Abstract: The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.

Abstract: A method includes performing operations as follows on a processor: initiating an outgoing connection to the communication session, establishing communication with a client device via the communication session, providing the client device with access to content that is stored at a remote storage location separate from the client device, and authorizing a modification to the content at the remote storage location via the client device.

Abstract: The invention provides novel articles of composite materials having hollow interior channels or passageways, or otherwise being hollowed out, and formulations and methods for their manufacture and uses. These hollow core objects are suitable for a variety of applications in construction, pavements and landscaping, and infrastructure.

Abstract: A method includes performing operations as follows on a processor: initiating an outgoing connection to the communication session, establishing communication with a client device via the communication session, providing the client device with access to content that is stored at a remote storage location separate from the client device, and authorizing a modification to the content at the remote storage location via the client device.

Abstract: A stacked die system (10) has a first die (16) having a first surface with active circuitry, a second die (18) having a first surface with active circuitry, and a conductive shield (28) interposed between the first surface of the first die and the first surface of the second die. In one embodiment, the distance between the first surfaces of the first and second die is less than one millimeter. The stacked die system may also include a package substrate (12) where the active circuitry of the first and second die are electrically connected to the package substrate. The electrical connections may be formed using wire bonds (56, 58, 60, 62). Alternatively, the first die may be connected to the package substrate in a flip chip configuration. In one embodiment, the active circuitry of the first die generates RF signals where the shield helps protect the RF signals from interference caused by the active circuitry of the second die.

Abstract: A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant. A second packaged IC may be stacked onto the first packaged IC. The second packaged IC includes at least one IC die and a plurality of conductive members, each conductive member of the plurality of conductive members of the second packaged IC is in contact with a corresponding conductive member of the plurality conductive members of the first packaged IC.

Abstract: A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant. A second packaged IC may be stacked onto the first packaged IC. The second packaged IC includes at least one IC die and a plurality of conductive members, each conductive member of the plurality of conductive members of the second packaged IC is in contact with a corresponding conductive member of the plurality conductive members of the first packaged IC.

Abstract: A method for testing a semiconductor structure having a set of top-side connections and having a set of bottom-side connections is provided. The method may include providing a device socket for connecting the set of top-side connections and the set of bottom-side connections to a tester. The method may further include providing a device hood for connecting the set of top-side connections to a respective first end of each of a plurality of interconnects in the device hood, wherein a second end of each of the plurality of interconnects in the device hood connects the set of top-side connections to the device socket. The method may further include testing the semiconductor structure using the tester. The semiconductor structure may include at least one integrated circuit to be tested.

Abstract: Frames and attachments thereto and methods of use thereof for the support and/or releasable securing of cargo and/or cargo containers upon and/or to cargo containers and/or cargo container transports and/or lifting devices. Linking frame (10) may be used upon and/or beneath containers that possess insufficient mutually corresponding mounting-points to otherwise enable them to be vertically stacked and secured together. Parallel longitudinal beams (11) are joined by shorter lateral beams (12). Attached directly or indirectly, protruding outward the outer side surfaces of said framework, are connectors (13) able to correspond upwardly and/or downwardly with various mounting-point layouts as provided upon the surfaces of cargo transport equipment.

Abstract: A stacked die system (10) has a first die (16) having a first surface with active circuitry, a second die (18) having a first surface with active circuitry, and a conductive shield (28) interposed between the first surface of the first die and the first surface of the second die. In one embodiment, the distance between the first surfaces of the first and second die is less than one millimeter. The stacked die system may also include a package substrate (12) where the active circuitry of the first and second die are electrically connected to the package substrate. The electrical connections may be formed using wire bonds (56, 58, 60, 62). Alternatively, the first die may be connected to the package substrate in a flip chip configuration. In one embodiment, the active circuitry of the first die generates RF signals where the shield helps protect the RF signals from interference caused by the active circuitry of the second die.

Abstract: Frames and attachments thereto and methods of use thereof for the support and/or releasable securing of cargo and/or cargo containers upon and/or to cargo containers and/or cargo container transports and/or lifting devices. Linking frame (10) may be used upon and/or beneath containers that possess insufficient mutually corresponding mounting-points to otherwise enable them to be vertically stacked and secured together. Parallel longitudinal beams (11) are joined by shorter lateral beams (12). Attached directly or indirectly, protruding outward the outer side surfaces of said framework, are connectors (13) able to correspond upwardly and/or downwardly with various mounting-point layouts as provided upon the surfaces of cargo transport equipment.

Abstract: A digital data scrambler and descrambler for m parallel synchronized digital data streams, where m is an integer greater than one, is disclosed. The scrambler and descrambler each include m linear sequential filters, each of the m filters being associated with a different one of the m data streams. Each of the scrambler filters include a feedback path and tapping connections to the feedback path and each of the descrambler filters include a feedforward path and tapping connections to the feedforward path. The nature and location of the tapping connections of both the scrambler and descrambler filters are determined in accordance with a polynomial expression which is the same for a matched scrambler and descrambler.