Abstract: An apparatus has a lens assembly which has: a front region with an entrance window of the lens assembly; a window structure at the entrance window; a back region; a lens between the window structure and the back region; and a heater coupled to heat the window structure. The lens assembly includes a reflective surface. The front region is on a first side of the reflective surface. The back region is on a second side of the reflective surface. The reflective surface reflects thermal radiation generated by the heater. The reflected radiation is reflected towards the first side. Other features are also provided.

Abstract: Techniques for facilitating wide field of view (FOV) imaging systems and methods are provided. In one example, an imaging device includes a lens barrel. The lens barrel includes a first body portion including a first lens element at least partially disposed therein, a second body portion including a second lens element and a third lens element at least partially disposed therein, and a snap-fit mechanism. The first, second, and third lens elements include a lens system configured to pass electromagnetic radiation from a scene to an image capture component. The snap-fit mechanism includes a plurality of finger members extended from the first body portion and a plurality of complementary notches in the second body portion. The finger members are configured to engage with the notches to releasably secure the first body portion to the second body portion. Related methods and systems are also provided.

Abstract: Imager optical systems and methods are provided. In one example, an imaging device includes a window configured to transmit electromagnetic radiation associated with a scene. The imaging device further includes a lens system. The lens system includes a first lens element configured to receive the electromagnetic radiation from the window and transmit the electromagnetic radiation. An aperture stop is positioned between the window and a surface of the first lens element adjacent to the window. The lens system further includes a second lens element adjacent to the first lens element and configured to receive the electromagnetic radiation and direct the electromagnetic radiation to the detector array. The imaging device further includes a detector array including detectors. Each detector is configured to receive the electromagnetic radiation from the lens system and generate a thermal image based on the electromagnetic radiation. Related methods and systems are also provided.

Abstract: Techniques for facilitating wide field of view (FOV) imaging systems and methods are provided. In one example, an imaging device includes a lens system including a first lens group and a second lens group. The first lens group includes at least one spherical lens element and is associated with a first FOV. The first lens group is configured to transmit electromagnetic radiation associated with a scene. The second lens group includes wafer level optics aspherical lens elements and is associated with a second FOV narrower than the first FOV. The second lens group is configured to transmit the electromagnetic radiation received from the first lens group. The imaging device further includes a detector array including detectors. Each detector is configured to receive a portion of the electromagnetic radiation from the lens system and generate a thermal image based on the electromagnetic radiation. Related methods and systems are also provided.

Abstract: Various techniques are provided for prevent excessive accumulation of moisture onto a surface of an optical component of an imaging device. In one example, a method includes providing a bulk layer of an optical component of a thermal imaging system, wherein the bulk layer is configured to pass thermal radiation. The method further includes depositing a diamond like coating (DLC) to provide an external surface of the optical component, wherein the DLC exhibits a resistance to abrasion. The method further includes forming a plurality of nanostructures in the optical component, wherein the nanostructures exhibit a superhydrophobic property to prevent excessive moisture accumulation on the external surface of the optical component. Additional methods and systems are also provided.

Abstract: Various techniques are disclosed to provide for reducing undesired reflections in captured images. In one example, a system includes an optical element configured to pass radiation from a scene. The system also includes an imager configured to capture images in response to the scene radiation and reflect at least a portion of the scene radiation to the optical element. The optical element comprises a surface with a convex radius of curvature facing the imager and configured to receive and return the reflected radiation toward the imager in a distribution pattern to reduce a magnitude of the reflected radiation in the captured images. Additional methods, devices, and systems are also provided.

Abstract: Aspect ratio modifying imaging systems and methods are provided. In one example, an infrared imaging device includes at least one lens element configured to transmit electromagnetic radiation associated with a portion of a scene. The portion has a first aspect ratio. The electromagnetic radiation includes mid-wave and/or long-wave infrared light. The at least one lens element has a freeform surface having no translational symmetry and no rotational symmetry. The infrared imaging device further includes a detector array configured to receive image data associated with the electromagnetic radiation from the at least one lens element and generate, based on the image data, an image. The image data has a second aspect ratio different from the first aspect ratio. Each of the first and second aspect ratios is a ratio of a size along a first direction and a size along a second direction orthogonal to the first direction.

Abstract: An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.

Abstract: A method of singulating includes scribing a first scribe line on a first side of a substrate, scribing a second scribe line on a second side of the substrate, the first and second sides facing away from each other, the second scribe line being substantially parallel to the first scribe line, and simultaneously separating the substrate at the first scribe line and the second scribe line.

Abstract: A method of manufacturing lenses includes creating a wafer-level master, overmolding the wafer-level master to form a daughter replica, casting a polymer lens shapes onto a wafer using the daughter replica, transferring the polymer lens shapes into the wafer, and singulating the wafer to create individual dies with a lens thereon. The wafer may be silicon, e.g., silicon having a resistivity between 0.1 and 100 ?cm.

Abstract: An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.

Abstract: A method of singulating includes scribing a first scribe line on a first side of a substrate, scribing a second scribe line on a second side of the substrate, the first and second sides facing away from each other, the second scribe line being substantially parallel to the first scribe line, and simultaneously separating the substrate at the first scribe line and the second scribe line.

Abstract: A method of manufacturing lenses includes creating a wafer-level master, overmolding the wafer-level master to form a daughter replica, casting a polymer lens shapes onto a wafer using the daughter replica, transferring the polymer lens shapes into the wafer, and singulating the wafer to create individual dies with a lens thereon. The wafer may be silicon, e.g., silicon having a resistivity between 0.1 and 100 ?cm.

Abstract: In one aspect, the present invention provides a wafer level optical assembly comprising a first wafer level optical element, the first wafer level optical element comprising a first alignment structure and a second wafer level optical element, the second wafer level optical element comprising a second alignment structure, wherein the first alignment structure contacts the second alignment structure.

Abstract: A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces of each microelectronic element extending beyond the respective first edges. The insulating region can define first and second side surfaces adjacent the first and second edges of the microelectronic elements. A plurality of spaced apart openings can extend along a side surface of the microelectronic assembly. Electrical conductors connected with respective traces can have portions disposed in respective openings and extending along the respective openings. The electrical conductors may extend to pads or solder balls overlying a face of one of the microelectronic elements.

Abstract: A chip-sized, wafer level packaged device including a portion of a semiconductor wafer including a device, at least one packaging layer containing silicon and formed over the device, a first ball grid array formed over a surface of the at least one packaging layer and being electrically connected to the device and a second ball grid array formed over a surface of the portion of the semiconductor wafer and being electrically connected to the device.

Abstract: A chip-sized, wafer level packaged device including a portion of a semiconductor wafer including a device, at least one packaging layer containing silicon and formed over the device, a first ball grid array formed over a surface of the at least one packaging layer and being electrically connected to the device and a second ball grid array formed over a surface of the portion of the semiconductor wafer and being electrically connected to the device.

Abstract: A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces of each microelectronic element extending beyond the respective first edges. The insulating region can define first and second side surfaces adjacent the first and second edges of the microelectronic elements. A plurality of spaced apart openings can extend along a side surface of the microelectronic assembly. Electrical conductors connected with respective traces can have portions disposed in respective openings and extending along the respective openings. The electrical conductors may extend to pads or solder balls overlying a face of one of the microelectronic elements.

Abstract: A chip-sized, wafer level packaged device including a portion of a semiconductor wafer including a device, at least one packaging layer containing silicon and formed over the device, a first ball grid array formed over a surface of the at least one packaging layer and being electrically connected to the device and a second ball grid array formed over a surface of the portion of the semiconductor wafer and being electrically connected to the device.

Abstract: A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces of each microelectronic element extending beyond the respective first edges. The insulating region can define first and second side surfaces adjacent the first and second edges of the microelectronic elements. A plurality of spaced apart openings can extend along a side surface of the microelectronic assembly. Electrical conductors connected with respective traces can have portions disposed in respective openings and extending along the respective openings. The electrical conductors may extend to pads or solder balls overlying a face of one of the microelectronic elements.