Abstract: A linear-travel mechanical switch for use in a headphone device comprises a user button attached to a plunger. The plunger extends into a body of the headphone device. A travel pathway extends in a first linear direction from the plunger and in a second, opposite linear direction from the plunger. At least one bias device is integrated into the linear-travel mechanical switch. The at least one bias device biasing the plunger to a middle position along the travel pathway. A plunger button is located such that depressing the user button engages the plunger button. A first button is located such that a movement of the user button along the travel pathway in the first linear direction engages the first button. A second button is located such that a movement of the user button long the travel pathway in the second, opposite linear direction engages the second button.

Abstract: Disclosed are methods for producing from a gaseous substrate comprising CO, CO2, and optionally H2 at least one oxygenated product. Also provided are methods of using a broth deficient in thiamine or thiazole-containing thiamine precursors as a screening tool for suitable ethanol producing acetogenic carboxydotrophic bacteria strains, operating a syngas fermentation without the addition of thiamine or thiazole-containing thiamine precursors, controlling bacterial contamination in a bioreactor, and methods for preparing animal feed and fertilizer.

Abstract: A linear-travel mechanical switch for use in a headphone device comprises a user button attached to a plunger. The plunger extends into a body of the headphone device. A travel pathway extends in a first linear direction from the plunger and in a second, opposite linear direction from the plunger. At least one bias device is integrated into the linear-travel mechanical switch. The at least one bias device biasing the plunger to a middle position along the travel pathway. A plunger button is located such that depressing the user button engages the plunger button. A first button is located such that a movement of the user button along the travel pathway in the first linear direction engages the first button. A second button is located such that a movement of the user button long the travel pathway in the second, opposite linear direction engages the second button.

Abstract: An apparatus and a method for obtaining, in vivo, a measurement of retinal response to an optical stimuli. Light sources provide optical stimuli to the retina in accordance with predetermined stimulation sequences, and images of the retina are obtained and correlated with the predetermined stimulation sequences so as to determine responses of the retina to the optical stimuli. In one particular embodiment, optical stimuli are provided according to m-sequences and correlated with corresponding optical coherence tomography images to determine a functional response of the retina.

Abstract: An apparatus and a method for obtaining, in vivo, a measurement of retinal response to an optical stimuli. Light sources provide optical stimuli to the retina in accordance with predetermined stimulation sequences, and images of the retina are obtained and correlated with the predetermined stimulation sequences so as to determine responses of the retina to the optical stimuli. In one particular embodiment, optical stimuli are provided according to m-sequences and correlated with corresponding optical coherence tomography images to determine a functional response of the retina.

Abstract: The present invention comprises a lead frame substrate adapted to receive semiconductor die and multiple passive components. The lead frame substrate is preferably formed from a single piece of electrically conductive material, such as copper, and may be mounted within a lead frame package or directly onto a circuit board. The lead frame substrate includes mounting surfaces adapted to receive the semiconductor dice and passive components. The mounting surfaces are linked together by temporary and/or permanent connection bars. A method to manufacture the lead frame package includes, among other steps, forming a lead frame substrate, applying a molding compound to the lead frame substrate to fix each mounting surface and connection bar in place, removing the temporary connection bars, mounting the semiconductor components on the lead frame substrate, and applying a packaging material over the lead frame substrate to encapsulate the semiconductor components.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: A semiconductor chip package that includes a DC—DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least one via array extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC—DC converter includes at least one power semiconductor die having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array.