Patents by Inventor David Tumpold

David Tumpold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12461019
    Abstract: A MEMS photoacoustic gas sensor includes a first membrane and a second membrane opposing the first membrane and spaced apart from the first membrane by a sensing volume. The MEMS photoacoustic gas sensor includes an electromagnetic source and communication with the sensing volume to deflect the first membrane and the second membrane.
    Type: Grant
    Filed: October 6, 2022
    Date of Patent: November 4, 2025
    Assignee: Infineon Technologies AG
    Inventors: Johannes Manz, Christoph Glacer, David Tumpold
  • Publication number: 20250102422
    Abstract: In accordance with an embodiment, a semiconductor device includes: a radiator comprising a radiation layer configured to radiate an electromagnetic wave; a detector comprising a detection layer configured to detect the electromagnetic wave; a substrate; and an interface layer arranged between the radiator or the detector and the substrate, where a thermal conductivity of the radiator or the detector is different from a thermal conductivity of the interface layer.
    Type: Application
    Filed: September 10, 2024
    Publication date: March 27, 2025
    Inventors: Michael Hauff, David Tumpold, Tobias Mittereder, Mohammadamir Ghaderi, Stefan Hampl, Alfred Sigl, Sebastian Schwagerl
  • Publication number: 20250060338
    Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.
    Type: Application
    Filed: November 6, 2024
    Publication date: February 20, 2025
    Inventors: Derek Debie, Klaus Elian, Ludwig Heitzer, David Tumpold, Jens Pohl, Cyrus Ghahremani, Thorsten Meyer, Christian Geissler, Andreas Allmeier
  • Patent number: 12196589
    Abstract: A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: January 14, 2025
    Assignee: Infineon Technologies AG
    Inventors: Martin Seidl, Christian Bretthauer, Wolfgang Klein, Ulrich Krumbein, David Tumpold
  • Patent number: 12158448
    Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: December 3, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Derek Debie, Klaus Elian, Ludwig Heitzer, David Tumpold, Jens Pohl, Cyrus Ghahremani, Thorsten Meyer, Christian Geissler, Andreas Allmeier
  • Publication number: 20240288363
    Abstract: A package for an optical radiation device comprises a base structure having arranged thereon an optical radiation device, an optically transparent lid element bonded to the base structure defining a cavity between the base structure and the lid element, and a bond structure in a bonding region between the base structure and the lid element, wherein the bond structure is arranged to provide an adhesive bond between the base structure and the lid element, and wherein the bond structure comprises a diffusion layer having a gas diffusive material or gas diffusive structure for providing a gas diffusion path between the cavity and the surrounding atmosphere.
    Type: Application
    Filed: February 20, 2024
    Publication date: August 29, 2024
    Inventors: Christoph Glacer, Ulrich Krumbein, Tobias Mittereder, Mark Pavier, Siyuan Qi, Hugh Richard, David Tumpold, Paul Westmarland
  • Publication number: 20240255450
    Abstract: A fluid sensor detects a target fluid and comprises thermal radiation emitters emitting a broadband thermal radiation, a waveguide structure guiding the thermal radiation comprising an evanescent field component, an optical filter structure coupled to the waveguide structure to provide a filtered thermal radiation having a center wavelength, a thermal radiation detector configured to provide a detector output signal based on a radiation strength of the filtered thermal radiation, and an actuation device for connecting the plurality of thermal radiation emitters with a power source such that the plurality of thermal radiation emitters has an operating temperature between 400 to 1300 K.
    Type: Application
    Filed: January 23, 2024
    Publication date: August 1, 2024
    Inventors: Thomas Grille, Gerald Stocker, Thomas Krotscheck Ostermann, Pooja Thakkar, David Tumpold, Reyhaneh Jannesari
  • Patent number: 12030021
    Abstract: The present disclosure concerns a micromechanical device and a method for manufacturing the same. The micromechanical device may comprise a membrane structure suspended on a substrate. The membrane structure may comprise a perforated gas permeable membrane comprising a plurality of perforations, and a reinforcement structure being coupled with the perforated membrane for stiffening the perforated membrane and/or for increasing the mechanical stability of the perforated membrane in order to attenuate an oscillation of the perforated membrane.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: July 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Abidin Güçlü Onaran, David Tumpold
  • Publication number: 20240166495
    Abstract: A MEMS device comprises a suspended membrane structure having an inner membrane section and an outer membrane section. The outer membrane section surrounds the inner membrane section. The membrane structure comprises an elastically deformable spring structure in the outer membrane section, such that the spring structure is arranged to convert a thermal-induced compressive stress in the suspended membrane structure into a spring displacement.
    Type: Application
    Filed: November 20, 2023
    Publication date: May 23, 2024
    Inventors: Mohammadamir Ghaderi, David Tumpold
  • Patent number: 11962973
    Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: April 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Christian Bretthauer, David Tumpold, Pradyumna Mishra, Daniel Neumaier
  • Patent number: 11788990
    Abstract: A system for measuring gas concentration includes a package having a cavity and a port, a photoacoustic gas sensor device within the package, and a Micro Electro Mechanical System (“MEMS”) valve separate from the photoacoustic gas sensor device placed over the port of the package and to allow ambient gas diffusion into the cavity in a first mode of operation, and to prevent ambient gas diffusion into the cavity and to acoustically isolate the cavity in a second mode of operation.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: October 17, 2023
    Assignee: Infineon Technologies AG
    Inventors: Johannes Manz, Wolfgang Klein, David Tumpold
  • Patent number: 11693021
    Abstract: A MEMS vibration sensor includes a piezoelectric membrane including a segmented electrode affixed to a holder; and an inertial mass affixed to the piezoelectric membrane, wherein the segmented electrode includes four segmentation zones, wherein, in an X-direction, a signal from a first segmentation zone is equal to a signal from a third segmentation zone, a signal from a second segmentation zone is equal to a signal from a fourth segmentation zone, and the signal from the first segmentation zone and the signal from the second segmentation zone have opposite signs, and wherein, in a Y-direction, a signal from the first segmentation zone is equal to the signal from the second segmentation zone, the signal from the third segmentation zone is equal to the signal from the fourth segmentation zone, and the signal from first segmentation zone and the signal from the third segmentation zone have opposite signs.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: July 4, 2023
    Assignee: Infineon Technologies AG
    Inventors: Somu Goswami, Christian Bretthauer, Matthias Friedrich Herrmann, Gunar Lorenz, Pradyumna Mishra, Daniel Neumaier, David Tumpold
  • Publication number: 20230194478
    Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.
    Type: Application
    Filed: October 27, 2022
    Publication date: June 22, 2023
    Inventors: Derek Debie, Klaus Elian, Ludwig Heitzer, David Tumpold, Jens Pohl, Cyrus Ghahremani, Thorsten Meyer, Christian Geissler, Andreas Allmeier
  • Publication number: 20230188899
    Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
    Type: Application
    Filed: February 6, 2023
    Publication date: June 15, 2023
    Inventors: Christian Bretthauer, David Tumpold, Pradyumna Mishra, Daniel Neumaier
  • Publication number: 20230160732
    Abstract: A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.
    Type: Application
    Filed: December 13, 2022
    Publication date: May 25, 2023
    Inventors: Martin Seidl, Christian Bretthauer, Wolfgang Klein, Ulrich Krumbein, David Tumpold
  • Patent number: 11617232
    Abstract: An emitter structure includes a substrate with a membrane arrangement. The membrane arrangement includes at least one first membrane, a first heating path and a second heating path in different substrate planes. The first heating path and the second heating path are positioned with respect to one another such that a projection of the first heating path and a projection of the second heating path onto a common plane lie at least partly next to one another in the common plane.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: March 28, 2023
    Assignee: Infineon Technologies AG
    Inventors: David Tumpold, Sebastian Anzinger, Christoph Glacer
  • Patent number: 11611835
    Abstract: A MicroElectroMechanical Structure (MEMS) accelerometer includes a piezoelectric membrane including at least one electrode and an inertial mass, the piezoelectric membrane being affixed to a holder; and a circuit for evaluating sums and differences of signals associated with the at least one electrode to determine a three-dimensional acceleration direction, wherein the at least one electrode includes a segmented electrode, and wherein the segmented electrode includes four segmentation zones.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: March 21, 2023
    Assignee: Infineon Technologies AG
    Inventors: Christian Bretthauer, Pradyumna Mishra, Daniel Neumaier, David Tumpold
  • Patent number: 11604171
    Abstract: A fluid sensor includes a housing structure forming a cavity for an IR emitter for emitting an IR radiation in the cavity, wherein the IR radiation has a center wavelength for providing an interaction of the IR radiation with the target fluid resulting in a temperature change in the cavity or in the housing structure, which effects a mechanical pulse in the housing structure, and an inertial detection sensor mechanically coupled to the housing structure for sensing the mechanical pulse in the housing structure.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: March 14, 2023
    Assignee: Infineon Technologies AG
    Inventor: David Tumpold
  • Publication number: 20230033615
    Abstract: A MEMS photoacoustic gas sensor includes a first membrane and a second membrane opposing the first membrane and spaced apart from the first membrane by a sensing volume. The MEMS photoacoustic gas sensor includes an electromagnetic source and communication with the sensing volume to deflect the first membrane and the second membrane.
    Type: Application
    Filed: October 6, 2022
    Publication date: February 2, 2023
    Inventors: Johannes Manz, Christoph Glacer, David Tumpold
  • Patent number: 11561168
    Abstract: A radiation source for obliquely launching a narrowband electromagnetic radiation into a cavity, comprises an emitter structure having a main radiation emission region for emitting the narrowband electromagnetic radiation, wherein the emitter structure is optically coupled to the cavity, and a layer element coupled to the main radiation emission region of the emitter structure, wherein the layer element comprises a radiation deflection structure configured for deflecting the radiation emission characteristic of the emitter structure with respect to the surface normal of the main radiation emission region of the emitter structure.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: January 24, 2023
    Assignee: Infineon Technologies AG
    Inventors: David Tumpold, Christoph Glacer, Steffen Kubacki