Abstract: A static RAM redundancy memory for use in combination with a non-volatile memory array, such as ferroelectric RAM (FRAM), in which the power consumption of the SRAM redundancy memory is reduced. Each word of the redundancy memory includes data bit cells for storing addresses of memory cells in the FRAM array to be replaced by redundant elements, and also enable bits indicating whether redundancy is enabled for those addresses. A logical combination of the enable bits in a given word determines whether the data bit cells in that word are powered-up. As a result, the power consumption of the redundancy memory is reduced to the extent that redundancy is not enabled for segments of the FRAM array.

Abstract: An integrated circuit containing a memory array, a redundancy circuit and a redundancy error correction circuit coupled to said redundancy circuit. A method for constructing a redundancy word which corresponds to each memory segment and a method for error checking the redundancy word during a memory access request.

Abstract: According to one embodiment of the present invention a memory subsystem comprises a column and a column select signal line. The column comprises at least one bit line and a write precharge circuit. The write precharge circuit is operable to provide at least a portion of a charge on the at least one bit line. The column select signal line is operable to provide a column select signal selecting the column for a write operation. The write precharge circuit is gated with the column select signal line such that the column select signal is communicated to the write precharge circuit upon selection of the column for the write operation. The write precharge circuit is operable to at least partially restore the charge on the at least one bit line upon receipt of the column select signal after the write operation.

Abstract: According to one embodiment of the invention, a memory circuit operable to assume a standby mode is provided. A memory circuit includes a transistor comprising a gate and a bulk. The bulk is at a retention voltage level. The memory circuit also includes a first node and a second node that are coupled to each other by the transistor. The first node is operable to assume a higher voltage level than the second node in response to an initiation of the standby mode. The memory circuit also includes a third node coupled to the gate of the transistor. The third node is operable to assume a voltage approximately equal to the retention voltage in response to an initiation of the standby mode. The transistor is operable to reduce any direct current flow between the first node and the second node in response to a rise in voltage at the third node to a voltage approximately equal to the retention voltage.

Abstract: A circuit and method for minimizing write recovery time in a Bi-CMOS SRAM by equalizing the bit-line voltages during a read access. A P-channel device whose drain, source and gate are connected to bit, bit-bar, and the write control signal, respectively, indirectly equalizes the bit-lines by equalizing the base voltages of the NPN bit-line load devices only when the column is selected for read access. This technique takes advantage of the current gain of the NPN transistor from the base to the emitter to provide fast bit-line equalization immediately following writes, thus minimizing the write recovery time.