Patents by Inventor David LeVine
David LeVine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230074958Abstract: Optical tactile sensors are provided that include a scaffolding structure, a transparent elastomer material covering at least an end portion of the scaffolding structure, and one or multiple cameras situated on the end portion of the scaffolding structure and embedded within the transparent elastomer material, wherein the one or multiple cameras are situated so as to provide an extended, e.g., up to 360°, field of view about the end portion of the scaffolding structure.Type: ApplicationFiled: April 19, 2022Publication date: March 9, 2023Inventors: Frederik David Ebert, Akhil Amar Padmanabha, Stephen Tian, Roberto Calandra, Sergey Vladimir Levine
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Patent number: 11602033Abstract: The present disclosure describes a network device that is capable of coordinating the control of light emitters. For example, the network device may receive data indicating conditions for activating the light emitters. The network device may then receive sensor data generated by various sensors, such as motion sensors, light sensors, or a timer. Using the sensor data, the network device may determine that the conditions are satisfied and, in response, cause the light emitters to activate. To activate first light emitters, the network device may transmit a signal to an electronic device that causes the first light emitters to activate. The first light emitters may be powered by the electronic device. Additionally, to activate second light emitters, the network device may transmit signals to the second light emitters that include commands to activate.Type: GrantFiled: June 26, 2019Date of Patent: March 7, 2023Assignee: Amazon Technologies, Inc.Inventors: James Siminoff, Michael V. Recker, Ryan David Hruska, David Brett Levine
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Publication number: 20230049952Abstract: Mutations in oncogenes and tumor suppressors contribute to the development and progression of cancer. The present disclosure describes compounds and methods to recover wild-type function to p53 mutants. The compounds of the present invention can bind to mutant p53 and restore the ability of the p53 mutant to bind DNA and activate downstream effectors involved in tumor suppression. The disclosed compounds can be used to reduce the progression of cancers that contain a p53 mutation.Type: ApplicationFiled: June 15, 2021Publication date: February 16, 2023Inventors: Arnold Levine, David Mack, Binh Vu, Thomas Davis, Melissa Dumble
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Patent number: 11568057Abstract: Systems and methods are provided for the classification of identified security vulnerabilities in software applications, and their automated triage based on machine learning. The disclosed system may generate a report listing detected potential vulnerability issues, and extract features from the report for each potential vulnerability issue. The system may receive policy data and business rules, and compare the extracted features relative to such data and rules. The system may determine a token based on the source code of a potential vulnerability issue, and a vector based on the extracted features of a potential vulnerability issue and based on the token. The system may select a machine learning modelling method and/or an automated triaging method based on the vector, and determine a vulnerability accuracy score based on the vector using the selected method.Type: GrantFiled: February 4, 2020Date of Patent: January 31, 2023Assignee: ACCENTURE GLOBAL SOLUTIONS LIMITEDInventors: Sidath Handurukande, Finbarr Tarrant, David Glyn Darkin, Owen McGauley, Mehdi Sanoh, Karel Kohout, Richard Levine, Ganesh Devarajan
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Patent number: 11546983Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: GrantFiled: October 28, 2020Date of Patent: January 3, 2023Assignee: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
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Publication number: 20220223049Abstract: Methods, apparatus, and articles of manufacture for observer-based landing control of a vehicle are disclosed. An example apparatus includes at least one memory, and at least one processor to execute instructions to at least in response to determining an aircraft is in a flight plan flare regime, determine an estimate state of an aircraft parameter based on an execution of a transfer function of an observer model, the execution of the transfer function based on an altitude command corresponding to the flare regime, determine a gain value based on the aircraft parameter, determine an altitude control input based on the estimate state and the gain value, determine an altitude command output based on the altitude control input and longitudinal dynamics of the aircraft, the longitudinal dynamics generated in response to the aircraft executing the altitude command output, and control an elevator of the aircraft based on the altitude command output.Type: ApplicationFiled: November 15, 2021Publication date: July 14, 2022Inventors: Eugene Lavretsky, Kevin Wise, Ross Gadient, Benjamin David Levine, Jasmine Beth Minteer-Levine
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Publication number: 20220180963Abstract: Methods of identifying a druggable target in a subject suffering from cancer comprising determining at least one unbalanced process in the subject's expression data and selecting at least one gene and/or protein from the at least one unbalanced process wherein a drug that targets that gene or protein is known.Type: ApplicationFiled: April 29, 2019Publication date: June 9, 2022Applicant: YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM LTD.Inventors: Nataly KRAVCHENKO-BALASHA, Raphael David LEVINE, Efrat FLASHNER-ABRAMSON
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Publication number: 20210359450Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.Type: ApplicationFiled: July 30, 2021Publication date: November 18, 2021Applicant: Amphenol CorporationInventors: Donald A. Girard, JR., Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine
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Publication number: 20210275440Abstract: The invention provides microbeads comprising chitosan, a magnetic nanoparticle, and an agent, and methods for using such microbeads for the local delivery of biologically active agents to an open fracture, complex wound or other site of infection or disease.Type: ApplicationFiled: September 27, 2017Publication date: September 9, 2021Applicant: THE UNIVERSITY OF MEMPHIS RESEARCH FOUNDATIONInventors: ANKITA MOHAPATRA, MICHAEL A. HARRIS, BASHIR I. MORSHED, JESSICA A. JENNINGS, JOEL BUMGARDNER, TOMOKO FUJIWARA, SANJAY R. MISHRA, DAVID A. LEVINE, GREGORY MCGRAW, WARREN O. HAGGARD
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Patent number: 11108180Abstract: Electrical connectors including superelastic components. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. A connector can include one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members may deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.Type: GrantFiled: July 20, 2020Date of Patent: August 31, 2021Assignee: Amphenol CorporationInventors: Donald A. Girard, Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine
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Publication number: 20210257788Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.Type: ApplicationFiled: January 27, 2021Publication date: August 19, 2021Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
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Publication number: 20210234290Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.Type: ApplicationFiled: January 27, 2021Publication date: July 29, 2021Applicant: Amphenol CorporationInventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
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Publication number: 20210218198Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.Type: ApplicationFiled: March 29, 2021Publication date: July 15, 2021Applicant: Amphenol CorporationInventors: Marc B. Cartier, JR., John Robert Dunham, Vysakh Sivarajan, Mark W. Gailus, David Levine, Michael Joseph Snyder
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Patent number: 10965065Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.Type: GrantFiled: March 2, 2020Date of Patent: March 30, 2021Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., John Robert Dunham, Vysakh Sivarajan, Mark W. Gailus, David Levine, Michael Joseph Snyder
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Publication number: 20210076486Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.Type: ApplicationFiled: October 28, 2020Publication date: March 11, 2021Applicant: Amphenol CorporationInventors: Mark W. Gailus, Marc B. Cartier, JR., Vysakh Sivarajan, David Levine
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Patent number: D908633Type: GrantFiled: October 12, 2018Date of Patent: January 26, 2021Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
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Patent number: D948454Type: GrantFiled: June 24, 2020Date of Patent: April 12, 2022Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
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Patent number: D953275Type: GrantFiled: December 22, 2020Date of Patent: May 31, 2022Assignee: Amphenol CorporationInventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
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Patent number: D963912Type: GrantFiled: April 23, 2021Date of Patent: September 13, 2022Assignee: Amazon Technologies, Inc.Inventors: Christopher Loew, Maya Winfield, Alexsandra M. Bowers, Ryan David Hruska, Mark Siminoff, David Brett Levine, James Siminoff
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Patent number: D969381Type: GrantFiled: December 29, 2021Date of Patent: November 8, 2022Assignee: Amazon Technologies, Inc.Inventors: Christopher Loew, Maya Winfield, Alexsandra M. Bowers, Ryan David Hruska, Mark D Siminoff, David Brett Levine, James Siminoff