Patents by Inventor David W. Engler

David W. Engler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11051422
    Abstract: A modular compute platform including an enclosure, a first module including an application specific integrated circuit, the first module being disposed in the enclosure, a second module including an input/output device, the second module being disposed in the enclosure, the input/output device connected to the first module through a first cable, and a third module including a media device disposed in the enclosure, the media device connected to the first module through a second cable.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 29, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Norton, David W. Engler, Hermann Wienchol
  • Patent number: 10964180
    Abstract: Software intrusion protection systems to prevent remote access to sensitive data are very prevalent. In some cases, additional physical access protection may also be desired. By preventing physical access to a system an intruder may not be able to physically “steal” component parts of the system and then obtain their contents (or design criteria) at a remote site (e.g., after the physical theft). Monitors are provided to detect potential access to a secure computer system and identify if inappropriate access to the secure computer system is obtained (or is imminent). In a case where unauthorized access is predicted, warnings and alerts may be sent prior to an actual breach. Upon determination that a breach may be likely to occur, techniques to protect data (e.g., erasure, destruction, etc.) and component parts may be initiated. Sensors monitor internal and external physical environmental conditions to assist in detection of intrusion.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: March 30, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David W. Engler, William James Walker
  • Patent number: 10846219
    Abstract: A system and method for a computing device having a processor, a memory module including volatile memory for random access memory (RAM), and an integrated circuit to intercept an error signal from the processor, the intercept delaying a system shutdown of the computing device. Firmware is executed by the processor to copy contents of the volatile memory to a non-volatile memory during the delay of the system shutdown.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: November 24, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Thierry Fevrier, David F Heinrich, William C Hallowell, Mark S Fletcher, Justin Haanbyull Park, David W Engler
  • Patent number: 10788872
    Abstract: Example implementations relate to a server node shutdown. For example, a system includes a control module and a secondary power supply. The control module includes a detect engine to detect an even that triggers a sequenced shutdown of a server node and prevent execution of the sequenced shutdown and execution of a data transfer. The control module also includes an initiate engine to initiate a data backup process, by a basic input/output system (BIOS) of the server node, to write data from a volatile memory location of the server node to a non-volatile memory location of the server node. The secondary power supply is to support the data backup process.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: September 29, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David F. Heinrich, David W. Engler, Patrick Raymond, William C. Hallowell
  • Patent number: 10757801
    Abstract: A printed circuit board having a substrate layer, at least one electrically conductive trace disposed on the substrate layer, and a solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask later includes a void region over at least a portion of the electrically conductive trace. Also, a method of optimizing printed circuit board designing including selecting printed circuit board data comprising at least a solder mask layer area, varying the solder mask layer area, determining an insertion loss value for each varied solder mask layer area, comparing the insertion loss values for each varied solder mask layer area, and selecting a solder mask layer area based on the comparing.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: August 25, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: David W. Engler, Stephen F. Contreras
  • Publication number: 20200093021
    Abstract: A modular compute platform including an enclosure, a first module including an application specific integrated circuit, the first module being disposed in the enclosure, a second module including an input/output device, the second module being disposed in the enclosure, the input/output device connected to the first module through a first cable, and a third module including a media device disposed in the enclosure, the media device connected to the first module through a second cable.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 19, 2020
    Inventors: John Norton, David W. Engler, Hermann Wienchol
  • Publication number: 20200084876
    Abstract: A printed circuit board having a substrate layer, at least one electrically conductive trace disposed on the substrate layer, and a solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask later includes a void region over at least a portion of the electrically conductive trace. Also, a method of optimizing printed circuit board designing including selecting printed circuit board data comprising at least a solder mask layer area, varying the solder mask layer area, determining an insertion loss value for each varied solder mask layer area, comparing the insertion loss values for each varied solder mask layer area, and selecting a solder mask layer area based on the comparing.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 12, 2020
    Inventors: David W. Engler, Stephen F. Contreras
  • Patent number: 10545686
    Abstract: A computing device having firmware, an uninterruptible power supply (UPS), and a memory module with volatile memory. Firmware tasks are prioritized to elevate tasks associated with the copying of the contents of the volatile memory to the nonvolatile memory external to the memory module during the loss of main or primary power.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: January 28, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Justin Haanbyull Park, Thierry Fevrier, David F Heinrich, David W Engler
  • Publication number: 20190371139
    Abstract: Software intrusion protection systems to prevent remote access to sensitive data are very prevalent. In some cases, additional physical access protection may also be desired. By preventing physical access to a system an intruder may not be able to physically “steal” component parts of the system and then obtain their contents (or design criteria) at a remote site (e.g., after the physical theft). Monitors are provided to detect potential access to a secure computer system and identify if inappropriate access to the secure computer system is obtained (or is imminent). In a case where unauthorized access is predicted, warnings and alerts may be sent prior to an actual breach. Upon determination that a breach may be likely to occur, techniques to protect data (e.g., erasure, destruction, etc.) and component parts may be initiated. Sensors monitor internal and external physical environmental conditions to assist in detection of intrusion.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 5, 2019
    Inventors: David W. Engler, William James Walker
  • Patent number: 10379591
    Abstract: An apparatus in accordance with one example includes a battery module in a dual in-line memory module (DIMM) form factor. The battery module is insertable in a DIMM slot of a host device to provide backup power to a plurality of loads of the host device.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: August 13, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventor: David W. Engler
  • Patent number: 10275003
    Abstract: Example implementations relate to backup power communication. For example, a system for backup power communication can include a shared backup power supply coupled to a node, a plurality of loads supported by the node, and a pass-through device to support multi-master communication between the shared backup power supply and the plurality of loads.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: April 30, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Justin H. Park, Patrick A. Raymond, David P. Mohr, David K. Altobelli, David W. Engler, Han Wang
  • Patent number: 10261571
    Abstract: Example implementations relate to backup power supply support. For example, a backup power supply support system can include a shared backup power supply controlled by a backup power control module and a support switch coupled to the shared backup power supply. The support switch enables a transition from a primary power supply to the shared backup power supply and the support switch includes system firmware. The system firmware detects a primary power supply compromise, isolates a hardware switch from the shared backup power supply, enables the hardware switch, and transitions to the shared backup power supply.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: April 16, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Edgar Hance, David W. Engler, Han Wang
  • Publication number: 20180365147
    Abstract: A system and method for a computing device having a processor, a memory module including volatile memory for random access memory (RAM), and an integrated circuit to intercept an error signal from the processor, the intercept delaying a system shutdown of the computing device. Firmware is executed by the processor to copy contents of the volatile memory to a non-volatile memory during the delay of the system shutdown.
    Type: Application
    Filed: July 31, 2015
    Publication date: December 20, 2018
    Inventors: Thierry FEVRIER, David F HEINRICH, William C HALLOWELL, Mark S FLETCHER, Justin Haanbyull PARK, David W ENGLER
  • Publication number: 20180364928
    Abstract: A computing device having firmware, an uninterruptible power supply (UPS), and a memory module with volatile memory. Firmware tasks are prioritized to elevate tasks associated with the copying of the contents of the volatile memory to the nonvolatile memory external to the memory module during the loss of main or primary power.
    Type: Application
    Filed: July 31, 2015
    Publication date: December 20, 2018
    Inventors: Justin Haanbyull PARK, Thierry FEVRIER, David F HEINRICH, David W ENGLER
  • Publication number: 20180275731
    Abstract: In an example, a system comprises a read-only memory, and a processor. The processor to: access a first reset vector, wherein the first reset vector is associated with a first memory address, wherein the first memory address is located on the read-only memory. Responsive to the processor being reset, the processor to: access a second reset vector, wherein the second reset vector is associated with a second memory address, wherein the second memory address is different than the first memory address.
    Type: Application
    Filed: March 21, 2017
    Publication date: September 27, 2018
    Inventors: David W. Engler, David F. Heinrich, Patrick Raymond
  • Publication number: 20180253131
    Abstract: Example implementations relate to a server node shutdown. For example, a system includes a control module and a secondary power supply. The control module includes a detect engine to detect an even that triggers a sequenced shutdown of a server node and prevent execution of the sequenced shutdown and execution of a data transfer. The control module also includes an initiate engine to initiate a data backup process, by a basic input/output system (BIOS) of the server node, to write data from a volatile memory location of the server node to a non-volatile memory location of the server node. The secondary power supply is to support the data backup process.
    Type: Application
    Filed: September 21, 2015
    Publication date: September 6, 2018
    Inventors: David F. Heinrich, David W. Engler, Patrick Raymond, William C. Hallowell
  • Publication number: 20180113496
    Abstract: Example implementations relate to dynamically changing a power voltage to a system. For example, a system includes a power supply unit to provide power to the system and a control module. The control module is to dynamically enable a first output voltage level from the power supply unit to the system when the system is operating in a first mode, and to dynamically enable a second output voltage level from the power supply unit to the system when the system is operating in a second mode. The first output voltage level is greater than the second output voltage level.
    Type: Application
    Filed: May 15, 2015
    Publication date: April 26, 2018
    Inventors: David F. Heinrich, Hung Quoc Phu, David W. Engler
  • Patent number: 9860975
    Abstract: A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: January 2, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Mark Vinod Kapoor, David W. Engler
  • Publication number: 20170160789
    Abstract: Example implementations relate to backup power supply support. For example, a backup power supply support system can include a shared backup power supply controlled by a backup power control module and a support switch coupled to the shared backup power supply. The support switch enables a transition from a primary power supply to the shared backup power supply and the support switch includes system firmware. The system firmware detects a primary power supply compromise, isolates a hardware switch from the shared backup power supply, enables the hardware switch, and transitions to the shared backup power supply.
    Type: Application
    Filed: October 31, 2014
    Publication date: June 8, 2017
    Inventors: Edgar Hance, David W. Engler, Han Wang
  • Publication number: 20170160779
    Abstract: Example implementations relate to backup power communication. For example, a system for backup power communication can include a shared backup power supply coupled to a node, a plurality of loads supported by the node, and a pass-through device to support multi-master communication between the shared backup power supply and the plurality of loads.
    Type: Application
    Filed: October 27, 2014
    Publication date: June 8, 2017
    Inventors: Justin H. Park, Patrick A. Raymond, David P. Mohr, David K. Altobelli, David W. Engler, Han Wang