Abstract: Systems and methods disclosed herein can be used to provide power for a non-powered rack chassis. An enclosure shaped to fit within the non-powered rack chassis may be associated with or may include a power shelf. The power shelf may have at least one busbar to distribute the power from the power shelf to one or more sleds of the non-powered rack chassis.

Abstract: Systems and methods disclosed herein can be used to supply power in a computing environment that may include a rack, multiple sleds, and a power-sharing logic. The rack may include a busbar, an alternating current (AC) input, and a plurality of rack power supply units (PSUs). The multiple sleds may include individual sled PSUs and power distribution board (PDBs). The power-sharing logic may be associated with the sled PSUs and the PDBs to allow sharing of power between the sled PSUs and through the PDBs.

Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.

Abstract: A combination tool, including a hammer portion and a ratchet wrench portion operationally connected to the hammer portion. The hammer portion has a generally circular aperture formed therethrough defining a first plane, and the ratchet wrench portion is disposed in the generally circular aperture. The ratchet wrench portion is rotatable around a first axis of rotation perpendicular to the first plane. The ratchet wrench portion further includes a rotatable socket head. The rotatable socket head is rotatable about a second axis of rotation disposed orthogonally to the first axis of rotation. The socket head has four socket faces rotatable about the second axis of rotation, each respective face defining a socket size and shape.

Abstract: A combination tool, including an elongated support member, a hammer portion operationally connected to the elongated support member, and a ratchet wrench portion operationally connected to the elongated support member and positioned opposite the hammer portion. The ratchet wrench portion has a generally circular aperture formed therethrough. The generally circular aperture defines a first plane and the ratchet assembly is disposed in the generally circular aperture. The ratchet assembly is rotatable around a first axis of rotation perpendicular to the first plane. The ratchet assembly further comprises a rotatable socket head and the rotatable socket head is rotatable about a second axis of rotation disposed orthogonally to the first axis of rotation. The socket head has socket four faces rotatable about the second axis of rotation, each respective face defining a socket size and shape.

Abstract: A power arrangement and cooling system for electronic devices includes a processing unit electrically interconnected and disposed to a first side of a printed circuit board and a power converter electrically interconnected and disposed on a second side of the printed circuit board. The power converter includes a thermally conductive material layer that transfers heat generated by the power converter during operation away from the power converter toward a heatsink that is disposed adjacent the second side of the printed circuit board. Heat generated by the processing unit is absorbed by a heatsink disposed adjacent the first side of the printed circuit board. Power for the processing unit is provided, by the power converter, through a thickness of the printed circuit board.

Abstract: An example module may include a first input power connector and a second input power connector; an input power line transfer switch circuit to connect one of the first input power connector and the second input power connector to an output power connector based on a power event; and an energy storage component to connect to a hot plug output power connector.

Abstract: An example device in accordance with an aspect of the present disclosure includes a converter to convert an input voltage to an output voltage. The converter includes an input connector that occupies greater than one third of a frontal area of the converter.

Abstract: An example device in accordance with an aspect of the present disclosure includes a converter to convert an input voltage to an output voltage. The converter includes an input connector that occupies greater than one third of a frontal area of the converter.

Abstract: Apparatus for detection of an edge of a generally disk-shaped workpiece, such as a semiconductor wafer, includes a light source positioned to direct a light beam at the surface of the workpiece near the edge thereof such that a first part of the light beam passes the workpiece and a second part of the light beam is intercepted by the workpiece. An angle between the light beam and a normal to the surface is equal to or greater than a critical angle that produces total internal reflection of the light beam in the workpiece. The apparatus further includes a mechanism for rotating the workpiece and a light sensor positioned to sense the first part of the light beam and to generate an edge signal that represents the edge of the workpiece as the workpiece is rotated. The apparatus may be used for sensing orientation and location of semiconductor wafers of different materials, including those which are transparent to the light beam.