Abstract: The presently disclosed subject matter provides for methods and compositions for treating cancer (e.g., pancreatic cancer). It relates to antigen recognizing receptor (e.g., chimeric antigen receptors (CARs)) that specifically target Sialyl Lewis A (e.g., human Sialyl Lewis A), and immunoresponsive cells comprising such CARs. The presently disclosed Sialyl Lewis A-specific CARs have enhanced immune-activating properties, including anti-tumor activity.

Abstract: A portable external device for a mechanical circulation support system includes first and second power sources, e.g. batteries and control electronics for redundant uninterrupted operation of an implantable blood pump. The control and power source module may be configured for variable form factors to accommodate a variety of wearable configurations for patient convenience and comfort.

Abstract: One or more multi-electrode lead coupled to a cardiac sensor/stimulator. Each lead includes a lead body extending from one lead proximal end portion to one lead distal end portion. Each lead further includes at least three tissue sensing/stimulation electrodes disposed along the lead body and at least three terminal connections disposed along the lead proximal end. The tissue sensing/stimulation electrodes are each adapted to sense or stimulate a subject's heart. The cardiac sensor/stimulator includes a signal processing circuit adapted to sense the heart in a first instance and stimulate the heart in a second instance by way of one or more tissue electrode configurations. The configurations are selectable from any combination of the tissue sensing/stimulation electrodes of each implanted lead and an indifferent return electrode. In one example, the signal processing circuit automatically selects the tissue electrode configurations.

Abstract: A portable external device for a mechanical circulation support system includes first and second power sources, e.g. batteries and control electronics for redundant uninterrupted operation of an implantable blood pump. The control and power source module may be configured for variable form factors to accommodate a variety of wearable configurations for patient convenience and comfort.

Abstract: An advertising sign configured for use in combination with a free standing security system having first and second sides and which is adapted to be arranged in proximity to an ingress/egress opening to a store. The advertising sign has axially aligned open ends and is sized and shaped to slidably fit over a lengthwise portion of the free standing security system. The advertising sign has first and second opposed side edges along with top and bottom edges. The advertising sign further includes first and second surfaces between the edges with an advertisement disposed upon each of the first and second surfaces.

Abstract: A header for an implantable pulse generator includes a header body having a bore formed therein, at least one header contact located within the bore to contact a corresponding contact of a lead terminal inserted in the bore, and a rigid component located within the bore.

Abstract: An advertising sign configured for use in combination with a free standing security system having first and second sides and which is adapted to be arranged in proximity to an ingress/egress opening to a store. The advertising sign has axially aligned open ends and is sized and shaped to slidably fit over a lengthwise portion of the free standing security system. The advertising sign has first and second opposed side edges along with top and bottom edges. The advertising sign further includes first and second surfaces between the edges with an advertisement disposed upon each of the first and second surfaces.

Abstract: An advertising sign configured for use in combination with an upstanding security system having a detection apparatus. The advertising sign comprises a substrate with a generally rectangularly shaped outer edge configuration having first and second generally parallel and planar surfaces, with a multicolor advertising copy printed across substantially the entirety of at least one of the planar surfaces with solvent inks thereby yielding protection to the substrate against exposure to atmospheric elements and thereby prolonging the life of the sign during use. The substrate also defines an opening spaced a predetermined distance from at least two edges of the printed substrate to facilitate alignment of the opening relative to the detection apparatus of the security system whereby allowing passage of a signal from the detection apparatus of the security system to pass through the substrate.

Abstract: A device-to-lead terminal connector for an implantable medical device is designed to positively lock the proximal lead terminal within a lead bore formed in the connector of the implantable device. Rather than using a conventional setscrew locking arrangement, first and second latching members are insertable through side ports in the device connector that intersect with the lead bore and that contain an elastomeric sleeve. When the latching members are squeezed together, they cooperate to expand the elastomeric sleeve against the proximal lead terminal to press it into intimate electrical and mechanical engagement with a contact in the lead bore of the device connector. The need for a tool to effect locking of the lead terminal in place is dispensed with.

Abstract: A connector port or “header” for an implantable medical device comprises a molded plastic connector module having a longitudinal bore formed therethrough and a plurality of slots formed inwardly of one side surface thereof and intersecting the longitudinal bore. The slots receive electrical contact members therein and individual seal members are inserted through the longitudinal bore between each of the contact members such that when the in-line terminal pin of a medical lead is inserted into the longitudinal bore, contacts on the lead terminal are aligned with and mate to the electrical contacts in the connector block. The seal members prevent body fluids from compromising the resulting electrical connection.

Abstract: A connector port or “header” for an implantable medical device comprises a molded plastic connector module having a longitudinal bore formed therethrough and a plurality of slots formed inwardly of one side surface thereof and intersecting the longitudinal bore. The slots receive electrical contact members therein and individual seal members are inserted through the longitudinal bore between each of the contact members such that when the in-line terminal pin of a medical lead is inserted into the longitudinal bore, contacts on the lead terminal are aligned with and mate to the electrical contacts in the connector block. The seal members prevent body fluids from compromising the resulting electrical connection.

Abstract: A semiconductor processing method of forming integrated circuitry on a semiconductor wafer includes, a) forming at least two discrete wafer alignment patterns on the wafer, the two discrete alignment patterns having respective series of elevation steps provided therein; and b) while fabricating integrated circuitry elsewhere on the wafer, processing a first portion of at least one of the alignment patterns differently from a second portion of the one alignment pattern to render the first portion to be different from the second portion in the one alignment pattern. Such preferably superimposes a secondary step, most preferably of the same degree, over only a portion of the elevation steps in at least one of the wafer alignment patterns.

Abstract: A semiconductor processing method of forming integrated circuitry on a semiconductor wafer includes, a) forming at least two discrete wafer alignment patterns on the wafer, the two discrete alignment patterns having respective series of elevation steps provided therein; and b) while fabricating integrated circuitry elsewhere on the wafer, processing a first portion of at least one of the alignment patterns differently from a second portion of the one alignment pattern to render the first portion to be different from the second portion in the one alignment pattern. Such preferably superimposes a secondary step, most preferably of the same degree, over only a portion of the elevation steps in at least one of the wafer alignment patterns.

Abstract: A semiconductor processing method of forming integrated circuitry on a semiconductor wafer includes, a) forming at least two discrete wafer alignment patterns on the wafer, the two discrete alignment patterns having respective series of elevation steps provided therein; and b) while fabricating integrated circuitry elsewhere on the wafer, processing a first portion of at least one of the alignment patterns differently from a second portion of the one alignment pattern to render the first portion to be different from the second portion in the one alignment pattern. Such preferably superimposes a secondary step, most preferably of the same degree, over only a portion of the elevation steps in at least one of the wafer alignment patterns.

Abstract: A semiconductor processing method of forming integrated circuitry on a semiconductor wafer includes, a) forming at least two discrete wafer alignment patterns on the wafer, the two discrete alignment patterns having respective-series of elevation steps provided therein; and b) while fabricating integrated circuitry elsewhere on the wafer, processing a first portion of at least one of the alignment patterns differently from a second portion of the one alignment pattern to render the first portion to be different from the second portion in the one alignment pattern. Such preferably superimposes a secondary step, most preferably of the same degree, over only a portion of the elevation steps in at least one of the wafer alignment patterns.

Abstract: A semiconductor processing method of forming integrated circuitry on a semiconductor wafer includes, a) forming at least two discrete wafer alignment patterns on the wafer, the two discrete alignment patterns having respective series of elevation steps provided therein; and b) while fabricating integrated circuitry elsewhere on the wafer, processing a first portion of at least one of the alignment patterns differently from a second portion of the one alignment pattern to render the first portion to be different from the second portion in the one alignment pattern. Such preferably superimposes a secondary step, most preferably of the same degree, over only a portion of the elevation steps in at least one of the wafer alignment patterns.

Abstract: A tanning apparatus includes a plurality of tubular lamp housings releasably joined together in an electrical series relationship for tanning either an erect or recumbent person. Lamp housings, walls, and power cords are easily attachable and detachable for adjusting the configuration of the apparatus. Each lamp housing includes an ultraviolet lamp, ballast, and igniter. The lamp housing further includes a front panel which allows access to the lamp for replacement while protecting a user from injury in case a lamp bursts during use. The front panel is transparent, allowing ultraviolet rays to be transmitted toward a user. Reflective surfaces within the lamp housings and on the interior wall surfaces further contribute to efficient tanning. A frame is provided to support the apparatus above a recumbent user. The lamp housings may also be vertically positioned to surround and tan an erect user. Following use, the apparatus may be rolled into a compact bundle and secured by straps for transport or storage.

Abstract: A semiconductor processing method of forming integrated cicuitry on a semiconductor wafer includes, a) forming at least two discrete wafer alignment patterns on the wafer, the two discrete alignment patterns having respective-series of elevation steps provided therein; and b) while fabricating integrated circuitry elsewhere on the wafer, processing a first portion of at least one of the alignment patterns differently from a second portion of the one alignment pattern to render the first portion to be different from the second portion in the one alignment pattern. Such preferably superimposes a secondary step, most preferably of the same degree, over only a portion of the elevation steps in at least one of the wafer alignment patterns.

Abstract: A microfiltrated clean air supply system for providing a highly filtered supply of clean air suitable for aseptic packaging (for example, class 100 or better) in a filling machine is provided. In an embodiment, the clean air supply system includes a housing having an inlet and an outlet. A first plurality of filters are arranged in order of increasing collection efficiency within the housing adjacent the inlet. Similarly a second plurality of filters are arranged within the housing near the outlet. The second plurality of filters are also arranged in order of increasing collection efficiency. The clean air supply system also includes a chamber located between the first plurality of filters and the second plurality of filters. The chamber includes a wall separating the chamber from the second plurality of filters. A blower is arranged in the chamber between the first and second plurality of filters.

Abstract: A semiconductor processing method of forming integrated circuitry on a semiconductor wafer includes, a) forming at least two discrete wafer alignment patterns on the wafer, the two discrete alignment patterns having respective-series of elevation steps provided therein; and b) while fabricating integrated circuitry elsewhere on the wafer, processing a first portion of at least one of the alignment patterns differently from a second portion of the one alignment pattern to render the first portion to be different from the second portion in the one alignment pattern. Such preferably superimposes a secondary step, most preferably of the same degree, over only a portion of the elevation steps in at least one of the wafer alignment patterns.