Patents by Inventor David H. Quach
David H. Quach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090032522Abstract: A substrate heater comprising a bake plate having an upper surface, a lower surface and a peripheral side surface extending between the upper and lower surfaces, the bake plate including at least one heating element, at least one temperature sensor and a plurality of wires including at least one wire coupled to the heating element and at least one wire coupled to the temperature sensor; a shield spaced apart from and generally surrounding the lower and peripheral side surfaces of the bake plate, the shield having an interior upper surface facing the lower surface of the bake plate, an interior side surface facing the peripheral side surface of the bake plate and a lower surface opposite the interior upper surface; a patterned signal layer formed on the lower surface of the shield, wherein the plurality of wires are electrically coupled to a corresponding plurality of signal traces formed in the patterned signal layer; and a connector, electrically coupled to the plurality of signal traces in the patterned sigType: ApplicationFiled: August 15, 2008Publication date: February 5, 2009Applicant: SOKUDO CO., LTD.Inventors: Martin Jeff Salinas, David H. Quach
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Patent number: 7427728Abstract: A substrate heater comprising a bake plate having an upper surface, a lower surface and a peripheral side surface extending between the upper and lower surfaces, the bake plate including at least one heating element, at least one temperature sensor and a plurality of wires including at least one wire coupled to the heating element and at least one wire coupled to the temperature sensor; a shield spaced apart from and generally surrounding the lower and peripheral side surfaces of the bake plate, the shield having an interior upper surface facing the lower surface of the bake plate, an interior side surface facing the peripheral side surface of the bake plate and a lower surface opposite the interior upper surface; a patterned signal layer formed on the lower surface of the shield, wherein the plurality of wires are electrically coupled to a corresponding plurality of signal traces formed in the patterned signal layer; and a connector, electrically coupled to the plurality of signal traces in the patterned sigType: GrantFiled: July 7, 2006Date of Patent: September 23, 2008Assignee: Sokudo Co., Ltd.Inventors: Martin Jeff Salinas, David H. Quach
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Publication number: 20080223293Abstract: A cluster tool for processing a substrate includes a cassette and a processing module including a first process chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing modules also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.Type: ApplicationFiled: February 19, 2008Publication date: September 18, 2008Applicant: Sokudo Co,. Ltd.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Publication number: 20080199282Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.Type: ApplicationFiled: April 21, 2008Publication date: August 21, 2008Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Publication number: 20080145191Abstract: A substrate transport module adapted to transport a substrate in a processing chamber of a semiconductor processing apparatus. The substrate transport module includes a substrate cooling surface and a plurality of coolant channels disposed in the substrate transport module and in thermal communication with the substrate cooling surface. The substrate transport module also includes a plurality of vacuum channels disposed in the substrate transport module and a plurality of proximity pins extending to a predetermined height above the substrate cooling surface. Each of the plurality of proximity pins is in fluid communication with one or more of the plurality of vacuum channels.Type: ApplicationFiled: March 21, 2007Publication date: June 19, 2008Applicant: SOKUDO CO., LTD.Inventors: Martin Jeff Salinas, Tetsuya Ishikawa, David H. Quach, Natarajan Ramanan
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Patent number: 7357842Abstract: A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing module also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer arm assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.Type: GrantFiled: April 22, 2005Date of Patent: April 15, 2008Assignee: Sokudo Co., Ltd.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Publication number: 20080006619Abstract: A substrate heater comprising a bake plate having an upper surface, a lower surface and a peripheral side surface extending between the upper and lower surfaces, the bake plate including at least one heating element, at least one temperature sensor and a plurality of wires including at least one wire coupled to the heating element and at least one wire coupled to the temperature sensor; a shield spaced apart from and generally surrounding the lower and peripheral side surfaces of the bake plate, the shield having an interior upper surface facing the lower surface of the bake plate, an interior side surface facing the peripheral side surface of the bake plate and a lower surface opposite the interior upper surface; a patterned signal layer formed on the lower surface of the shield, wherein the plurality of wires are electrically coupled to a corresponding plurality of signal traces formed in the patterned signal layer; and a connector, electrically coupled to the plurality of signal traces in the patterned sigType: ApplicationFiled: July 7, 2006Publication date: January 10, 2008Applicant: Applied Materials, INC.Inventors: Martin Jeff Salinas, David H. Quach
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Patent number: 7297906Abstract: An integrated thermal unit comprises a bake station comprising a bake plate configured to hold and heat a substrate; a chill station comprising a chill plate configured to hold and cool a substrate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the chill plate along a horizontally linear path within the thermal unit and raise and lower substrates along a vertical path within the integrated thermal unit.Type: GrantFiled: July 5, 2005Date of Patent: November 20, 2007Assignee: Sokudo Co., Ltd.Inventors: David H. Quach, Martin Jeff Salinas
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Patent number: 7288746Abstract: An integrated thermal unit comprising a bake plate having a substrate holding surface configured to hold and heat a substrate in a baking position and a chill plate having a substrate holding surface configured to hold and cool a substrate in a cooling position where the substrate holding surface of the bake plate is positioned in a first substantially horizontal plane when the bake plate is in the baking position and the substrate holding surface of the chill plate is positioned in a second substantially horizontal plane that is below the first plane when the chill plate is in a cooling position.Type: GrantFiled: July 5, 2005Date of Patent: October 30, 2007Assignee: Sokudo Co., Ltd.Inventors: David H. Quach, Tetsuya Ishikawa
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Patent number: 7282675Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.Type: GrantFiled: July 5, 2005Date of Patent: October 16, 2007Assignee: Sokudo Co., Ltd.Inventors: David H. Quach, Martin Jeff Salinas
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Patent number: 7274005Abstract: A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably coupled to a lower surface of the bake plate when the bake plate is in the lower cooling position.Type: GrantFiled: July 5, 2005Date of Patent: September 25, 2007Assignee: Sokudo Co., Ltd.Inventors: David H. Quach, Tetsuya Ishikawa
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Patent number: 7049612Abstract: One embodiment of the present invention is an electron beam treatment apparatus that includes: (a) an array of lamps that output radiation; (b) a support mechanism adapted to support a substrate at a treatment position above the lamps; and (c) a lamp heat shield, disposed above the array, having a radiation absorption portion adapted to absorb radiation from at least a portion of the array, and a radiation reflection portion adapted to reflect radiation from at least a portion of the array towards the substrate when disposed at the treatment position.Type: GrantFiled: March 2, 2004Date of Patent: May 23, 2006Assignee: Applied MaterialsInventors: David H. Quach, Jun Zhao
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Publication number: 20040020601Abstract: A series of modular apparatuses for processing substrates using a unique combinations of a substrate coating subsystem, a substrate curing subsystem and a PECVD-based capping subsystem. The individual subsystems are capable of being combined with one another for creating unique integrated substrate processing apparatuses that enable combined processing by the coating, curing and capping subsystems in an integrated and controlled environment, thus enabling the processing of substrates in an efficient manner, while minimizing the exposure of the substrates to an external environment and minimizing the condensation of vapors while the substrate is processed by the cure and capping subsystems.Type: ApplicationFiled: July 29, 2003Publication date: February 5, 2004Applicant: Applied Materials, Inc.Inventors: Jun Zhao, Farhad Moghadam, Tim Weidman, Rick J. Roberts, Hari Ponnekanti, Chau T. Nguyen, Satish Sundar, David H. Quach, Sasson Somekh