Abstract: An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.

Abstract: An electrical connector assembly which utilizes a double layered elastomeric for a pressure exertion member wherein the two, individual layers are of different hardness. The first layer is of a relatively low durometer elastomeric material while the second layer is of higher durometer elastomeric material and includes several projections, e.g., for engaging a circuitized substrate such as a flexible circuit. Both layers preferably have the same spring rate, while the projections of the second layer may possess a variety of different configurations, e.g., cylindrical or boxlike. The individual projections may each include extension portions which in turn are positioned within corresponding openings within the substantially solid first layer.