Abstract: A carbon dioxide capture facility is disclosed comprising packing formed as a slab, and at least one liquid source. The slab has opposed dominant faces, the opposed dominant faces being at least partially wind penetrable to allow wind to flow through the packing. The at least one liquid source is oriented to direct carbon dioxide absorbent liquid into the packing to flow through the slab. The slab is disposed in a wind flow that has a non-zero incident angle with one of the opposed dominant faces. A method of carbon dioxide capture is also disclosed. Carbon dioxide absorbing liquid is applied into packing in a series of pulses. A gas containing carbon dioxide is flowed through the packing to at least partially absorb the carbon dioxide from the gas into the carbon dioxide absorbing liquid.

Abstract: A carbon dioxide capture facility is disclosed comprising packing formed as a slab, and at least one liquid source. The slab has opposed dominant faces, the opposed dominant faces being at least partially wind penetrable to allow wind to flow through the packing. The at least one liquid source is oriented to direct carbon dioxide absorbent liquid into the packing to flow through the slab. The slab is disposed in a wind flow that has a non-zero incident angle with one of the opposed dominant faces. A method of carbon dioxide capture is also disclosed. Carbon dioxide absorbing liquid is applied into packing in a series of pulses. A gas containing carbon dioxide is flowed through the packing to at least partially absorb the carbon dioxide from the gas into the carbon dioxide absorbing liquid.

Abstract: A carbon dioxide capture facility is disclosed comprising packing formed as a slab, and at least one liquid source. The slab has opposed dominant faces, the opposed dominant faces being at least partially wind penetrable to allow wind to flow through the packing. The at least one liquid source is oriented to direct carbon dioxide absorbent liquid into the packing to flow through the slab. The slab is disposed in a wind flow that has a non-zero incident angle with one of the opposed dominant faces. A method of carbon dioxide capture is also disclosed. Carbon dioxide absorbing liquid is applied into packing in a series of pulses. A gas containing carbon dioxide is flowed through the packing to at least partially absorb the carbon dioxide from the gas into the carbon dioxide absorbing liquid.

Abstract: A carbon dioxide capture facility is disclosed comprising packing formed as a slab, and at least one liquid source. The slab has opposed dominant faces, the opposed dominant faces being at least partially wind penetrable to allow wind to flow through the packing. The at least one liquid source is oriented to direct carbon dioxide absorbent liquid into the packing to flow through the slab. The slab is disposed in a wind flow that has a non-zero incident angle with one of the opposed dominant faces. A method of carbon dioxide capture is also disclosed. Carbon dioxide absorbing liquid is applied into packing in a series of pulses. A gas containing carbon dioxide is flowed through the packing to at least partially absorb the carbon dioxide from the gas into the carbon dioxide absorbing liquid.

Abstract: A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer test system includes an interposer having a first surface and a second surface facing away from the first surface. The system also includes a wafer translator having a first side facing the second surface of the interposer and a second side facing away from the first side and toward a wafer, the first side carrying a plurality of first terminals at a first scale and the second side carrying a plurality of second terminals at a second scale. The first scale is greater than the second scale.

Abstract: A carbon dioxide capture facility is disclosed comprising packing formed as a slab, and at least one liquid source. The slab has opposed dominant faces, the opposed dominant faces being at least partially wind penetrable to allow wind to flow through the packing. The at least one liquid source is oriented to direct carbon dioxide absorbent liquid into the packing to flow through the slab. The slab is disposed in a wind flow that has a non-zero incident angle with one of the opposed dominant faces. A method of carbon dioxide capture is also disclosed. Carbon dioxide absorbing liquid is applied into packing in a series of pulses. A gas containing carbon dioxide is flowed through the packing to at least partially absorb the carbon dioxide from the gas into the carbon dioxide absorbing liquid.

Abstract: A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer test system includes an interposer having a first surface and a second surface facing away from the first surface. The system also includes a wafer translator having a first side facing the second surface of the interposer and a second side facing away from the first side and toward a wafer, the first side carrying a plurality of first terminals at a first scale and the second side carrying a plurality of second terminals at a second scale. The first scale is greater than the second scale.

Abstract: A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

Abstract: A carbon dioxide capture facility is disclosed comprising packing formed as a slab, and at least one liquid source. The slab has opposed dominant faces, the opposed dominant faces being at least partially wind penetrable to allow wind to flow through the packing. The at least one liquid source is oriented to direct carbon dioxide absorbent liquid into the packing to flow through the slab. The slab is disposed in a wind flow that has a non-zero incident angle with one of the opposed dominant faces. A method of carbon dioxide capture is also disclosed. Carbon dioxide absorbing liquid is applied into packing in a series of pulses. A gas containing carbon dioxide is flowed through the packing to at least partially absorb the carbon dioxide from the gas into the carbon dioxide absorbing liquid.

Abstract: A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

Abstract: A wafer testing system and associated methods of use an manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

Abstract: A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

Abstract: A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

Abstract: A method of carbon dioxide capture is disclosed. In a step (a) anhydrous sodium carbonate is separated from a first aqueous solution formed by reacting carbon dioxide and an aqueous solution of sodium hydroxide. In step (b) the anhydrous sodium carbonate is treated by causticization to generate carbon dioxide and sodium hydroxide. The first aqueous solution of step (a) is formed by scrubbing a gas containing carbon dioxide with an aqueous solution of sodium hydroxide.

Abstract: The disclosure relates to a method and apparatus wherein extra mass is added to a profile of a slider zipper prior to the ultrasonic or thermal forming of the end stomps. This results in an end stomp of increased size and height, thereby providing a greater resistance to the slider being pulled from the ends of the zipper.

Abstract: An optically addressed, photoconductive spatial light modulator (SLM) operates in a transmissive mode and is capable of modulating a wide spectrum of visible light. There is no pixel structure or native pixel resolution in the SLM. The SLM has no photodiodes and does not rectify. A light projection system (100) in which one or more SLMs (128, 130, 132) are placed includes a write (image definition) UV light path (102) and a read (illumination) visible light path (104) to form a color image projection display. The write UV light propagates from an image display pattern source (120) and either sequentially or continuously writes image patterns on the photoconductive SLMs. The read visible light propagates through the SLM and is modulated by an electro-optical material, the optical properties of which change in response to the image structure carried by the write light. The result is a high efficiency display system that delivers high resolution color images through a projection lens (190) onto a display screen.

Abstract: A carbon dioxide capture facility is disclosed comprising packing formed as a slab, and at least one liquid source. The slab has opposed dominant faces, the opposed dominant faces being at least partially wind penetrable to allow wind to flow through the packing. The at least one liquid source is oriented to direct carbon dioxide absorbent liquid into the packing to flow through the slab. The slab is disposed in a wind flow that has a non-zero incident angle with one of the opposed dominant faces. A method of carbon dioxide capture is also disclosed. Carbon dioxide absorbing liquid is applied into packing in a series of pulses. A gas containing carbon dioxide is flowed through the packing to at least partially absorb the carbon dioxide from the gas into the carbon dioxide absorbing liquid.

Abstract: A method of carbon dioxide capture is disclosed. In a step (a) anhydrous sodium carbonate is separated from a first aqueous solution formed by reacting carbon dioxide and an aqueous solution of sodium hydroxide. In step (b) the anhydrous sodium carbonate is treated by causticization to generate carbon dioxide and sodium hydroxide. The first aqueous solution of step (a) is formed by scrubbing a gas containing carbon dioxide with an aqueous solution of sodium hydroxide.

Abstract: An optically addressed, photoconductive spatial light modulator (SLM) operates in a transmissive mode and is capable of modulating a wide spectrum of visible light. There is no pixel structure or native pixel resolution in the SLM. The SLM has no photodiodes and does not rectify. A light projection system (100) in which one or more SLMs (128, 130, 132) are placed includes a write (image definition) UV light path (102) and a read (illumination) visible light path (104) to form a color image projection display. The write UV light propagates from an image display pattern source (120) and either sequentially or continuously writes image patterns on the photoconductive SLMs. The read visible light propagates through the SLM and is modulated by an electro-optical material, the optical properties of which change in response to the image structure carried by the write light. The result is a high efficiency display system that delivers high resolution color images through a projection lens (190) onto a display screen.

Abstract: A flexible reclosable container with a header strip, fastener elements, and a slider. The header strip preferably extends from the mouth of the bag, and includes a line of weakness for easy tear off of the bag. The slider and profiles are arranged such that the mouth of the bag is substantially open.