Abstract: A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board.

Abstract: A chip package includes adjacent integrated circuits on a circuit board, and separate heat sinks are thermally coupled to the integrated circuits. Because the integrated circuits are in close proximity, heat pipes in the separate heat sinks are interdigitated to prevent mechanical interference between the heat sinks. The amount of interdigitation depends on the separation between the integrated circuits and how the integrated circuits are arranged relative to an external fluid (such as flowing air). At the minimum, the heat pipes in fin regions of the heat sinks (which include fins for convective heat transfer to the external fluid) are interdigitated. However, the heat pipes may be interdigitated in pedestal regions of the heat sinks (which are thermally coupled to the integrated circuits) and/or in ramp regions of the heat sinks (in which vertical positions of the heat sinks change from the pedestal regions to the fin regions).

Abstract: An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.

Abstract: An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.

Abstract: An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.

Abstract: A chip package includes adjacent integrated circuits on a circuit board, and separate heat sinks are thermally coupled to the integrated circuits. Because the integrated circuits are in close proximity, heat pipes in the separate heat sinks are interdigitated to prevent mechanical interference between the heat sinks. The amount of interdigitation depends on the separation between the integrated circuits and how the integrated circuits are arranged relative to an external fluid (such as flowing air). At the minimum, the heat pipes in fin regions of the heat sinks (which include fins for convective heat transfer to the external fluid) are interdigitated. However, the heat pipes may be interdigitated in pedestal regions of the heat sinks (which are thermally coupled to the integrated circuits) and/or in ramp regions of the heat sinks (in which vertical positions of the heat sinks change from the pedestal regions to the fin regions).

Abstract: A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board.

Abstract: An apparatus for cooling an integrated circuit (IC) die is described. The apparatus includes an adhesion layer coated on a surface of the IC die, wherein the adhesion layer has high thermal conductivity. The apparatus also includes a heat dissipation structure affixed onto the adhesion layer. This heat dissipation structure further includes a set of discrete heat dissipation elements which are substantially mechanically isolated from each other. This set of discrete heat dissipation elements provides an extended heat dissipation surface for the IC die. Moreover, each of the set of discrete heat dissipation elements has high compliance, which allows the adhesion layer to be sufficiently thin, thereby reducing a thermal conductivity of the adhesion layer.

Abstract: In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.

Abstract: A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an outlet face, and includes at least one fan configured to propel a flow of air from the inlet face to the outlet face. The tandem fan system also includes a heat exchanger coupled between the first and second fan assemblies, wherein the heat exchanger includes at least one fin array and one or more heat pipes. The fin array and heat pipe combination is configured to draw heat from a flow of air that flows through the heat exchanger, and to straighten the flow of air so that the flow is perpendicular to the inlet face of the second fan assembly.

Abstract: A tandem fan system with an airflow-straightening heat exchanger removes heat from an airflow while providing optimal airflow pressure. The tandem fan system includes a first fan assembly and a second fan assembly, wherein each fan assembly has an inlet face and an outlet face, and includes at least one fan configured to propel a flow of air from the inlet face to the outlet face. The tandem fan system also includes a heat exchanger coupled between the first and second fan assemblies, wherein the heat exchanger includes at least one fin array and one or more heat pipes. The fin array and heat pipe combination is configured to draw heat from a flow of air that flows through the heat exchanger, and to straighten the flow of air so that the flow is perpendicular to the inlet face of the second fan assembly.

Abstract: In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.

Abstract: A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference.

Abstract: A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.

Abstract: A liquid cooled rack with compliant heat exchanger support structure includes a rack having a rigid frame for supporting electronic components therein, a plurality of flexible supports connected to the rigid frame, and a liquid-fed heat exchanger mounted within the rack via the plurality of flexible supports. The plurality of flexible supports are connected to the heat exchanger and configured to flexibly support the liquid-fed heat exchanger with respect to the rigid frame.

Abstract: A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server.

Abstract: A cooling system for a rack-mount server including at least one blade includes a liquid cooling line, at least one adjustable valve connected to the liquid cooling line, at least one heat exchanger connected to the at least one adjustable valve, a control module connected to the at least one valve, and a feedback module connected to the control module and including a sensor configured to measure a feedback control signal. The control module is configured to adjust the at least one adjustable valve and a flow rate of liquid through the liquid cooling line based on a feedback control signal measured by the sensor.

Abstract: A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference.

Abstract: A cooling system for a rack-mount server including at least one blade includes a liquid cooling line, a pump connected to the liquid cooling line, at least one heat exchanger connected to the liquid cooling line, a fan module, a control module connected to the fan module and the pump, a feedback module connected to the control module and comprising a sensor configured to measure a feedback control signal, where the control module is configured to adjust an air flow rate through the fan module or a liquid coolant flow rate through the pump based on the feedback control signal.

Abstract: A cooling system for a rack-mount server including at least one blade and a system enclosure includes a liquid cooling line, at least one heat exchanger connected to the liquid cooling line and including a plurality of fins divided into one or more sections of the plurality of fins, wherein the fin density of the plurality of fins varies over the one or more sections, and a plurality of fans configured to blow air through the at least one heat exchanger and cool the at least one blade in the rack-mount server