Abstract: Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.

Abstract: The present disclosure relates to systems and methods directed to alignment of light-emitting devices. An example method includes coupling a support substrate to a light guide assembly. The support substrate includes a plurality of elongate structures and a plurality of laser diodes. Each laser diode of the plurality of laser diodes is coupled to a respective elongate structure of the plurality of elongate structures. The method also includes causing a given laser diode of the plurality of laser diodes to emit light toward the light guide assembly. The light guide assembly includes a light guide manifold configured to guide at least a portion of the emitted light as transmitted light. The method additionally includes comparing at least one optical characteristic of the transmitted light to a desired optical characteristic and, based on the comparison, adjusting a position of the given laser diode by adjusting the respective elongate structure.

Abstract: The present disclosure relates to optical systems and methods for their manufacture. An example system includes a first substrate that has at least one bridge structure. The bridge structure has a first surface with one or more light-emitter devices disposed on it. The system also includes a second substrate that has a mounting surface that defines a reference plane. The second substrate includes a structure and an optical spacer on the mounting surface. The first and second substrates are coupled together such that the first surface of the first substrate faces the second substrate at an angle with respect to the reference plane. The system also includes at least one spacer coupled to the mounting surface. The at least one spacer is in physical contact with the one or more light-emitter devices.

Abstract: The present disclosure relates to systems and methods that provide information about a scene based on a time-of-flight (ToF) sensor and a structured light pattern. In an example embodiment, a sensor system could include at least one ToF sensor configured to receive light from a scene. The sensor system could also include at least one light source configured to emit a structured light pattern and a controller that carries out operations. The operations include causing the at least one light source to illuminate at least a portion of the scene with the structured light pattern and causing the at least one ToF sensor to provide information indicative of a depth map of the scene based on the structured light pattern.

Abstract: Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.

Abstract: The present disclosure relates to optical systems and methods for their manufacture. An example system includes a first substrate that has at least one bridge structure. The bridge structure has a first surface with one or more light-emitter devices disposed on it. The system also includes a second substrate that has a mounting surface that defines a reference plane. The second substrate includes a structure and an optical spacer on the mounting surface. The first and second substrates are coupled together such that the first surface of the first substrate faces the second substrate at an angle with respect to the reference plane. The system also includes at least one spacer coupled to the mounting surface. The at least one spacer is in physical contact with the one or more light-emitter devices.

Abstract: Example embodiments relate to arrays of light detectors with a corresponding array of optical elements. An example embodiment includes a light detection and ranging (LIDAR) system. The LIDAR system includes an array of light detectors. The LIDAR system also includes a shared imaging optic. Further, the LIDAR system includes an array of optical elements positioned between the shared imaging optic and the array of light detectors. Each light detector in the array of light detectors is configured to detect a respective light signal from a respective region of a scene. Each respective light signal is transmitted via the shared imaging optic and modified by a respective optical element in the array of optical elements based on at least one aspect of the scene.

Abstract: The present disclosure relates to systems and methods that provide both an image of a scene and depth information for the scene. An example system includes at least one time-of-flight (ToF) sensor and an imaging sensor. The ToF sensor and the imaging sensor are configured to receive light from a scene. The system also includes at least one light source and a controller that carries out operations. The operations include causing the at least one light source to illuminate at least a portion of the scene with illumination light according to an illumination schedule. The operations also include causing the at least one ToF sensor to provide information indicative of a depth map of the scene based on the illumination light. The operations additionally include causing the imaging sensor to provide information indicative of an image of the scene based on the illumination light.

Abstract: Optical output beams from a vertical stack of diode-laser bars are focused by a simple focusing lens on an optical axis of the lens. The optical output beams from outlying diode-laser bars in the vertical stack are tilted with respect to the optical axis of the focusing lens such that optical output from the whole vertical stack is brought to a common focus location on the optical axis of the focusing lens.

Abstract: Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.

Abstract: The present disclosure relates to optical systems and methods for their manufacture. An example system includes a first substrate that has at least one bridge structure. The bridge structure has a first surface with one or more light-emitter devices disposed on it. The system also includes a second substrate that has a mounting surface that defines a reference plane. The second substrate includes a structure and an optical spacer on the mounting surface. The first and second substrates are coupled together such that the first surface of the first substrate faces the second substrate at an angle with respect to the reference plane. The system also includes at least one spacer coupled to the mounting surface. The at least one spacer is in physical contact with the one or more light-emitter devices.

Abstract: The present disclosure relates to optical systems and methods for their manufacture. An example system includes a first substrate that has at least one bridge structure. The bridge structure has a first surface with one or more light-emitter devices disposed on it. The system also includes a second substrate that has a mounting surface that defines a reference plane. The second substrate includes a structure and an optical spacer on the mounting surface. The first and second substrates are coupled together such that the first surface of the first substrate faces the second substrate at an angle with respect to the reference plane. The system also includes at least one spacer coupled to the mounting surface. The at least one spacer is in physical contact with the one or more light-emitter devices.

Abstract: A diode-laser assembly having an electrically isolated diode-laser bar on a cooled base-element is disclosed. The diode-laser bar is electrically isolated from the base-element and electrically isolated from any coolant water, thereby eliminating the need for de-ionized water and mitigating corrosion due to galvanic action. Multiple such diode-laser assemblies are stackable, with small bar-to-bar pitch, enabling a high-current and high-brightness diode-laser stack.

Abstract: Optical output beams from a vertical stack of diode-laser bars are focused by a simple focusing lens on an optical axis of the lens. The optical output beams from outlying diode-laser bars in the vertical stack are tilted with respect to the optical axis of the focusing lens such that optical output from the whole vertical stack is brought to a common focus location on the optical axis of the focusing lens.

Abstract: A diode-laser assembly having an electrically isolated diode-laser bar on a cooled base-element is disclosed. The diode-laser bar is electrically isolated from the base-element and electrically isolated from any coolant water, thereby eliminating the need for de-ionized water and mitigating corrosion due to galvanic action. Multiple such diode-laser assemblies are stackable, with small bar-to-bar pitch, enabling a high-current and high-brightness diode-laser stack.

Abstract: A water-cooled heat-sink for a diode-laser bar includes a copper-cooling-unit having an integral mount thereon for the diode-laser bar. The copper-cooling-unit is attached to a steel base-unit. The base-unit and the cooling-unit are cooperatively configured such that at least one cooling-channel is formed in the cooling-unit by the attachment of the base-unit to the cooling-unit. The cooling-channel is positioned to cool the mount when cooling-water flows through the cooling-channel.

Abstract: Laser treatment apparatus includes one diode-laser providing infrared radiation for the treatment and another diode-laser for providing visible radiation. A lens launches the infrared and visible radiations from the diode-lasers into the entrance face of the optical fiber for transporting the radiations to a treatment location.

Abstract: A water-cooled heat-sink for a diode-laser bar includes a copper-cooling-unit having an integral mount thereon for the diode-laser bar. The copper-cooling-unit is attached to a steel base-unit. The base-unit and the cooling-unit are cooperatively configured such that at least one cooling-channel is formed in the cooling-unit by the attachment of the base-unit to the cooling-unit. The cooling-channel is positioned to cool the mount when cooling-water flows through the cooling-channel.

Abstract: A diode-laser bar is mounted on water-cooled heat-sink between two ceramic sub-mounts for electrically isolating cooling-water in the heat-sink from the diode-laser bar. Mounting between the two ceramic sub-mounts also provides for balancing stresses due to differences in coefficient of thermal expansion (CTE) between the sub-mounts and the diode-laser bar. Both sub-mounts are in thermal communication with the heat-sink for providing two-sided cooling of the diode-laser bar.

Abstract: A water-cooled heat-sink for a diode-laser bar includes a copper-cooling-unit having an integral mount thereon for the diode-laser bar. The copper-cooling-unit is attached to a steel base-unit. The base-unit and the cooling-unit are cooperatively configured such that at least one cooling-channel is formed in the cooling-unit by the attachment of the base-unit to the cooling-unit. The cooling-channel is positioned to cool the mount when cooling-water flows through the cooling-channel.