Patents by Inventor David H. Quach
David H. Quach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230220097Abstract: Treatment and prevention of cancer using virus-specific immune cells, comprising a chimeric antigen receptor (CAR) or nucleic acid encoding a CAR, wherein the CAR comprises: (i) an antigen-binding domain which binds specifically to CD30, (ii) a transmembrane domain, and (iii) a signalling domain, wherein the signalling domain comprises: (a) an amino acid sequence derived from the intracellular domain of CD28, and (b) an amino acid sequence comprising an immunoreceptor tyrosine-based activation motif (ITAM), is disclosed.Type: ApplicationFiled: April 27, 2021Publication date: July 13, 2023Inventors: David H. Quach, Cliona M. Rooney, Carlos A. Ramos
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Publication number: 20230172986Abstract: Treatment and prevention of diseases/conditions characterised by an alloreactive immune response using virus-specific immune cells, comprising a chimeric antigen receptor (CAR) or nucleic acid encoding a CAR, wherein the CAR comprises: (i) an antigen-binding domain which binds specifically to CD30, (ii) a transmembrane domain, and (iii) a signalling domain, wherein the signalling domain comprises: (a) an amino acid sequence derived from the intracellular domain of CD28, and (b) an amino acid sequence comprising an immunoreceptor tyrosine-based activation motif (ITAM), is disclosed.Type: ApplicationFiled: April 27, 2021Publication date: June 8, 2023Inventors: David H. Quach, Cliona M. Rooney, Carlos A. Ramos
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Publication number: 20230167187Abstract: Virus-specific immune cells, comprising a chimeric antigen receptor (CAR) or nucleic acid encoding a CAR, wherein the CAR comprises: (i) an antigen-binding domain which binds specifically to CD30, (ii) a transmembrane domain, and (iii) a signalling domain, wherein the signalling domain comprises: (a) an amino acid sequence derived from the intracellular domain of CD28, and (b) an amino acid sequence comprising an immunoreceptor tyrosine-based activation motif (ITAM), are disclosed. Also disclosed are methods for producing and compositions comprising such cells.Type: ApplicationFiled: April 27, 2021Publication date: June 1, 2023Inventors: David H. Quach, Cliona M. Rooney, Carlos A. Ramos
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Patent number: 11434568Abstract: An apparatus for distributing a gas within a process chamber is disclosed. The apparatus has a body formed from a distribution portion surrounded by a coupling portion. A heater is disposed within the distribution portion to heat the body to an elevated temperature. A bridge extends between the coupling portion and the distribution portion. The bridge limits heat transfer between the distribution portion and the coupling portion.Type: GrantFiled: March 19, 2019Date of Patent: September 6, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Juan Carlos Rocha-Alvarez, David H. Quach
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Publication number: 20220181120Abstract: In some embodiments, the semiconductor process apparatus comprises a conductive support comprising mesh, a conductive shaft comprising a conductive rod, and a plurality of connection elements. The plurality of connection elements are coupled to the mesh in parallel and are connected to the rod at a single junction. The plurality of connection elements help spread RF current, reducing localized heating in the substrate, resulting in a more uniform film deposition. Additionally, using connection elements that are merged and coupled to a single RF rod allow for the rod to be made of materials that can conduct RF current at lower temperatures.Type: ApplicationFiled: February 22, 2022Publication date: June 9, 2022Inventors: Jun MA, Jian LI, David H. QUACH, Amit Kumar BANSAL, Juan Carlos ROCHA-ALVAREZ
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Publication number: 20210363635Abstract: An apparatus for distributing a gas within a process chamber is disclosed. The apparatus has a body formed from a distribution portion surrounded by a coupling portion. A heater is disposed within the distribution portion to heat the body to an elevated temperature. A bridge extends between the coupling portion and the distribution portion. The bridge limits heat transfer between the distribution portion and the coupling portion.Type: ApplicationFiled: March 19, 2019Publication date: November 25, 2021Inventors: Juan Carlos ROCHA-ALVAREZ, David H. QUACH
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Publication number: 20200013586Abstract: In some embodiments, the semiconductor process apparatus comprises a conductive support comprising mesh, a conductive shaft comprising a conductive rod, and a plurality of connection elements. The plurality of connection elements are coupled to the mesh in parallel and are connected to the rod at a single junction. The plurality of connection elements help spread RF current, reducing localized heating in the substrate, resulting in a more uniform film deposition. Additionally, using connection elements that are merged and coupled to a single RF rod allow for the rod to be made of materials that can conduct RF current at lower temperatures.Type: ApplicationFiled: June 20, 2019Publication date: January 9, 2020Inventors: Jun MA, Jian LI, David H. QUACH, Amit Kumar BANSAL, Juan Carlos ROCHA
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Patent number: 10177050Abstract: A dynamically tunable process kit, a processing chamber having a dynamically tunable process kit, and a method for processing a substrate using a dynamically tunable process kit are provided. The dynamically tunable process kit allows one or both of the electrical and thermal state of the process kit to be changed without changing the physical construction of the process kit, thereby allowing plasma properties, and hence processing results, to be easily changed without replacing the process kit. The processing chamber having a dynamically tunable process kit includes a chamber body that includes a portion of a conductive side wall configured to be electrically controlled, and a process kit. The processing chamber includes a first control system operable to control one or both of an electrical and thermal state of the process kit and a second control system operable to control an electrical state of the portion of the side wall.Type: GrantFiled: July 18, 2016Date of Patent: January 8, 2019Assignee: Applied Materials, Inc.Inventors: S. M. Reza Sadjadi, Dmitry Lubomirsky, Hamid Noorbakhsh, John Zheng Ye, David H. Quach, Sean S. Kang
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Publication number: 20160329256Abstract: A dynamically tunable process kit, a processing chamber having a dynamically tunable process kit, and a method for processing a substrate using a dynamically tunable process kit are provided. The dynamically tunable process kit allows one or both of the electrical and thermal state of the process kit to be changed without changing the phyisical construction of the process kit, thereby allowing plasma properties, and hence processing results, to be easily changed without replacing the process kit. The processing chamber having a dynamically tunable process kit includes a chamber body that includes a portion of a conductive side wall configured to be electrically controlled, and a process kit. The processing chamber includes a first control system operable to control one or both of an electrical and thermal state of the process kit and a second control system operable to control an electrical state of the portion of the side wall.Type: ApplicationFiled: July 18, 2016Publication date: November 10, 2016Inventors: S. M. Reza SADJADI, Dmitry LUBOMIRSKY, Hamid NOORBAKHSH, John Zheng YE, David H. QUACH, Sean S. KANG
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Patent number: 9412579Abstract: A dynamically tunable process kit, a processing chamber having a dynamically tunable process kit, and a method for processing a substrate using a dynamically tunable process kit are provided. The dynamically tunable process kit allows one or both of the electrical and thermal state of the process kit to be changed without changing the physical construction of the process kit, thereby allowing plasma properties, and hence processing results, to be easily changed without replacing the process kit. The processing chamber having a dynamically tunable process kit includes a chamber body that includes a portion of a conductive side wall configured to be electrically controlled, and a process kit. The processing chamber includes a first control system operable to control one or both of an electrical and thermal state of the process kit and a second control system operable to control an electrical state of the portion of the side wall.Type: GrantFiled: February 13, 2013Date of Patent: August 9, 2016Assignee: Applied Materials, Inc.Inventors: S. M. Reza Sadjadi, Dmitry Lubomirsky, Hamid Noorbakhsh, John Zheng Ye, David H. Quach, Sean S. Kang
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Patent number: 8910644Abstract: Embodiments of the invention generally relate to apparatus and methods for cleaning chamber components using a cleaning plate. The cleaning plate is adapted to be positioned on a substrate support during a cleaning process, and includes a plurality of turbulence-inducing structures. The turbulence-inducing structures induce a turbulent flow of cleaning gas while the cleaning plate is rotated during a cleaning process. The cleaning plate increases the retention time of the cleaning gas near the showerhead during cleaning. Additionally, the cleaning plate reduces concentration gradients within the cleaning plate to provide a more effective clean. The method includes positioning a cleaning plate adjacent to a showerhead, and introducing cleaning gas to the space between the showerhead and the cleaning plate. A material deposited on the surface of the showerhead is then heated and vaporized in the presence of the cleaning gas, and then exhausted from the processing chamber.Type: GrantFiled: March 4, 2011Date of Patent: December 16, 2014Assignee: Applied Materials, Inc.Inventors: Hua Chung, Xizi Dong, Kyawwin Jason Maung, Hiroji Hanawa, Sang Won Kang, David H. Quach, Donald J. K. Olgado, David Bour, Wei-Yung Hsu, Alexander Tam, Anzhong Chang, Sumedh Acharya
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Publication number: 20130288483Abstract: A dynamically tunable process kit, a processing chamber having a dynamically tunable process kit, and a method for processing a substrate using a dynamically tunable process kit are provided. The dynamically tunable process kit allows one or both of the electrical and thermal state of the process kit to be changed without changing the phyisical construction of the process kit, thereby allowing plasma properties, and hence processing results, to be easily changed without replacing the process kit. The processing chamber having a dynamically tunable process kit includes a chamber body that includes a portion of a conductive side wall configured to be electrically controlled, and a process kit. The processing chamber includes a first control system operable to control one or both of an electrical and thermal state of the process kit and a second control system operable to control an electrical state of the portion of the side wall.Type: ApplicationFiled: February 13, 2013Publication date: October 31, 2013Inventors: S.M. Reza Sadjadi, Dmitry Lubomirsky, Hamid Noorbakhsh, John Zheng Ye, David H. Quach, Sean S. Kang
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Patent number: 8568529Abstract: Embodiments disclosed herein generally relate to an HVPE chamber. The chamber may have two separate precursor sources coupled thereto to permit two separate layers to be deposited. For example, a gallium source and a separate aluminum source may be coupled to the processing chamber to permit gallium nitride and aluminum nitride to be separately deposited onto a substrate in the same processing chamber. The nitrogen may be introduced to the processing chamber at a separate location from the gallium and the aluminum and at a lower temperature. The different temperatures causes the gases to mix together, react and deposit on the substrate with little or no deposition on the chamber walls.Type: GrantFiled: December 14, 2009Date of Patent: October 29, 2013Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, David H. Quach, Anzhong Chang, Olga Kryliouk, Yuriy Melnik, Harsukhdeep S. Ratia, Son T. Nguyen, Lily Pang
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Patent number: 8550031Abstract: Embodiments of the invention generally include a robot assembly comprising a robot operable to position a substrate at one or more points within a plane, and a motion assembly having a motor operable to position the robot in a direction generally parallel to a first direction. The motion assembly comprises a robot support interface having the robot coupled thereto, and one or more walls that form an interior region in which the motor is enclosed. The walls define an elongated opening through which the robot support interface travels, and the motor is operable to move the robot support interface laterally in the elongated opening. The motion assembly further comprises one or more fan assemblies that are in fluid communication with the interior region. The fan assemblies are operable to create a subatmospheric pressure in the interior region thereby causing gas to flow through the elongated opening into the interior region.Type: GrantFiled: June 15, 2012Date of Patent: October 8, 2013Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Patent number: 8491720Abstract: Embodiments disclosed herein generally relate to an HVPE chamber. The chamber may have two separate precursor sources coupled thereto to permit two separate layers to be deposited. For example, a gallium source and a separate aluminum source may be coupled to the processing chamber to permit gallium nitride and aluminum nitride to be separately deposited onto a substrate in the same processing chamber. The nitrogen may be introduced to the processing chamber at a separate location from the gallium and the aluminum and at a lower temperature. The different temperatures causes the gases to mix together, react and deposit on the substrate with little or no deposition on the chamber walls.Type: GrantFiled: December 14, 2009Date of Patent: July 23, 2013Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, David H. Quach, Anzhong Chang, Olga Kryliouk, Yuriy Melnik, Harsukhdeep S. Ratia, Son T. Nguyen, Lily Pang
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Publication number: 20120320361Abstract: Embodiments of the invention generally include a robot assembly comprising a robot operable to position a substrate at one or more points within a plane, and a motion assembly having a motor operable to position the robot in a direction generally parallel to a first direction. The motion assembly comprises a robot support interface having the robot coupled thereto, and one or more walls that form an interior region in which the motor is enclosed. The walls define an elongated opening through which the robot support interface travels, and the motor is operable to move the robot support interface laterally in the elongated opening. The motion assembly further comprises one or more fan assemblies that are in fluid communication with the interior region. The fan assemblies are operable to create a subatmospheric pressure in the interior region thereby causing gas to flow through the elongated opening into the interior region.Type: ApplicationFiled: June 15, 2012Publication date: December 20, 2012Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchem, Brian Lue
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Publication number: 20120234229Abstract: Substrate support assemblies and deposition chambers employing such support assemblies to improve temperature uniformity during film depositions, such as epitaxial growths of group-V material stacks for LEDs. In one embodiment, the support assembly includes a first component having a first thermal resistance and a top surface upon which the substrate is to be disposed at a first location. The support assembly further includes a second component to be disposed over the first component and cover a second location of the susceptor while the substrate is disposed over the first location and having a second thermal resistance to insulate regions of the susceptor adjacent to the substrate by an amount approximating that of the substrate during a deposition process. In embodiments, the second component is removable from the first component and supports the substrate in absence of the first component during transfer of the substrate between multiple deposition systems.Type: ApplicationFiled: March 13, 2012Publication date: September 20, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Tuan Anh NGUYEN, Donald J.K. Olgado, David H. Quach
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Publication number: 20120180983Abstract: The present invention generally provides a cluster tool for processing a substrate. In one embodiment, the cluster tool comprises at least one processing rack, which comprises a first plurality of substrate processing chambers that are positioned adjacent to each other and aligned in a first direction, a second plurality of substrate processing chambers that are positioned adjacent to each other and adjacent to at least one of the first plurality of substrate processing chambers, the second plurality of substrate processing chambers being positioned in a second direction relative to the first direction, a first shuttle robot movable in the first direction for moving substrates between each of the first plurality of substrate processing chambers, and a second shuttle robot movable in the second direction for moving substrates between each of the second plurality of substrate processing chambers.Type: ApplicationFiled: March 2, 2012Publication date: July 19, 2012Inventors: TETSUYA ISHIKAWA, RICK J. ROBERTS, HELEN R. ARMER, LEON VOLFOVSKI, JAY D. PINSON, MICHAEL RICE, DAVID H. QUACH, MOHSEN S. SALEK, ROBERT LOWRANCE, JOHN A. BACKER, WILLIAM TYLER WEAVER, CHARLES CARLSON, CHONGYANG WANG, JEFFREY HUDGENS, HARALD HERCHEN, BRIAN LUE
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Patent number: D664170Type: GrantFiled: March 4, 2011Date of Patent: July 24, 2012Assignee: Applied Materials, Inc.Inventors: Hua Chung, Xizi Dong, Kyawwin Jason Maung, Hiroji Hanawa, Sang Won Kang, David H. Quach, Donald J. K. Olgado, David Bour, Wei-Yung Hsu, Alexander Tam, Anzhong Chang, Sumedh Acharya
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Patent number: D664172Type: GrantFiled: November 16, 2009Date of Patent: July 24, 2012Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, David H. Quach, Anzhong Chang, Olga Kryliouk, Yuriy Melnik, Harsukhdeep S. Ratia, Son T. Nguyen, Lily Pang