Patents by Inventor David J. Elliott
David J. Elliott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929466Abstract: Provided herein are energy storage devices. In some cases, the energy storage devices are capable of being transported on a vehicle and storing a large amount of energy. An energy storage device is provided comprising at least one liquid metal electrode, an energy storage capacity of at least about 1 MWh and a response time less than or equal to about 100 milliseconds (ms).Type: GrantFiled: May 11, 2023Date of Patent: March 12, 2024Assignee: Ambri Inc.Inventors: David J. Bradwell, David A. H. McCleary, Gregory A. Thompson, Allan Blanchard, Jeffrey B. Miller, Ronald Teel, William B. Langhauser, Alexander W. Elliott, Donald R. Sadoway, Michael J. McNeley, Ian Redfern
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Patent number: 11921023Abstract: Holographic Video Microscopy analysis of non-spherical particles is disclosed herein. Properties of the particles are determined by application of light scattering theory to holography data. Effective sphere theory is applied to provide information regarding the reflective index of a sphere that includes a target particle. Known particles may be co-dispersed with unknown particles in a medium and the holographic video microscopy is used to determine properties, such as porosity, of the unknown particles.Type: GrantFiled: December 30, 2022Date of Patent: March 5, 2024Assignees: New York University, Spheryx, Inc.Inventors: David G. Grier, Mary Ann Odete, Fook Chiong Cheong, Annemarie Winters, Jesse J. Elliott, Laura A. Philips
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Patent number: 9802844Abstract: A portable, non-filtering, microorganism deactivation device for treating water contaminated with harmful bacteria such as E. coli and fecal coliform, includes a housing, said housing containing a high porosity media saturated with an ionically charged material such as colloidal silver.Type: GrantFiled: October 29, 2013Date of Patent: October 31, 2017Assignee: SILVER AQUA, INC.Inventors: David J. Elliott, Ronald P. Millman, Jr., Amber P. Truhanovitch, Tyler H. Albee, Erin K. Flaherty
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Patent number: 9421480Abstract: A door for a settling tank is provided, including a suction port for connection to a suction pipe within the settling tank; a discharge port positioned below the suction port, for connection to a discharge pipe within the settling tank, and for receiving a pipe providing discharge from a discharge source; an overflow port positioned adjacent to the suction port; and a frac fill port.Type: GrantFiled: April 10, 2013Date of Patent: August 23, 2016Assignee: Repsol Oil & Gas Canada Inc.Inventors: David J. Elliott, Gentian Toska
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Patent number: 8887760Abstract: A system for delivering frac water at high pressure is provided, including a first pump positionable within a tank, the first pump configured to receive water from within the tank and output the water at pressure to a first pressure tank; a second pump positionable above the first pressure tank, the second pump configured to receive water from the first pressure tank and output the water at pressure to a second pressure tank; and a third pump positionable above the second pressure tank, the third pump configured to receive water from the second pressure tank and output pressurized water to a discharge piping, the discharge piping leading said pressurized water over a wall of said tank.Type: GrantFiled: January 23, 2012Date of Patent: November 18, 2014Assignee: Flo-Dynamics, Inc.Inventor: David J. Elliott
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Publication number: 20140158640Abstract: A portable, non-filtering, microorganism deactivation device for treating water contaminated with harmful bacteria such as E. coli and fecal coliform, includes a housing, said housing containing a high porosity media saturated with an ionically charged material such as colloidal silver.Type: ApplicationFiled: October 29, 2013Publication date: June 12, 2014Applicant: Silver Aqua, Inc.Inventors: David J. Elliott, Ronald P. Millman, JR., Amber P. Truhanovitch, Tyler H. Albee, Erin K. Flaherty
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Patent number: 8658937Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer.Type: GrantFiled: January 7, 2011Date of Patent: February 25, 2014Assignee: UVTech Systems, Inc.Inventors: Kenneth J. Harte, Ronald P. Millman, Jr., Victoria M. Chaplick, David J. Elliott, Eugene O. Degenkolb, Murray L. Tardif
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Patent number: 8415587Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.Type: GrantFiled: February 24, 2011Date of Patent: April 9, 2013Assignee: UVTech Systems, Inc.Inventors: Ronald P. Millman, Jr., Kenneth J. Harte, Victoria M. Chaplick, David J. Elliott
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Patent number: 8410394Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.Type: GrantFiled: February 24, 2011Date of Patent: April 2, 2013Assignee: UVTech Systems, Inc.Inventors: Ronald P. Millman, Jr., Kenneth J. Harte, Victoria M. Chaplick, David J. Elliott, Murray L. Tardif, Eugene O. Degenkolb
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Publication number: 20130061963Abstract: A system for delivering frac water at high pressure is provided, including a first pump positionable within a tank, the first pump configured to receive water from within the tank and output the water at pressure to a first pressure tank; a second pump positionable above the first pressure tank, the second pump configured to receive water from the first pressure tank and output the water at pressure to a second pressure tank; and a third pump positionable above the second pressure tank, the third pump configured to receive water from the second pressure tank and output pressurized water to a discharge piping, the discharge piping leading said pressurized water over a wall of said tank.Type: ApplicationFiled: January 23, 2012Publication date: March 14, 2013Applicant: Flo-Dynamics, Inc.Inventor: David J. Elliott
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Publication number: 20130048276Abstract: A water blending system and associated method for a gas shale well is provided, which includes a first inlet pipeline that receives water from a freshwater source. The first inlet pipeline has a first valve. A second inlet pipeline receives flow back water and has a second control valve. A third pipeline receives water flow from the first and second pipelines. The first pipeline has a salination level detector, the third pipeline flowing water into a tank; wherein the water flow of the first and second inlet pipelines is adjusted based on a salination level detected by the salination level detector.Type: ApplicationFiled: October 18, 2011Publication date: February 28, 2013Applicant: Flo-Dynamics Systems, IncInventor: David J. Elliott
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Publication number: 20120187052Abstract: A bacteria deactivation device that has a porous medium through which water and bacteria contained in the water, like E. coli and fecal coliform, are passed. Silver, such as colloidal silver, within the medium deactivates bacteria that pass therethrough. The medium has a porosity and pores sized to provide high flow rates hour while meeting Environmental Protection Agency limits for human consumption of silver.Type: ApplicationFiled: July 25, 2011Publication date: July 26, 2012Applicant: Solutions Benefiting LifeInventor: DAVID J. ELLIOTT
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Publication number: 20110185971Abstract: The disclosed apparatus and method provides substrate impurity doping wherein a laser rapidly scans a substrate while simultaneously a uniform laminar flow of reactive gas is injected, the interaction of the laser radiation and the dopant results in a uniform diffusion of the dopant species in all planes (X,Y,Z) of the substrate. Laser energy density, wavelength, and pulse geometry are adjustable, in a simple system for volume manufacturing, to provide depth and dose control of the dopant. The system optics can be focused to form a high resolution laser beam to directly write the doping area pattern geometry. Alternatively the laser beam can be optically expanded to form a large diameter beam for large area diffusion of the dopant through a patterned mask.Type: ApplicationFiled: November 30, 2010Publication date: August 4, 2011Applicant: UVTech Systems, Inc.Inventors: David J. Elliott, Kenneth J. Harte, Ronald P. Millman, JR., Victoria M. Chaplick, Eugene O. Degenkolb
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Publication number: 20110168672Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer.Type: ApplicationFiled: January 7, 2011Publication date: July 14, 2011Applicant: UVTech Systems, Inc.Inventors: Kenneth J. Harte, Ronald P. Millman, JR., Victoria M. Chaplick, David J. Elliott, Eugene O. Degenkolb, Murray L. Tardif
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Publication number: 20110147350Abstract: A modular wafer edge processing apparatus is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The modular apparatus can be integrated into wafer tracks, cluster tools, and other volume manufacturing systems. The edge processing apparatus of this invention includes a laser that can either be contained inside the module, or mounted externally to feed multiple modules and thereby reduce system cost. The apparatus contains a beam delivery subsystem to direct a beam of radiation onto the edges of a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site.Type: ApplicationFiled: February 24, 2011Publication date: June 23, 2011Applicant: UVTech Systems Inc.Inventors: Ronald P. Millman, JR., Kenneth J. Harte, Victoria M. Chaplick, David J. Elliott, Eugene O. Degenkolb
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Publication number: 20110139759Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.Type: ApplicationFiled: February 24, 2011Publication date: June 16, 2011Applicant: UVTech Systems Inc.Inventors: Ronald P. Millman, JR., Kenneth J. Harte, Victoria M. Chaplick, David J. Elliott
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Publication number: 20110139757Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.Type: ApplicationFiled: February 24, 2011Publication date: June 16, 2011Inventors: Ronald P. Millman, JR., Kenneth J. Harte, Victoria M. Chaplick, David J. Elliott, Murray L. Tardif, Eugene O. Degenkolb
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Publication number: 20110061679Abstract: A method for removing ion implanted photoresist from a surface of a substrate is provided. The method may include introducing a gas to a reaction chamber containing the substrate; illuminating the ion implanted photoresist with radiation from a laser in the presence of the gas; and scanning the radiation across the surface in the presence of the gas to photoreactively remove the ion implanted photoresist from the surface.Type: ApplicationFiled: June 21, 2010Publication date: March 17, 2011Applicant: UVTech Systems, Inc.Inventors: David J. Elliott, Ronald P. Millman, JR., Victoria M. Chaplick, Murray Tardif, Krista Aiello, Kenneth J. Harte
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Patent number: 7906019Abstract: A bacteria deactivation device that has a porous medium through which water and bacteria contained in the water, like E. coli and fecal coliform, are passed. Colloidal silver within the medium deactivates bacteria that pass therethrough. The medium has a porosity up to 80% and pores sized to provide flow rates up to 8 liters per hour while meeting Environmental Protection Agency limits for human consumption of silver.Type: GrantFiled: December 5, 2005Date of Patent: March 15, 2011Inventors: David J. Elliott, Hem K. Pokharel
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Patent number: D731024Type: GrantFiled: December 4, 2013Date of Patent: June 2, 2015Assignee: Silver Aqua, Inc.Inventors: David J. Elliott, Ronald P. Millman, Jr., Amber P. Truhanovitch