Solder pad for printed circuit boards

- AST Research, Inc.
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Description

FIG. 1 is a front plan view of a solder pad for printed circuit boards of the present invention;

FIG. 2 is a rear plan view thereof;

FIG. 3 is a left side elevational view of the solder pad, as viewed from the left side of the page. FIG. 3 is not drawn to scale, and the thickness is exaggerated in order to illustrate that the solder pad does have a measurable thickness to it;

FIG. 4 is a top side elevational view of the solder pad, as viewed from the top side of the page. FIG. 4 is not drawn to scale, and the thickness is exaggerated in order to illustrate that the solder pad does have a measurable thickness to it. The right side and bottom side elevational views are not shown, since the symmetry of the solder pad provides a right and bottom view which is the same as the left and top view;

FIG. 5 is a front plan view of an alternative embodiment of a solder pad for printed circuit boards of the present invention;

FIG. 6 is a rear plan view thereof;

FIG. 7 is a left side elevational view of the alternative embodiment of the solder pad, as viewed from the left side of the page. FIG. 7 is not drawn to scale, and the thickness is exaggerated in order to illustrate that the solder pad does have a measurable thickness to it; and,

FIG. 8 is a front side elevational view thereof. The right side and rear elevational views thereof are not shown, since the symmetry of the solder pad provides right side and rear views which are the same as the left side and front views.

Referenced Cited
U.S. Patent Documents
D348650 July 12, 1994 Julian
5115375 May 19, 1992 Garay
5295862 March 22, 1994 Mosquera
Patent History
Patent number: D365084
Type: Grant
Filed: Aug 10, 1994
Date of Patent: Dec 12, 1995
Assignee: AST Research, Inc. (Irvine, CA)
Inventors: Edward D. Suski (Lake Forest, CA), David J. Silva (Trabuco, CA), Glenn G. Miner (Weatherford, TX)
Primary Examiner: Alan P. Douglas
Assistant Examiner: Robert M. Spear
Law Firm: Lyon & Lyon
Application Number: 0/26,966