Patents by Inventor David Harriman

David Harriman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11657015
    Abstract: A device is provided with two or more uplink ports to connect the device via two or more links to one or more sockets, where each of the sockets includes one or more processing cores, and each of the two or more links is compliant with a particular interconnect protocol. The device further includes I/O logic to identify data to be sent to the one or more processing cores for processing, determine an affinity attribute associated with the data, and determine which of the two or more links to use to send the data to the one or more processing cores based on the affinity attribute.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: May 23, 2023
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Anil Vasudevan, David Harriman
  • Publication number: 20220261178
    Abstract: Examples described herein relate to a packet processing device that includes circuitry to receive an address translation for a virtual to physical address prior to receipt of a GPUDirect remote direct memory access (RDMA) operation, wherein the address translation is provided at initiation of a process executed by a host system and circuitry to apply the address translation for a received GPUDirect RDMA operation.
    Type: Application
    Filed: March 7, 2022
    Publication date: August 18, 2022
    Inventors: Shaopeng HE, Yadong LI, Anjali Singhai JAIN, Kun TIAN, Yan ZHAO, Yaozu DONG, Baolu LU, Rajesh M. SANKARAN, Eliel LOUZOUN, Rupin H. VAKHARWALA, David HARRIMAN, Saurabh GAYEN, Philip LANTZ, Israel BEN SHAHAR, Kenneth G. KEELS
  • Publication number: 20220179961
    Abstract: Various embodiments provide apparatuses, systems, and methods for establishing, by a data object exchange (DOE entity) of a peripheral component interconnect express (PCIe) device, a first session for communication between a first host entity of a host device and a first PCIe entity of the PCIe device, and a second session for communication between a second host entity of the host device and a second PCIe entity of the PCIe device. The first session may have a first security policy and be a session of a first connection between the PCIe device and the host device. The second session may have a second security policy and be a session of a second connection between the PCIe device and the host device. Other embodiments may be described and claimed.
    Type: Application
    Filed: January 14, 2022
    Publication date: June 9, 2022
    Inventors: Jiewen YAO, David HARRIMAN, Xiaoyu RUAN, Mahesh NATU
  • Publication number: 20210165756
    Abstract: A device is provided with two or more uplink ports to connect the device via two or more links to one or more sockets, where each of the sockets includes one or more processing cores, and each of the two or more links is compliant with a particular interconnect protocol. The device further includes I/O logic to identify data to be sent to the one or more processing cores for processing, determine an affinity attribute associated with the data, and determine which of the two or more links to use to send the data to the one or more processing cores based on the affinity attribute.
    Type: Application
    Filed: January 20, 2021
    Publication date: June 3, 2021
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Anil Vasudevan, David Harriman
  • Patent number: 10884971
    Abstract: A general input/output communication port implements a communication stack that includes a physical layer, a data link layer and a transaction layer. The transaction layer includes assembling a packet header for a message request transaction to one or more logical devices. The packet header includes a format field to indicate the length of the packet header and to further specify whether the packet header includes a data payload, a subset of a type field to indicate the packet header relates to the message request transaction and a message field. The message field includes a message to implement the message request transaction. The message includes at least one message that is selected from a group of messages.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: January 5, 2021
    Assignee: Intel Corporation
    Inventors: David Harriman, Jasmin Ajanovic
  • Publication number: 20200183876
    Abstract: A device is provided with two or more uplink ports to connect the device via two or more links to one or more sockets, where each of the sockets includes one or more processing cores, and each of the two or more links is compliant with a particular interconnect protocol. The device further includes I/O logic to identify data to be sent to the one or more processing cores for processing, determine an affinity attribute associated with the data, and determine which of the two or more links to use to send the data to the one or more processing cores based on the affinity attribute.
    Type: Application
    Filed: December 6, 2019
    Publication date: June 11, 2020
    Applicant: Intel Corporation
    Inventors: Debendra Das Sharma, Anil Vasudevan, David Harriman
  • Patent number: 10581545
    Abstract: An apparatus is provided, where the apparatus may include a first terminal and a second terminal to be coupled to a host via a first wire and a second wire, respectively; a rechargeable storage; and a data circuitry. The apparatus may, during a first time-period, receive power via the first wire and the second wire from the host, and store the power in the rechargeable storage, and during a second time-period, transmit data from the data circuitry to the host via the first wire and the second wire. The first and second time-periods may be non-overlapping time periods. The apparatus is to refrain from transmitting any data to, or receiving any data from, the host during the first time period.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: March 3, 2020
    Assignee: Intel Corporation
    Inventors: Huimin Chen, David Harriman, Yong Yang
  • Patent number: 10503684
    Abstract: A device is provided with two or more uplink ports to connect the device via two or more links to one or more sockets, where each of the sockets includes one or more processing cores, and each of the two or more links is compliant with a particular interconnect protocol. The device further includes I/O logic to identify data to be sent to the one or more processing cores for processing, determine an affinity attribute associated with the data, and determine which of the two or more links to use to send the data to the one or more processing cores based on the affinity attribute.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: December 10, 2019
    Assignee: Intel Corporation
    Inventors: Debendra Das Sharma, Anil Vasudevan, David Harriman
  • Patent number: 10360171
    Abstract: A general input/output communication port implements a communication stack that includes a physical layer, a data link layer and a transaction layer. The transaction layer includes assembling a packet header for a message request transaction to one or more logical devices. The packet header includes a format field to indicate the length of the packet header and to further specify whether the packet header includes a data payload, a subset of a type field to indicate the packet header relates to the message request transaction and a message field. The message field includes a message to implement the message request transaction. The message includes at least one message that is selected from a group of messages.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: July 23, 2019
    Assignee: Intel Corporation
    Inventors: David Harriman, Jasmin Ajanovic
  • Publication number: 20190044638
    Abstract: An apparatus is provided, where the apparatus may include a first terminal and a second terminal to be coupled to a host via a first wire and a second wire, respectively; a rechargeable storage; and a data circuitry. The apparatus may, during a first time-period, receive power via the first wire and the second wire from the host, and store the power in the rechargeable storage, and during a second time-period, transmit data from the data circuitry to the host via the first wire and the second wire. The first and second time-periods may be non-overlapping time periods. The apparatus is to refrain from transmitting any data to, or receiving any data from, the host during the first time period.
    Type: Application
    Filed: May 15, 2018
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: Huimin Chen, David Harriman, Yong Yang
  • Publication number: 20180004703
    Abstract: A device is provided with two or more uplink ports to connect the device via two or more links to one or more sockets, where each of the sockets includes one or more processing cores, and each of the two or more links is compliant with a particular interconnect protocol. The device further includes I/O logic to identify data to be sent to the one or more processing cores for processing, determine an affinity attribute associated with the data, and determine which of the two or more links to use to send the data to the one or more processing cores based on the affinity attribute.
    Type: Application
    Filed: July 1, 2016
    Publication date: January 4, 2018
    Inventors: Debendra Das Sharma, Anil Vasudevan, David Harriman
  • Patent number: 9860173
    Abstract: A storage device is provided to maintain a count of flow control credits to be granted to a device in association with transactions over a channel to be implemented on a data link and control logic is provided to communicate, to the device, an indication of an amount of flow control credits for the device in association with a reset of the data link.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: January 2, 2018
    Assignee: Intel Corporation
    Inventors: Jasmin Ajanovic, David Harriman, Blaise Fanning, David M. Lee
  • Patent number: 9836424
    Abstract: An enhanced general input/output communication architecture, protocol and related methods are presented.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: December 5, 2017
    Assignee: Intel Corporation
    Inventors: Jasmin Ajanovic, David Harriman, Blaise Fanning, David Lee
  • Publication number: 20170235701
    Abstract: Techniques for embedded high speed serial interface methods are described herein. The techniques include an apparatus for sideband signaling including a first serial sideband link module and a second serial sideband link module. The first serial sideband link module is to propagate packets from an upstream port to a downstream port via a first signaling lane, and the second serial sideband link module is to propagate packets from the downstream port to the upstream port via a second signaling lane.
    Type: Application
    Filed: December 24, 2014
    Publication date: August 17, 2017
    Applicant: INTEL CORPORATION
    Inventors: Akshay Pethe, Mahesh Wagh, David Harriman, Su Wei Lim, Debendra Das Sharma, Daniel Froelich, Venkatraman Iyer, James Jaussi, Zuoguo Wu
  • Patent number: 9736071
    Abstract: An enhanced general input/output communication architecture, protocol and related methods are presented.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: August 15, 2017
    Assignee: Intel Corporation
    Inventors: Jasmin Ajanovic, David Harriman, Blaise Fanning, David Lee
  • Patent number: 9602408
    Abstract: An enhanced general input/output communication architecture, protocol and related methods are presented.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: March 21, 2017
    Assignee: Intel Corporation
    Inventors: Jasmin Ajanovic, David Harriman, Blaise Fanning, David Lee
  • Patent number: 9565106
    Abstract: A storage device is provided to maintain a value of flow control credits allocated for a device on a channel and flow control logic is provided to receive a flow control signal over a link of an interconnect, the flow control signal indicating flow control credits allocated for the device on the channel. The flow control logic is further to update the value of flow control credits based on activity of the device on the channel.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: February 7, 2017
    Assignee: Intel Corporation
    Inventors: Jasmin Ajanovic, David Harriman, Blaise Fanning, David M. Lee
  • Publication number: 20160274923
    Abstract: An apparatus, method, and system is described herein for fast device configuration. Fast configuration devices may be configured without host intervention. For example, before going into a low power mode, the device may dump its configuration context to storage and go to sleep. Then, upon resuming into an active state, a controller can reload the context without a host processing device having to re-write the entire configuration space, which potentially reduces the latency decision of when a device goes into a low power mode. Moreover, fast configuration mechanism may accelerate configuration accesses from the host by providing accelerated completions, while still ensuring legacy configuration for legacy devices.
    Type: Application
    Filed: January 16, 2014
    Publication date: September 22, 2016
    Applicant: INTEL CORPORATION
    Inventor: David HARRIMAN
  • Patent number: 9432456
    Abstract: A method and apparatus for synchronizing time between a master device and a target device arranged across a network, wherein the target device communicates to the master device through a PCIe interconnect includes transmitting a first message at a first time from the master device to the target device, the first message including a message indicator; and receiving a reply message at a subsequent time from the target device to the master device, the reply message including the message indicator.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: August 30, 2016
    Assignee: INTEL CORPORATION
    Inventors: Kevin Stanton, David Harriman
  • Publication number: 20160070671
    Abstract: A general input/output communication port implements a communication stack that includes a physical layer, a data link layer and a transaction layer. The transaction layer includes assembling a packet header for a message request transaction to one or more logical devices. The packet header includes a format field to indicate the length of the packet header and to further specify whether the packet header includes a data payload, a subset of a type field to indicate the packet header relates to the message request transaction and a message field. The message field includes a message to implement the message request transaction. The message includes at least one message that is selected from a group of messages.
    Type: Application
    Filed: July 14, 2015
    Publication date: March 10, 2016
    Inventors: David Harriman, Jasmin Ajanovic