic energy through the wafer.