Patents by Inventor David LeVine

David LeVine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230074958
    Abstract: Optical tactile sensors are provided that include a scaffolding structure, a transparent elastomer material covering at least an end portion of the scaffolding structure, and one or multiple cameras situated on the end portion of the scaffolding structure and embedded within the transparent elastomer material, wherein the one or multiple cameras are situated so as to provide an extended, e.g., up to 360°, field of view about the end portion of the scaffolding structure.
    Type: Application
    Filed: April 19, 2022
    Publication date: March 9, 2023
    Inventors: Frederik David Ebert, Akhil Amar Padmanabha, Stephen Tian, Roberto Calandra, Sergey Vladimir Levine
  • Patent number: 11602033
    Abstract: The present disclosure describes a network device that is capable of coordinating the control of light emitters. For example, the network device may receive data indicating conditions for activating the light emitters. The network device may then receive sensor data generated by various sensors, such as motion sensors, light sensors, or a timer. Using the sensor data, the network device may determine that the conditions are satisfied and, in response, cause the light emitters to activate. To activate first light emitters, the network device may transmit a signal to an electronic device that causes the first light emitters to activate. The first light emitters may be powered by the electronic device. Additionally, to activate second light emitters, the network device may transmit signals to the second light emitters that include commands to activate.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: March 7, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: James Siminoff, Michael V. Recker, Ryan David Hruska, David Brett Levine
  • Publication number: 20230049952
    Abstract: Mutations in oncogenes and tumor suppressors contribute to the development and progression of cancer. The present disclosure describes compounds and methods to recover wild-type function to p53 mutants. The compounds of the present invention can bind to mutant p53 and restore the ability of the p53 mutant to bind DNA and activate downstream effectors involved in tumor suppression. The disclosed compounds can be used to reduce the progression of cancers that contain a p53 mutation.
    Type: Application
    Filed: June 15, 2021
    Publication date: February 16, 2023
    Inventors: Arnold Levine, David Mack, Binh Vu, Thomas Davis, Melissa Dumble
  • Patent number: 11568057
    Abstract: Systems and methods are provided for the classification of identified security vulnerabilities in software applications, and their automated triage based on machine learning. The disclosed system may generate a report listing detected potential vulnerability issues, and extract features from the report for each potential vulnerability issue. The system may receive policy data and business rules, and compare the extracted features relative to such data and rules. The system may determine a token based on the source code of a potential vulnerability issue, and a vector based on the extracted features of a potential vulnerability issue and based on the token. The system may select a machine learning modelling method and/or an automated triaging method based on the vector, and determine a vulnerability accuracy score based on the vector using the selected method.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: January 31, 2023
    Assignee: ACCENTURE GLOBAL SOLUTIONS LIMITED
    Inventors: Sidath Handurukande, Finbarr Tarrant, David Glyn Darkin, Owen McGauley, Mehdi Sanoh, Karel Kohout, Richard Levine, Ganesh Devarajan
  • Patent number: 11546983
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 3, 2023
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
  • Publication number: 20220223049
    Abstract: Methods, apparatus, and articles of manufacture for observer-based landing control of a vehicle are disclosed. An example apparatus includes at least one memory, and at least one processor to execute instructions to at least in response to determining an aircraft is in a flight plan flare regime, determine an estimate state of an aircraft parameter based on an execution of a transfer function of an observer model, the execution of the transfer function based on an altitude command corresponding to the flare regime, determine a gain value based on the aircraft parameter, determine an altitude control input based on the estimate state and the gain value, determine an altitude command output based on the altitude control input and longitudinal dynamics of the aircraft, the longitudinal dynamics generated in response to the aircraft executing the altitude command output, and control an elevator of the aircraft based on the altitude command output.
    Type: Application
    Filed: November 15, 2021
    Publication date: July 14, 2022
    Inventors: Eugene Lavretsky, Kevin Wise, Ross Gadient, Benjamin David Levine, Jasmine Beth Minteer-Levine
  • Publication number: 20220180963
    Abstract: Methods of identifying a druggable target in a subject suffering from cancer comprising determining at least one unbalanced process in the subject's expression data and selecting at least one gene and/or protein from the at least one unbalanced process wherein a drug that targets that gene or protein is known.
    Type: Application
    Filed: April 29, 2019
    Publication date: June 9, 2022
    Applicant: YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM LTD.
    Inventors: Nataly KRAVCHENKO-BALASHA, Raphael David LEVINE, Efrat FLASHNER-ABRAMSON
  • Publication number: 20210359450
    Abstract: Embodiments related to electrical connectors including superelastic components are described. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. In some embodiments, a connector includes one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Application
    Filed: July 30, 2021
    Publication date: November 18, 2021
    Applicant: Amphenol Corporation
    Inventors: Donald A. Girard, JR., Tom Pitten, Mark W. Gailus, Marc B. Cartier, JR., David Levine
  • Publication number: 20210275440
    Abstract: The invention provides microbeads comprising chitosan, a magnetic nanoparticle, and an agent, and methods for using such microbeads for the local delivery of biologically active agents to an open fracture, complex wound or other site of infection or disease.
    Type: Application
    Filed: September 27, 2017
    Publication date: September 9, 2021
    Applicant: THE UNIVERSITY OF MEMPHIS RESEARCH FOUNDATION
    Inventors: ANKITA MOHAPATRA, MICHAEL A. HARRIS, BASHIR I. MORSHED, JESSICA A. JENNINGS, JOEL BUMGARDNER, TOMOKO FUJIWARA, SANJAY R. MISHRA, DAVID A. LEVINE, GREGORY MCGRAW, WARREN O. HAGGARD
  • Patent number: 11108180
    Abstract: Electrical connectors including superelastic components. The high elastic limit of superelastic materials compared to conventional connector materials may allow for designs which provide reliable connections and high frequency operation. Superelastic components also may enable connector designs with higher densities of connections. A connector can include one or more superelastic elongated members forming the mating contacts of the connector. The superelastic elongated members may deform within one or more conductive receptacles to generate a suitable contact force. The conductive receptacles may include a plurality of protrusions arranged to deflect the superelastic elongated members during mating. A superelastic component may also be provided in a receiving portion of a connector, and may form a portion of a conductive receptacle.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: August 31, 2021
    Assignee: Amphenol Corporation
    Inventors: Donald A. Girard, Tom Pitten, Mark W. Gailus, Marc B. Cartier, Jr., David Levine
  • Publication number: 20210257788
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20210234290
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Application
    Filed: January 27, 2021
    Publication date: July 29, 2021
    Applicant: Amphenol Corporation
    Inventors: John Robert Dunham, Marc B. Cartier, JR., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20210218198
    Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Vysakh Sivarajan, Mark W. Gailus, David Levine, Michael Joseph Snyder
  • Patent number: 10965065
    Abstract: An electrical connector module with openings in an insulative support selectively positioned to limit dielectric loss in a signal. The connector may include a first and second conductor including first and second sides between first and second edges. An insulative support holds the first conductor adjacent the second conductor and may have at least five pedestal portions, wherein the first pedestal portion contacts the first side of the first conductor, the second pedestal portion contacts the second side of the first conductor, the third pedestal portion contacts the first side of the second conductor, the fourth pedestal portion contacts the second side of the second conductor, and at least a portion of the fifth pedestal portion is disposed between two edges of the first and second conductors. The pedestal portions may have widths less than the widths of the first and second sides of the first and second conductors.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: March 30, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Vysakh Sivarajan, Mark W. Gailus, David Levine, Michael Joseph Snyder
  • Publication number: 20210076486
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
    Type: Application
    Filed: October 28, 2020
    Publication date: March 11, 2021
    Applicant: Amphenol Corporation
    Inventors: Mark W. Gailus, Marc B. Cartier, JR., Vysakh Sivarajan, David Levine
  • Patent number: D908633
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: January 26, 2021
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D948454
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: April 12, 2022
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D953275
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: May 31, 2022
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Vysakh Sivarajan, John Robert Dunham, John Pitten
  • Patent number: D963912
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: September 13, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Loew, Maya Winfield, Alexsandra M. Bowers, Ryan David Hruska, Mark Siminoff, David Brett Levine, James Siminoff
  • Patent number: D969381
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: November 8, 2022
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Loew, Maya Winfield, Alexsandra M. Bowers, Ryan David Hruska, Mark D Siminoff, David Brett Levine, James Siminoff