Patents by Inventor David Gracias

David Gracias has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220346760
    Abstract: Microgrippers adapted to capture, manipulate, and contain single cells in both in vitro and in vivo cell applications are disclosed. The energy required to actuate these microgrippers is derived from the release of residual stress and does not require any wires, tethers, or batteries. Because the microgrippers are made from biocompatible and biosorbable materials, they do not accumulate in tissue. Accordingly, they can be used for in vivo applications, such as for gripping single cells in tissue biopsies.
    Type: Application
    Filed: May 16, 2022
    Publication date: November 3, 2022
    Inventors: David GRACIAS, Kate MALACHOWSKI
  • Patent number: 11331085
    Abstract: Microgrippers adapted to capture, manipulate, and contain single cells in both in vitro and in vivo cell applications are disclosed. The energy required to actuate these microgrippers is derived from the release of residual stress and does not require any wires, tethers, or batteries. Because the microgrippers are made from biocompatible and biosorbable materials, they do not accumulate in tissue. Accordingly, they can be used for in vivo applications, such as for gripping single cells in tissue biopsies.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: May 17, 2022
    Assignee: The Johns Hopkins University
    Inventors: David Gracias, Kate Malachowski
  • Publication number: 20210372995
    Abstract: In one aspect, provided is a composition (biomimetic composition) that includes a biomimetic in vitro model of an arteriolar vessel comprising: at least one of 1) human smooth muscle cells and 2) human pulmonary endothelial cells; wherein the vessel recapitulates one or more of the overall tubular geometry, morphometrics, extracellular matrix constituents, cellular morphology, cellular alignment, and functional heterotypic connections between the human smooth muscle cells and/or the human endothelial cells as compared to an in vivo arteriolar vessel. A microfluidics-based model platform of the pulmonary circulation is provided. Methods of use include measuring flow in biomimetic vessels, and to determine the resistance of these biomimetic vessels in the setting of a variety of experimental conditions that recapitulate the pathobiology of pulmonary hypertension.
    Type: Application
    Filed: October 22, 2018
    Publication date: December 2, 2021
    Inventors: Lewis Romer, David Gracias, Jayson Pagaduan, Anil Bhatta, Xing Chen, Qianru Jin
  • Patent number: 10192471
    Abstract: A device, system, and method for utilizing precisely patterned and chemically loaded three-dimensional porous containers akin to “chemical voxels” is disclosed to enable display of dynamic visual patterns via spatial and temporal control of both local and global chemical release. Variations in porosity, volume, shape and relative positioning of the chemical voxels can be used to control the types of images that are formed with control in both space and time. Static or moving images can be displayed using the device, system, and method of the present invention.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: January 29, 2019
    Assignee: The Johns Hopkins University
    Inventors: David Gracias, Yevgeniy Kalinin, Shivendra Pandey, Jinpyo Hong
  • Publication number: 20160300382
    Abstract: An embodiment in accordance with the present invention is directed to a device, system, and method for utilizing precisely patterned and chemically loaded three-dimensional porous containers akin to “chemical voxels” to enable dynamic visual patterns via spatial and temporal control of both local and global chemical release. Variations in porosity, volume, shape and relative positioning of the chemical voxels can be used to control the types of images that are formed with control in both space and time. Static or moving images can be displayed using the device, system, and method of the present invention.
    Type: Application
    Filed: April 8, 2016
    Publication date: October 13, 2016
    Inventors: David Gracias, Yevgeniy Kalinin, Shivendra Pandey, Jinpyo Hong
  • Publication number: 20160106399
    Abstract: Microgrippers adapted to capture, manipulate, and contain single cells in both in vitro and in vivo cell applications are disclosed. The energy required to actuate these microgrippers is derived from the release of residual stress and does not require any wires, tethers, or batteries. Because the microgrippers are made from biocompatible and biosorbable materials, they do not accumulate in tissue. Accordingly, they can be used for in vivo applications, such as for gripping single cells in tissue biopsies.
    Type: Application
    Filed: October 16, 2015
    Publication date: April 21, 2016
    Applicant: THE JOHNS HOPKINS UNIVERSITY
    Inventors: David GRACIAS, Kate MALACHOWSKI
  • Patent number: 7518244
    Abstract: By exposing dielectrics to a strong electric field, anisotropic characteristics may be introduced into the dielectric. This may result in the dielectric having different dielectric constants in different directions. As integrated circuits scale, importance of line to line capacitance in one plane increases. Thus, in some embodiments, the dielectric constant of the oriented dielectric may be lower in the plane that controls line to line capacitance.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: April 14, 2009
    Assignee: Intel Corporation
    Inventors: Kevin O'Brien, David Gracias
  • Patent number: 7375425
    Abstract: Fluidic self-assembly may be utilized to form a stack of two integrated circuits. The integrated circuits may include surface mount electrical connections and surface features that control the alignment between the integrated circuits. In particular, the contacts may be provided on one side of each integrated circuit and surface features may cause the integrated circuits to align with one another in an immersion fluid. The aligned circuits may join to form physical and electrical connections. The resulting structure may be a stack of two integrated circuits electrically coupled to one another.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: May 20, 2008
    Assignee: Intel Corporation
    Inventor: David Gracias
  • Publication number: 20070020310
    Abstract: The present invention relates to a nanoscale or microscale container for encapsulation and delivery of materials or substances, including, but not limited to, cells, drugs, tissue, gels and polymers contained within the container, with subsequent release of the therapeutic materials in situ, methods of fabricating the container by folding a 2D precursor into the 3D container, and the use of the container in in-vivo or in-vitro applications. The container can be in any polyhedral shape and its surfaces can have either no perforations or nano/microscale perforations. The container is coated with a biocompatible metal, e.g. gold, or polymer, e.g. parylene, layer and the surfaces and hinges of the container are made of any metal or polymer combinations.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 25, 2007
    Inventors: David Gracias, Barjor Gimi, Zaver Bhujwalla
  • Publication number: 20060191125
    Abstract: Techniques for self assembly of macro-scale objects, optionally defining electrical circuitry, are described, as well as articles formed by self assembly. Components can be joined, during self-assembly by minimization of free energy, capillary attraction, or a combination.
    Type: Application
    Filed: February 13, 2006
    Publication date: August 31, 2006
    Applicant: President and Fellows of Harvard College
    Inventors: David Gracias, Joe Tien, George Whitesides
  • Publication number: 20060118971
    Abstract: Fluidic self-assembly may be utilized to form a stack of two integrated circuits. The integrated circuits may include surface mount electrical connections and surface features that control the alignment between the integrated circuits. In particular, the contacts may be provided on one side of each integrated circuit and surface features may cause the integrated circuits to align with one another in an immersion fluid. The aligned circuits may join to form physical and electrical connections. The resulting structure may be a stack of two integrated circuits electrically coupled to one another.
    Type: Application
    Filed: January 9, 2006
    Publication date: June 8, 2006
    Inventor: David Gracias
  • Patent number: 7018867
    Abstract: Fluidic self-assembly may be utilized to form a stack of two integrated circuits. The integrated circuits may include surface mount electrical connections and surface features that control the alignment between the integrated circuits. In particular, the contacts may be provided on one side of each integrated circuit and surface features may cause the integrated circuits to align with one another in an immersion fluid. The aligned circuits may join to form physical and electrical connections. The resulting structure may be a stack of two integrated circuits electrically coupled to one another.
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: March 28, 2006
    Assignee: Intel Corporation
    Inventor: David Gracias
  • Publication number: 20050236714
    Abstract: An inter-layer dielectric structure and method of making such structure are disclosed. A composite dielectric layer, initially comprising a porous matrix and a porogen, is formed. Subsequent to other processing treatments, the porogen is decomposed and removed from at least a portion of the porous matrix, leaving voids defined by the porous matrix in areas previously occupied by the porogen. The resultant structure has a desirably low k value as a result of the porosity and materials comprising the porous matrix and porogen. The composite dielectric layer may be used in concert with other dielectric layers of varying porosity, dimensions, and material properties to provide varied mechanical and electrical performance profiles.
    Type: Application
    Filed: June 28, 2005
    Publication date: October 27, 2005
    Inventors: Jihperng Leu, Grant Kloster, David Gracias, Lee Rockford, Peter Moon, Chris Barns
  • Publication number: 20050224980
    Abstract: A die is provided with an interconnect, and the grain structure of the interconnect is adapted to reduce electron scattering.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 13, 2005
    Inventors: Jihperng Leu, Chih-I Wu, Mark Liu, Kevin Fischer, Chia-Hong Jan, David Gracias
  • Publication number: 20050190020
    Abstract: By exposing dielectrics to a strong electric field, anisotropic characteristics may be introduced into the dielectric. This may result in the dielectric having different dielectric constants in different directions. As integrated circuits scale, importance of line to line capacitance in one plane increases. Thus, in some embodiments, the dielectric constant of the oriented dielectric may be lower in the plane that controls line to line capacitance.
    Type: Application
    Filed: April 11, 2005
    Publication date: September 1, 2005
    Inventors: Kevin O'Brien, David Gracias
  • Publication number: 20050181593
    Abstract: An inter-layer dielectric structure and method of making such structure are disclosed. A composite dielectric layer, initially comprising a porous matrix and a porogen, is formed. Subsequent to other processing treatments, the porogen is decomposed and removed from at least a portion of the porous matrix, leaving voids defined by the porous matrix in areas previously occupied by the porogen. The resultant structure has a desirably low k value as a result of the porosity and materials comprising the porous matrix and porogen. The composite dielectric layer may be used in concert with other dielectric layers of varying porosity, dimensions, and material properties to provide varied mechanical and electrical performance profiles.
    Type: Application
    Filed: November 21, 2002
    Publication date: August 18, 2005
    Inventors: Jihperng Leu, Grant Kloster, David Gracias, Lee Rockford, Peter Moon, Chris Barns
  • Patent number: 6927180
    Abstract: By exposing dielectrics to a strong electric field, anisotropic characteristics may be introduced into the dielectric. This may result in the dielectric having different dielectric constants in different directions. As integrated circuits scale, importance of line to line capacitance in one plane increases. Thus, in some embodiments, the dielectric constant of the oriented dielectric may be lower in the plane that controls line to line capacitance.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: August 9, 2005
    Assignee: Intel Corporation
    Inventors: Kevin O'Brien, David Gracias
  • Publication number: 20050091931
    Abstract: Methods and solutions for forming self assembled organic monolayers that are covalently bound to metal interfaces are presented along with a device containing a self assembled organic monolayer. Embodiments of the present invention utilize self assembled thiolate monolayers to prevent the electromigration and surface diffusion of copper atoms while minimizing the resistance of the interconnect lines. Self assembled thiolate monolayers are used to cap the copper interconnect lines and chemically hold the copper atoms at the top of the lines in place, thus preventing surface diffusion. The use of self assembled thiolate monolayers minimizes the resistance of copper interconnect lines because only a single monolayer of approximately 10 ? and 20 ? in thickness is used.
    Type: Application
    Filed: November 23, 2004
    Publication date: May 5, 2005
    Inventor: David Gracias
  • Publication number: 20050093162
    Abstract: Methods and solutions for forming self assembled organic monolayers that are covalently bound to metal interfaces are presented along with a device containing a self assembled organic monolayer. Embodiments of the present invention utilize self assembled thiolate monolayers to prevent the electromigration and surface diffusion of copper atoms while minimizing the resistance of the interconnect lines. Self assembled thiolate monolayers are used to cap the copper interconnect lines and chemically hold the copper atoms at the top of the lines in place, thus preventing surface diffusion. The use of self assembled thiolate monolayers minimizes the resistance of copper interconnect lines because only a single monolayer of approximately 10 ? and 20 ? in thickness is used.
    Type: Application
    Filed: November 23, 2004
    Publication date: May 5, 2005
    Inventor: David Gracias
  • Publication number: 20050090103
    Abstract: Methods and solutions for forming self assembled organic monolayers that are covalently bound to metal interfaces are presented along with a device containing a self assembled organic monolayer. Embodiments of the present invention utilize self assembled thiolate monolayers to prevent the electromigration and surface diffusion of copper atoms while minimizing the resistance of the interconnect lines. Self assembled thiolate monolayers are used to cap the copper interconnect lines and chemically hold the copper atoms at the top of the lines in place, thus preventing surface diffusion. The use of self assembled thiolate monolayers minimizes the resistance of copper interconnect lines because only a single monolayer of approximately 10 ? and 20 ? in thickness is used.
    Type: Application
    Filed: November 23, 2004
    Publication date: April 28, 2005
    Inventor: David Gracias