Abstract: A multi-lid semiconductor package includes one or more die disposed on a substrate, an interconnect disposed on the substrate, one or more die lids, a die thermal interface between the one or more die and the corresponding die lid or lids, one or more substrate lids, and a substrate interface between the substrate and the corresponding substrate lid or lids. The multi-lid semiconductor package may include one or more discrete surface mount components disposed on the substrate. The multi-lid semiconductor package may include a sealant between the one or more die lids and the one or more substrate lids and the substrate. The one or more die lids and the one or more substrate lids may differ in construction, design, placement, and/or thermal performance.

Abstract: A multi-lid semiconductor package includes one or more die disposed on a substrate, an interconnect disposed on the substrate, one or more die lids, a die thermal interface between the one or more die and the corresponding die lid or lids, one or more substrate lids, and a substrate interface between the substrate and the corresponding substrate lid or lids. The multi-lid semiconductor package may include one or more discrete surface mount components disposed on the substrate. The multi-lid semiconductor package may include a sealant between the one or more die lids and the one or more substrate lids and the substrate. The one or more die lids and the one or more substrate lids may differ in construction, design, placement, and/or thermal performance.

Abstract: A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.