Abstract: Methods of protecting a surface of a copper layer or a copper bonding pad on a semiconductor device against oxidation. A surface of the layer or bonding pad is cleaned by removing an oxidation layer with a plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma-enhanced deposition process to protect the cleaned surface of the layer against exposure to an oxidizing gas.

Abstract: Methods of protecting a surface of a copper layer or a copper bonding pad on a semiconductor device against oxidation. A surface of the layer or bonding pad is cleaned by removing an oxidation layer with a plasma. A polymer layer is formed on the cleaned surface of the layer using a plasma-enhanced deposition process to protect the cleaned surface of the layer against exposure to an oxidizing gas.

Abstract: An apparatus and a method for obtaining, in vivo, a measurement of retinal response to an optical stimuli. Light sources provide optical stimuli to the retina in accordance with predetermined stimulation sequences, and images of the retina are obtained and correlated with the predetermined stimulation sequences so as to determine responses of the retina to the optical stimuli. In one particular embodiment, optical stimuli are provided according to m-sequences and correlated with corresponding optical coherence tomography images to determine a functional response of the retina.

Abstract: An apparatus and a method for obtaining, in vivo, a measurement of retinal response to an optical stimuli. Light sources provide optical stimuli to the retina in accordance with predetermined stimulation sequences, and images of the retina are obtained and correlated with the predetermined stimulation sequences so as to determine responses of the retina to the optical stimuli. In one particular embodiment, optical stimuli are provided according to m-sequences and correlated with corresponding optical coherence tomography images to determine a functional response of the retina.

Abstract: The present invention comprises a lead frame substrate adapted to receive semiconductor die and multiple passive components. The lead frame substrate is preferably formed from a single piece of electrically conductive material, such as copper, and may be mounted within a lead frame package or directly onto a circuit board. The lead frame substrate includes mounting surfaces adapted to receive the semiconductor dice and passive components. The mounting surfaces are linked together by temporary and/or permanent connection bars. A method to manufacture the lead frame package includes, among other steps, forming a lead frame substrate, applying a molding compound to the lead frame substrate to fix each mounting surface and connection bar in place, removing the temporary connection bars, mounting the semiconductor components on the lead frame substrate, and applying a packaging material over the lead frame substrate to encapsulate the semiconductor components.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: A center beam rail road car has a center sill that runs along the car from end to end. The center sill is dog-legged, having end portions mounted over rail car trucks, and a downwardly stepped central portion between the trucks. A central beam assembly stands upwardly of the center sill. A lading supporting deck structure extends laterally to either side of the center sill. The deck structure has a depressed medial portion between the trucks, and raised end portions over the trucks. The deck portions have lading bearing interfaces. The medial portion of the center sill has a top flange that is carried at a height that lies flush with, or below, the level of the lading bearing interface of the medial portion of the center sill. In one embodiment, a column member for carrying buff and draft loads is spaced upwardly from the medial portion of the center sill.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: A semiconductor chip package that includes a DC—DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least one via array extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC—DC converter includes at least one power semiconductor die having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array.

Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.

Abstract: In accordance with the invention a surface mount connector is provided for vertically mounting one circuit device on another. By “vertically mounting” is meant that a circuit device with a major surface is mounted perpendicular to the major surface of another circuit device. The connector is a conductive body comprising a base section and a transverse section, the base section having a width greater than the transverse section and a length which extends beyond the transverse section. Advantageously, the base section extends beyond the transverse section in front, behind and on both sides. In typical use, a major surface of a subassembly can be connected to the transverse section and an edge of the subassembly can be connected to the base extensions. The base can then be connected to the mother board.

Abstract: A semiconductor chip package that includes a DC—DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC—DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC—DC converter provided on the substrate. The DC—DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC—DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area.

Abstract: A center beam car has a main deck structure extending laterally from a main center sill, and a central vertically oriented central beam structure. The center beam so formed defines bunks upon in which to carry cargo. The upper region of the web-work structure includes a top chord mounted to run between two end bulkheads. The cargo can be secured to the deck with straps or webs. When the car is empty the straps or webs can be stored within boxes that are accessible at deck level by a person of average height. The storage boxes can be along the center line of the car, between the posts of the center beam, or they can be located adjacent to the side sills. Further, the boxes can be movable to a raised position, or to a lowered, stored position. A reeling mechanism is provided to facilitate winding of the straps or webs for storage.

Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.