Abstract: A method for manufacturing a bulk acoustic wave resonator, each resonator including: above a substrate, a piezoelectric resonator, and next to the piezoelectric resonator, a contact pad connected to an electrode of the piezoelectric resonator; and, between the piezoelectric resonator and the substrate, a Bragg mirror including at least one conductive layer extending between the pad and the substrate and at least one upper silicon oxide layer extending between the pad and the substrate, the method including the steps of: depositing the upper silicon oxide layer; and decreasing the thickness unevenness of the upper silicon oxide layer due to the deposition method, so that this layer has a same thickness to within better than 2%, and preferably to within better than 1%, at the level of each pad.

Abstract: A method of adjustment in the manufacture of a capacitance of a capacitor supported by a substrate, the method including the steps of: a) forming a first electrode parallel to the surface of the substrate and covering it with a dielectric layer; b) forming, on a first portion of the dielectric layer, a second electrode; c) measuring the capacitance between the first electrode and the second electrode, and deducing therefrom the capacitance to be added to obtain the desired capacitance; d) thinning down a second portion of the dielectric layer, which is not covered by the second electrode, so that the thickness of this second portion is adapted to the forming of the deduced capacitance; and e) forming a third electrode on the thinned-down portion and connecting it to the second electrode.

Abstract: A method for manufacturing a wafer on which are formed resonators, each resonator including, above a semiconductor substrate, a stack of layers including, in the following order from the substrate surface: a Bragg mirror; a compensation layer made of a material having a temperature coefficient of the acoustic velocity of a sign opposite to that of all the other stack layers; and a piezoelectric resonator, the method including the successive steps of: a) depositing the compensation layer; and b) decreasing thickness inequalities of the compensation layer due to the deposition method, so that this layer has a same thickness to within better than 2%, and preferably to within better than 1%, at the level of each resonator.

Abstract: A resonant device including a stack of a first metal layer, a piezoelectric material layer, and a second metal layer formed on a silicon substrate, a cavity being formed in depth in the substrate, the thickness of the silicon above the cavity having at least a first value in a first region located opposite to the center of the stack, having a second value in a second region located under the periphery of the stack and having at least a third value in a third region surrounding the second region, the second value being greater than the first and the third values.

Abstract: A coupling for connecting double-walled fuel comprises a pipe end fitting (1), which includes a male outer surface for example including a groove (12) and a female inner surface for example including a groove (11). The coupling also includes a double-walled socket (4), which includes a female outer socket (17) and a male inner shaft (18). The pipe end fitting is partially accommodated in the region between the female outer socket and the male inner shaft of the double-walled socket. A first seal ring (9) seals between the female inner surface of the pipe end fitting (1) and the male inner shaft (18) of the double-walled socket (4). A second seal ring (10) which may be substantially coplanar with the first, seals between the male outer surface of the pipe end fitting (1) and the female outer socket (17) of the double-walled socket (4).

Abstract: A portable self-contained testing apparatus is provided for accurately determining the stopping time of a press after the initiating of a STOP signal. The apparatus includes a detector head, a stationary grid, a synchronizing touch switch, and a control box with a digital readout. The detector head is mounted on the press ram to be movable therewith while the stationary grid member is mounted proximate to the detector to allow the detector to scan the grid lines on the grid as the ram moves. The touch switch is used to initiate the press STOP control signal and provides a signal to the control box to initiate grid count by the detector head whenever the press STOP signal is initiated through the touch switch. The control box has circuitry to convert the grid count signals from the detector head and the press STOP signals from the touch switch to a digital readout of the time required for the press to actually stop after the initiation of the press STOP signal.