Patents by Inventor David Korn

David Korn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer carrier
    Patent number: 6237979
    Abstract: A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: May 29, 2001
    Assignee: Micron Technology, Inc.
    Inventors: David Korn, Keith Smith
  • Method of constructing a wafer carrier
    Patent number: 6227590
    Abstract: A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: May 8, 2001
    Assignee: Micron Technology, Inc.
    Inventors: David Korn, Keith Smith
  • Semiconductor processing methods, methods of forming electronic components, and transistors
    Patent number: 6143611
    Abstract: In one implementation, first and second layers are formed over a substrate. One of the layers has a higher oxidation rate than the other when exposed to an oxidizing atmosphere. The layers respectively have an exposed outer edge spaced inside of the substrate periphery. Etching is conducted into the higher oxidation rate material at a faster rate than any etching which occurs into the lower oxidation rate material. Then, the substrate is exposed to the oxidizing atmosphere. In another implementation, a stack of at least two conductive layers for an electronic component is formed. The two conductive layers have different oxidation rates when exposed to an oxidizing atmosphere. The layer with the higher oxidation rate has an outer lateral edge which is recessed inwardly of a corresponding outer lateral edge of the layer with the lower oxidation rate. The stack is exposed to the oxidizing atmosphere effective to grow an oxide layer over the outer lateral edges of the first and second layers.
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: November 7, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Terry Gilton, David Korn
  • Wafer carrier having both a rigid structure and resistance to corrosive environments
    Patent number: 6092851
    Abstract: A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.
    Type: Grant
    Filed: November 15, 1999
    Date of Patent: July 25, 2000
    Assignee: Micron Technology, Inc.
    Inventors: David Korn, Keith Smith
  • Method of making a carrier for at least one wafer
    Patent number: 6086127
    Abstract: A method of making a wafer carrier for use in the transportation and storage of semiconductor wafers includes providing a unitary frame, forming a corrosion resistant coating, such as a fluoropolymer, covering the frame and providing wafer support elements mounted on the frame. A wafer carrier made by the present method may include a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.
    Type: Grant
    Filed: August 3, 1998
    Date of Patent: July 11, 2000
    Assignee: Micron Technology, Inc.
    Inventors: David Korn, Keith Smith
  • Oxide etch and method of etching
    Patent number: 6063712
    Abstract: An oxide etchant and method of etching are provided. The etchant includes at least one fluorine-containing compound and at least one auxiliary component selected from the group of a boron-containing compound and a phosphorus-containing compound.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: May 16, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Terry L. Gilton, David A. Korn
  • Wafer carrier having both a rigid structure and resistance to corrosive environments
    Patent number: 5788304
    Abstract: A wafer carrier for use in the transportation and storage of semiconductor wafers. More particularly, the invention is a wafer carrier having both a rigid structure and a corrosion resistant coating. The wafer carrier includes a unitary frame having several wafer supports joined by connecting members. The frame is coated with a material, such as a fluoropolymer, which is resistant to corrosive materials typically used in semiconductor fabrication processes.
    Type: Grant
    Filed: May 17, 1996
    Date of Patent: August 4, 1998
    Assignee: Micron Technology, Inc.
    Inventors: David Korn, Keith Smith