Patents by Inventor David Richard Esler

David Richard Esler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210407878
    Abstract: A device comprises: a high temperature semiconductor device comprising a first surface, wherein the high temperature semiconductor device comprises an active area and a termination area disposed adjacent to the active area; an inorganic dielectric insulating layer disposed on the first surface, wherein the inorganic dielectric insulating layer fills a volume extending over an entirety of the termination area and comprises a thickness greater than or equal to 25 ?m and less than or equal to 500 ?m; and an electrical connector connecting the active area of the high temperature semiconductor device to an additional component of the device.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 30, 2021
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: David Richard Esler, Emad A. Andarawis
  • Publication number: 20210325348
    Abstract: A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 21, 2021
    Applicant: General Electric Company
    Inventors: Joseph Alfred Iannotti, Christopher James Kapusta, David Richard Esler
  • Patent number: 11079359
    Abstract: A system includes a structure bonding layer and a sensor. The structure bonding layer is disposed on a structure. The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: August 3, 2021
    Assignee: General Electric Company
    Inventors: Joseph Alfred Iannotti, Christopher James Kapusta, David Richard Esler
  • Publication number: 20210183808
    Abstract: A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A re-metalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the re-metalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 17, 2021
    Inventors: David Richard Esler, Nancy Cecelia Stoffel
  • Patent number: 10892237
    Abstract: Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: January 12, 2021
    Assignee: General Electric Company
    Inventors: Stephen Daley Arthur, Liangchun Yu, Nancy Cecelia Stoffel, David Richard Esler, Christopher James Kapusta
  • Publication number: 20200194388
    Abstract: Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 18, 2020
    Inventors: Stephen Daley Arthur, Liangchun Yu, Nancy Cecelia Stoffel, David Richard Esler, Christopher James Kapusta
  • Publication number: 20200194387
    Abstract: A semiconductor device is provided. The semiconductor device includes an electric field (E-field) suppression layer formed over a termination region. The E-field suppression layer is patterned with openings over metal contact areas. The E-field suppression layer has a thickness such that an electric field strength above the E-field suppression layer is below a dielectric strength of an adjacent material when the semiconductor device is operating at or below a maximum voltage.
    Type: Application
    Filed: December 14, 2018
    Publication date: June 18, 2020
    Inventors: Stephen Daley Arthur, Liangchun Yu, Nancy Cecelia Stoffel, David Richard Esler, Christopher James Kapusta
  • Publication number: 20200124573
    Abstract: A system includes a structure bonding layer and a sensor. The structure bonding layer is disposed on a structure. The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Inventors: Joseph Alfred Iannotti, Christopher James Kapusta, David Richard Esler
  • Patent number: 10605785
    Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: March 31, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Joseph Iannotti, Christopher James Kapusta, David Richard Esler
  • Publication number: 20180356368
    Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
    Type: Application
    Filed: June 7, 2017
    Publication date: December 13, 2018
    Inventors: Joseph Iannotti, Christopher James Kapusta, David Richard Esler
  • Patent number: 9417048
    Abstract: A capacitive sensor device and a method of manufacture are provided. The capacitive sensor device includes at least one sensor tip that includes an electrode positioned at a first end of the sensor tip, and a stem member coupled to the electrode and extending toward a second end of the sensor tip. The device also includes a coaxial cable including a center conductor, the center conductor coupled to the sensor tip at the second end, and an insulation layer supporting the sensor tip between the first and second ends. The insulation layer includes a metallization on a portion surrounding the second end of the sensor tip. The device further includes a casing surrounding a portion of the coaxial cable, the metallization, and the coupling of the center conductor and the sensor tip, wherein a braze joint is formed between the casing and the metallization to form a hollow, hermetic cavity.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: August 16, 2016
    Assignee: General Electric Company
    Inventors: David Richard Esler, Emad Andarawis Andarawis, Wayne Charles Hasz, Mahadevan Balasubramaniam
  • Patent number: 8970228
    Abstract: A radial clearance measurement system is provided. The radial clearance measurement system comprises a radial clearance sensor that is relatively insensitive to axial movement of an object rotating relative to the radial clearance sensor. In one embodiment, the radial clearance sensor includes an electrode having a relatively constant overlap area over the range of axial movement of the object.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: March 3, 2015
    Assignee: General Electric Company
    Inventors: Emad Andarawis Andarawis, Wayne Charles Hasz, Mahadevan Balasubramaniam, David Richard Esler
  • Patent number: 8853550
    Abstract: A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: October 7, 2014
    Assignee: General Electric Company
    Inventors: Arun Virupaksha Gowda, Kevin Matthew Durocher, James Wilson Rose, Paul Jeffrey Gillespie, Richard Alfred Beaupre, David Richard Esler
  • Publication number: 20140270650
    Abstract: An optical subassembly and method of manufacturing an optical subassembly are provided. One subassembly includes a base, an optical emitter attached to the base and one or more spacers attached to the base surrounding at least a portion of the optical emitter. The optical subassembly further includes a ferrule sleeve attached to the base with the optical emitter and one or more spacers within the ferrule sleeve, wherein the ferrule sleeve is configured to receive an optical fiber therein. The optical subassembly also includes one or more reinforcement members attached to the base adjacent the ferrule sleeve and configured to provide support to the ferrule sleeve.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Ansas Matthias Kasten, Sora Kim, David Richard Esler, Jim Grecco
  • Patent number: 8829840
    Abstract: A condition monitoring method for an electrical machine is provided. The method includes providing at least one first sensor element embedded in or disposed on at least one substrate element located in a stator core for obtaining a first set of data. The method also includes providing at least one second sensor element for obtaining a second set of data from the electrical machine. Further, the method includes generating signals indicative of changes in characteristics of the first sensor element based on the second set of data. Finally, the method includes refining the first set of data by combining the first set of data with the generated signals.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: September 9, 2014
    Assignee: General Electric Company
    Inventors: Emad Andarawis Andarawis, Ertugrul Berkcan, Brock Matthew Lape, David Richard Esler
  • Publication number: 20140119884
    Abstract: A capacitive sensor device and a method of manufacture are provided. The capacitive sensor device includes at least one sensor tip that includes an electrode positioned at a first end of the sensor tip, and a stem member coupled to the electrode and extending toward a second end of the sensor tip. The device also includes a coaxial cable including a center conductor, the center conductor coupled to the sensor tip at the second end, and an insulation layer supporting the sensor tip between the first and second ends. The insulation layer includes a metallization on a portion surrounding the second end of the sensor tip. The device further includes a casing surrounding a portion of the coaxial cable, the metallization, and the coupling of the center conductor and the sensor tip, wherein a braze joint is formed between the casing and the metallization to form a hollow, hermetic cavity.
    Type: Application
    Filed: October 31, 2012
    Publication date: May 1, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: David Richard Esler, Emad Andarawis Andarawis, Wayne Charles Hasz, Mahadevan Balasubramaniam
  • Publication number: 20130321000
    Abstract: A radial clearance measurement system is provided. The radial clearance measurement system comprises a radial clearance sensor that is relatively insensitive to axial movement of an object rotating relative to the radial clearance sensor. In one embodiment, the radial clearance sensor includes an electrode having a relatively constant overlap area over the range of axial movement of the object.
    Type: Application
    Filed: May 31, 2012
    Publication date: December 5, 2013
    Applicant: General Electric Company
    Inventors: Emad Andarawis Andarawis, Wayne Charles Hasz, Mahadevan Balasubramaniam, David Richard Esler
  • Patent number: 8536878
    Abstract: A sensor system for measuring a clearance parameter between a stationary component and a rotating component of a rotating machine is provided. The system includes a clearance sensor to output a clearance measurement signal. A sensor memory is attached to the sensor for storing a first sensor information. A second sensor information is stored in a electronics interface memory. The first and the second sensor information are read and the clearance sensor is matched with a respective plurality of calibration data by an electronic interface based on the first and the second sensor information.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: September 17, 2013
    Assignee: General Electric Company
    Inventors: Emad Andarawis Andarawis, Wayne Charles Hasz, David So Keung Chan, David Mulford Shaddock, John Harry Down, Samhita Dasgupta, David Walter Parry, David Richard Esler, Zhiyuan Ren, Mahadevan Balasubramaniam, Cheryl Herron
  • Publication number: 20120274258
    Abstract: A condition monitoring method for an electrical machine is provided. The method includes providing at least one first sensor element embedded in or disposed on at least one substrate element located in a stator core for obtaining a first set of data. The method also includes providing at least one second sensor element for obtaining a second set of data from the electrical machine. Further, the method includes generating signals indicative of changes in characteristics of the first sensor element based on the second set of data. Finally, the method includes refining the first set of data by combining the first set of data with the generated signals.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 1, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Emad Andarawis Andarawis, Ertugrul Berkcan, Brock Matthew Lape, David Richard Esler
  • Patent number: 8272246
    Abstract: Self-calibration of a multiple channel clearance sensor system, which in one embodiment includes at least one sensor for measuring at least one clearance parameter signal between a stationary object and a rotating object of a rotating machine. The sensor output is processed as a clearance parameter by an offset correction section configured to determine an offset error in the clearance parameter signal which is used by a level shifter. The level shifter is also switchably coupled to the clearance parameter signal wherein the output of the level shifter, which may be amplified and digitally converted, is processed by a signal level analyzer to determine a channel gain signal.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: September 25, 2012
    Assignee: General Electric Company
    Inventors: Emad Andarawis Andarawis, Wayne Charles Hasz, David So Keung Chan, David Mulford Shaddock, John Harry Down, Samhita Dasgupta, David Richard Esler, Zhiyuan Ren, Mahadevan Balasubramaniam, Ibrahim Issoufou Kouada