Abstract: In some embodiments, the present disclosure provides a composition comprising 1) about 97.5 wt % to about 99.9 wt % of a first polyethylene having a density of about 0.91 g/cm3 to about 0.94 g/cm3, and a melt strength of about 10 mN or greater; and 2) about 0.1 wt % to about 2.5 wt % of a second polyethylene having an Mw of about 500,000 g/mol or more. In some embodiments, the composition is a film. In some embodiments, the present disclosure provides a method of making a composition comprising blending a first polyethylene of any embodiment described herein and a second polyethylene of any embodiment described herein.

Abstract: A printed circuit board having a footprint that is capable of receiving one of two electronic components having differing pin configurations. The footprint includes a first and a second common pin receptor arranged about a first axis. The first and second common pin receptors are configured to receive a first and a second pin on either of the electronic components. The footprint also includes a third pin receptor that is positioned along the first axis so as to be interposed between the first and the second common pin receptors and is configured to receive a third pin receptor of the first electronic component. The footprint also includes a fourth pin receptor that is positioned along a second axis, that is orthogonal to and intersects the first axis at the location of the third pin receptor. The fourth pin receptor is configured to receive a third pin of the second electronic component.

Abstract: A printed circuit board has a first plurality of pin receptors configured to receive a first type of SRAM memory device, a second plurality of pin receptors configured to receive a second type of SRAM memory device and a third plurality of pin receptors configured to receive a third type of SRAM memory device. The first plurality of pin receptors are formed in two parallel lines that extend in a first direction and define a portion of the boundary of a first area of the printed circuit board. The second and third pluralities of pin receptors are formed in the first area of the printed circuit board, with said second and third pluralities of pin receptors each comprising two parallel lines of pin receptors extending in a second direction, substantially orthogonal to the first direction.

Abstract: A dual footprint for servicing either of two types of microprocessor packaging systems. A first footprint capable of receiving and servicing a first type of microprocessor packaging system, for example, a tape carrier package microprocessor package, is formed within a second footprint capable of receiving and servicing a second type of microprocessor packaging system, for example, a pin grid array microprocessor package. In a preferred form, the two footprints are electrically interconnected and the first footprint is offset by a selected angle from the second footprint to allow increased connectivity between the two footprints.

Abstract: A dual footprint for servicing either of two types of microprocessor packaging systems. A first footprint capable of receiving and servicing a first type of microprocessor packaging system, for example, a tape carrier package microprocessor package, is formed within a second footprint capable of receiving and servicing a second type of microprocessor packaging system, for example, a pin grid array microprocessor package. In a preferred form, the two footprints are electrically interconnected and the first footprint is offset by a selected angle from the second footprint to allow increased connectivity between the two footprints.

Abstract: An improved omni-directional non-occluding solder pad design for printed circuit boards comprising a plurality of spokes radiating outward from a through-hole on the printed circuit board, with a ring concentric to the through-hole that intersects each of the plurality of spokes at approximately a perpendicular angle. The ringed-spoke configuration eliminates the need to ensure proper orientation of the solder pad on the printed circuit board prior to a wave soldering process since the symmetrical ringed-spoke design is omni-directional. The concentric ring structure provides an additional contact area of solder between the printed circuit board and a computer chassis. This additional contact area of solder ensures that there is a sufficient electrical connection between the printed circuit board and the computer chassis such that when the printed circuit board is mounted to the computer chassis, a proper grounding connection is provided.