Abstract: A semiconductor device includes a ROM, a differential sense amplifier and a multiplexer logic circuit. The ROM has memory cells in rows along word lines and columns along bit lines, and a reference column having reference transistors along a reference bit line. The multiplexer logic circuit couples a selected bit line to a first differential amplifier input and couples the reference bit line to the second differential amplifier input and controls a reference current of the reference bit line to be between a first bit line current of a programmed memory cell and a second bit line current of an unprogrammed memory cell.

Abstract: A semiconductor device includes a ROM, a differential sense amplifier and a multiplexer logic circuit. The ROM has memory cells in rows along word lines and columns along bit lines, and a reference column having reference transistors along a reference bit line. The multiplexer logic circuit couples a selected bit line to a first differential amplifier input and couples the reference bit line to the second differential amplifier input and controls a reference current of the reference bit line to be between a first bit line current of a programmed memory cell and a second bit line current of an unprogrammed memory cell.

Abstract: A semiconductor device includes a ROM, a differential sense amplifier and a multiplexer logic circuit. The ROM has memory cells in rows along word lines and columns along bit lines, and a reference column having reference transistors along a reference bit line. The multiplexer logic circuit couples a selected bit line to a first differential amplifier input and couples the reference bit line to the second differential amplifier input and controls a reference current of the reference bit line to be between a first bit line current of a programmed memory cell and a second bit line current of an unprogrammed memory cell.

Abstract: A delay circuit includes precharge and discharge transistors configured to receive an input signal. The delay circuit also includes a resistor coupled to the precharge transistor having a negative temperature coefficient to thereby form a node. A capacitive device and an inverter are coupled to the node. The inverter produces an output signal. Responsive to the input signal having a first polarity, the precharge transistor is configured to be turned on and the discharge transistor is configured to be turned off to thereby cause current to flow through the precharge transistor to the capacitive device to thereby charge the capacitive device. Responsive to the input signal having a second polarity, the precharge and discharge transistors are configured to change state to thereby cause charge from the capacitive device to discharge through the resistor and through the discharge transistor. The voltage on the node decays to a level which eventually causes the inverter's output to change state.

Abstract: An example memory circuit for reading and/or writing FRAM memory includes a controller to output a signal to an input of a driver; a transistor coupled an output of the driver; the driver to, in response to receiving the signal, output a first voltage to the transistor; and the transistor to, in response to receiving the first voltage, output a second voltage to a bit cell after a transistor delay, the transistor selected based on a size of the memory circuit.

Abstract: Methods and apparatus for reading and/or writing FRAM memory are disclosed. An example memory circuit includes a controller to output a signal to an input of a driver; a transistor coupled an output of the driver; the driver to, in response to receiving the signal, output a first voltage to the transistor; and the transistor to, in response to receiving the first voltage, output a second voltage to a bit cell after a transistor delay, the transistor selected based on a size of the memory circuit.

Abstract: An example memory circuit for reading and/or writing FRAM memory includes a controller to output a signal to an input of a driver; a transistor coupled an output of the driver; the driver to, in response to receiving the signal, output a first voltage to the transistor; and the transistor to, in response to receiving the first voltage, output a second voltage to a bit cell after a transistor delay, the transistor selected based on a size of the memory circuit.

Abstract: Methods and apparatus for reading and/or writing FRAM memory are disclosed. An example memory circuit includes a controller to output a signal to an input of a driver; a transistor coupled an output of the driver; the driver to, in response to receiving the signal, output a first voltage to the transistor; and the transistor to, in response to receiving the first voltage, output a second voltage to a bit cell after a transistor delay, the transistor selected based on a size of the memory circuit.

Abstract: Methods and apparatus for reading and/or writing FRAM memory are disclosed. An example memory circuit includes a controller to output a signal to an input of a driver; a transistor coupled an output of the driver; the driver to, in response to receiving the signal, output a first voltage to the transistor; and the transistor to, in response to receiving the first voltage, output a second voltage to a bit cell after a transistor delay, the transistor selected based on a size of the memory circuit.

Abstract: A programmable memory including a self-latching read data path. A sense amplifier senses the voltage level at a bit line, the bit line communicating the data state of a selected memory cell in its associated column. A data latch coupled to the output of the sense amplifier passes the sensed data state. Set-reset logic is provided that receives the output of the data latch in the read data path and, in response to a transition of the data state in a read cycle, latches the data latch and isolates it from the sense amplifier. The set-reset logic resets the data latch at the start of the next read cycle. In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.

Abstract: A delay circuit includes precharge and discharge transistors configured to receive an input signal. The delay circuit also includes a resistor coupled to the precharge transistor having a negative temperature coefficient to thereby form a node. A capacitive device and an inverter are coupled to the node. The inverter produces an output signal. Responsive to the input signal having a first polarity, the precharge transistor is configured to be turned on and the discharge transistor is configured to be turned off to thereby cause current to flow through the precharge transistor to the capacitive device to thereby charge the capacitive device. Responsive to the input signal having a second polarity, the precharge and discharge transistors are configured to change state to thereby cause charge from the capacitive device to discharge through the resistor and through the discharge transistor. The voltage on the node decays to a level which eventually causes the inverter's output to change state.

Abstract: A delay circuit includes precharge and discharge transistors configured to receive an input signal. The delay circuit also includes a resistor coupled to the precharge transistor having a negative temperature coefficient to thereby form a node. A capacitive device and an inverter are coupled to the node. The inverter produces an output signal. Responsive to the input signal having a first polarity, the precharge transistor is configured to be turned on and the discharge transistor is configured to be turned off to thereby cause current to flow through the precharge transistor to the capacitive device to thereby charge the capacitive device. Responsive to the input signal having a second polarity, the precharge and discharge transistors are configured to change state to thereby cause charge from the capacitive device to discharge through the resistor and through the discharge transistor. The voltage on the node decays to a level which eventually causes the inverter's output to change state.

Abstract: A programmable memory including a self-latching read data path. A sense amplifier senses the voltage level at a bit line, the bit line communicating the data state of a selected memory cell in its associated column. A data latch coupled to the output of the sense amplifier passes the sensed data state. Set-reset logic is provided that receives the output of the data latch in the read data path and, in response to a transition of the data state in a read cycle, latches the data latch and isolates it from the sense amplifier. The set-reset logic resets the data latch at the start of the next read cycle. In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.

Abstract: A programmable memory including a self-latching read data path. A sense amplifier senses the voltage level at a bit line, the bit line communicating the data state of a selected memory cell in its associated column. A data latch coupled to the output of the sense amplifier passes the sensed data state. Set-reset logic is provided that receives the output of the data latch in the read data path and, in response to a transition of the data state in a read cycle, latches the data latch and isolates it from the sense amplifier. The set-reset logic resets the data latch at the start of the next read cycle. In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.

Abstract: Methods and apparatus for reading and/or writing FRAM memory are disclosed. An example memory circuit includes a controller to output a signal to an input of a driver; a transistor coupled an output of the driver; the driver to, in response to receiving the signal, output a first voltage to the transistor; and the transistor to, in response to receiving the first voltage, output a second voltage to a bit cell after a transistor delay, the transistor selected based on a size of the memory circuit.

Abstract: A programmable memory including a self-latching read data path. A sense amplifier senses the voltage level at a bit line, the bit line communicating the data state of a selected memory cell in its associated column. A data latch coupled to the output of the sense amplifier passes the sensed data state. Set-reset logic is provided that receives the output of the data latch in the read data path and, in response to a transition of the data state in a read cycle, latches the data latch and isolates it from the sense amplifier. The set-reset logic resets the data latch at the start of the next read cycle. In some embodiments, a timer is provided so that the latch is reset after a time-out period in a long read cycle in which no data transition occurs.

Abstract: A computer program for generating a layout for a ferroelectric random access memory (FRAM) that is embodied on a non-transitory storage medium and executable by a processor is provided. FRAM specifications are received, and an FRAM floorplan and design rules are retrieved from the non-transitory storage medium. The layout for the FRAM based on the FRAM specifications and design rules is then assembled.

Abstract: A computer program for generating a layout for a ferroelectric random access memory (FRAM) that is embodied on a non-transitory storage medium and executable by a processor is provided. FRAM specifications are received, and an FRAM floorplan and design rules are retrieved from the non-transitory storage medium. The layout for the FRAM based on the FRAM specifications and design rules is then assembled.

Abstract: An integrated circuit containing a memory array, a redundancy circuit and a redundancy error correction circuit coupled to said redundancy circuit. A method for constructing a redundancy word which corresponds to each memory segment and a method for error checking the redundancy word during a memory access request.

Abstract: A static RAM redundancy memory for use in combination with a non-volatile memory array, such as ferroelectric RAM (FRAM), in which the power consumption of the SRAM redundancy memory is reduced. Each word of the redundancy memory includes data bit cells for storing addresses of memory cells in the FRAM array to be replaced by redundant elements, and also enable bits indicating whether redundancy is enabled for those addresses. A logical combination of the enable bits in a given word determines whether the data bit cells in that word are powered-up. As a result, the power consumption of the redundancy memory is reduced to the extent that redundancy is not enabled for segments of the FRAM array.