Patents by Inventor David Wallis
David Wallis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240150957Abstract: A metalized fabric and method for metallization of fabric. The fabric is formed using two threads with different affinities for metallization, but which threads are not metalized prior to forming into the fabric. The threads will typically be woven using an unbalanced weave to provide one side of the fabric with a resultant greater amount of metallization than the other but this is not required. Once the resultant fabric is metalized, it will typically be more suitable for consistent color dying than fabric which was formed from both metalized and unmetallized threads.Type: ApplicationFiled: January 12, 2024Publication date: May 9, 2024Inventors: Bennett Fisher, Carl Jones, Jodi Wallis, Dino Aimino, Thomas Dougal, Greg Gianforcaro, David Curry
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Publication number: 20240084805Abstract: A mass spectrometer comprising: a vacuum housing comprising a first vacuum chamber having a first gas exhaust port; a gas pump (1700) having a first gas inlet port connected to the first gas exhaust port (H1) by a first gas conduit for evacuating the first vacuum chamber, and a first apertured cover (2010) arranged over the first gas exhaust port (H1) or first gas inlet port, or in the first gas conduit therebetween.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: Micromass UK LimitedInventors: Cedric Marsh, Peter Carney, Jason Lee Wildgoose, David Wallis, Paul McIver, Soji Chummar, George Andreas Antoniades, Dipesh Mistry
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Patent number: 11879470Abstract: A mass spectrometer comprising: a vacuum housing comprising a first vacuum chamber having a first gas exhaust port; a gas pump (1700) having a first gas inlet port connected to the first gas exhaust port (H1) by a first gas conduit for evacuating the first vacuum chamber; and a first apertured cover (2010) arranged over the first gas exhaust port (H1) or first gas inlet port, or in the first gas conduit therebetween.Type: GrantFiled: May 31, 2019Date of Patent: January 23, 2024Assignee: Micromass UK LimitedInventors: Cedric Marsh, Peter Carney, Jason Lee Wildgoose, David Wallis, Paul McIver, Soji Chummar, George Andreas Antoniades, Dipesh Mistry
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Publication number: 20220368111Abstract: A semiconductor structure comprising a matrix having a first cubic Group-III nitride with a first band gap, and a second cubic Group-III nitride having a second band gap and forming a region embedded within the matrix. The second cubic Group-III nitride comprises an alloying material which reduces the second band gap relative to the first band gap, a quantum wire is defined by a portion within the region embedded within the matrix, the portion forming a one-dimensional charge-carrier confinement channel, wherein the quantum wire is operable to exhibit emission luminescence which is optically polarised.Type: ApplicationFiled: September 30, 2020Publication date: November 17, 2022Inventors: David Wallis, Rachel Oliver, Menno Kappers, Philip Dawson, Stephen Church, David Binks
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Publication number: 20210207608Abstract: A mass spectrometer comprising: a vacuum housing comprising a first vacuum chamber having a first gas exhaust port; a gas pump (1700) having a first gas inlet port connected to the first gas exhaust port (H1) by a first gas conduit for evacuating the first vacuum chamber; and a first apertured cover (2010) arranged over the first gas exhaust port (H1) or first gas inlet port, or in the first gas conduit therebetween.Type: ApplicationFiled: May 31, 2019Publication date: July 8, 2021Applicant: Micromass UK LimitedInventors: Cedric Marsh, Peter Carney, Jason Lee Woldgoose, David Wallis, Paul McIver, Soji Chummar, George Andreas Antoniades, Dipesh Mistry
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Patent number: 11052852Abstract: An impact detection system is disclosed for detecting and identifying an object colliding with a vehicle. The impact detection system comprises a sensor arrangement arranged to measure a characteristic of an impact of the object against the vehicle, a trigger determiner associated with the sensor arrangement for determining whether the characteristic of the 5 impact is greater than a predefined threshold value, and an image capturing device arranged to capture an image of the object. The system is arranged to automatically make the captured image available for inspection in response to the trigger determiner determining that the characteristic of the impact is greater than the predefined threshold value so that the object in the image can be identified substantially in real-time.Type: GrantFiled: July 14, 2016Date of Patent: July 6, 2021Assignee: Technological Resources Pty. LimitedInventors: Ilidio Gouveia Da Costa, Anthony Michael Godber, David Wallis, Matthew Shurmer, Paul Nicholson, Gareth Topham, Richard Pearman, Peter Knight
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Publication number: 20180194314Abstract: An impact detection system is disclosed for detecting and identifying an object colliding with a vehicle. The impact detection system comprises a sensor arrangement arranged to measure a characteristic of an impact of the object against the vehicle, a trigger determiner associated with the sensor arrangement for determining whether the characteristic of the 5 impact is greater than a predefined threshold value, and an image capturing device arranged to capture an image of the object. The system is arranged to automatically make the captured image available for inspection in response to the trigger determiner determining that the characteristic of the impact is greater than the predefined threshold value so that the object in the image can be identified substantially in real-time.Type: ApplicationFiled: July 14, 2016Publication date: July 12, 2018Inventors: Ilidio Gouveia Da Costa, Anthony Michael Godber, David Wallis, Matthew Shurmer, Paul Nicholson, Gareth Topham, Richard Pearman, Peter Knight
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Patent number: 9711973Abstract: A wireless power source including a microwave receiver, a matching network, and a transducer. The microwave receiver receives a microwave signal having a carrier frequency. The matching network receives a signal having the carrier frequency and a switched frequency and removes the carrier frequency such that the matching network outputs a switched signal at the switched frequency. The transducer is configured to receive the switched signal and output a DC voltage.Type: GrantFiled: April 24, 2015Date of Patent: July 18, 2017Assignee: MOTOROLA SOLUTIONS, INC.Inventors: David Wallis, John Herrmann
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Publication number: 20160315480Abstract: A wireless power source including a microwave receiver, a matching network, and a transducer. The microwave receiver receives a microwave signal having a carrier frequency. The matching network receives a signal having the carrier frequency and a switched frequency and removes the carrier frequency such that the matching network outputs a switched signal at the switched frequency. The transducer is configured to receive the switched signal and output a DC voltage.Type: ApplicationFiled: April 24, 2015Publication date: October 27, 2016Inventors: David Wallis, John Herrmann
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Patent number: 8077474Abstract: A variable equalizer apparatus for forward and/or reverse equalizers in an amplifier. The system can include a structure to allow continuous contact of the signal flow as an equalizer is removed; jumpers with fixed resistors and associated capacitors and inductors to produce a variable range over many different values; and/or variable resistance potentiometers with fixed resistors and associated capacitors and inductors to produce a variable range over separate value equalizers.Type: GrantFiled: June 16, 2008Date of Patent: December 13, 2011Inventors: Edward Perez, David Wallis
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Publication number: 20090041106Abstract: A variable equalizer apparatus for forward and/or reverse equalizers in an amplifier. The system can include a structure to allow continuous contact of the signal flow as an equalizer is removed; jumpers with fixed resistors and associated capacitors and inductors to produce a variable range over many different values; and/or variable resistance potentiometers with fixed resistors and associated capacitors and inductors to produce a variable range over separate value equalizers.Type: ApplicationFiled: June 16, 2008Publication date: February 12, 2009Inventors: Edward Perez, David Wallis
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Patent number: 7390742Abstract: The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method comprises applying and patterning masking layers on the first and the second surfaces, thereby uncovering a first contact location on the first surface and a second contact location on the second surface; applying a protective layer to the second surface in order to protect the corresponding masking layer and the second contact location during subsequent method steps; applying a first conductor structure to the first surface, the first conductor structure on the first surface covering the first contact location; removing the protective layer on the second surface; and applying a second conductor structure to the second surface, the second conductor structure on the second surface covering the second contact location.Type: GrantFiled: October 14, 2005Date of Patent: June 24, 2008Assignee: Infineon Technologies AGInventors: Axel Brintzinger, Stefan Ruckmich, Octavio Trovarelli, Fritz Uhlendorf, legal representative, David Wallis, Ingo Uhlendorf
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Patent number: 7235859Abstract: An arrangement for protecting fuses/anti-fuses on chips which serve to activate redundant circuits or chip functions includes a passivation layer (e.g., hard passivation) arranged on a fully processed chip with the exception of metal contacts of a metallization level and the fuses. The chip is provided with a redistribution layer that is electrically contact-connected to the metallization level, and to a process for protecting such fuses/anti-fuses. The invention is now based on the object of ensuring sufficient protection of fuses/anti-fuses on integrated circuits. This is achieved by virtue of the fact that a dielectric (3.1, 3.2), which covers at least the region of the fuses/anti-fuses (4) and to which the redistribution layer (2) comprising the combination of materials Cu/Ni/Au is applied, is arranged on the passivation layer (5).Type: GrantFiled: October 1, 2004Date of Patent: June 26, 2007Assignee: Infineon Technologies AGInventors: Axel Brintzinger, Octavio Trovarelli, David Wallis, Wolfgang Leiberg
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Patent number: 7169647Abstract: A conductive connection is made between a semiconductor chip and an external conductor structure. An elevation element is applied on the surface of the semiconductor chip and a soldering island is arranged on the elevation element. An interconnect is produced below the soldering island as far as a bonding island or an I/O pad. Increased reliability of conductive connections of the bonding island or the I/O pad to an external conductive structure can be achieved by preventing the flowing-away of the solder and the oxidation or corrosion of the conductive layer.Type: GrantFiled: May 7, 2004Date of Patent: January 30, 2007Assignee: Infineon Technologies AGInventors: Octavio Trovarelli, Ingo Uhlendorf, David Wallis, Axel Brintzinger
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Publication number: 20060145186Abstract: A buffer structure comprising a compositionally graded layer of a nitride alloy comprising two or more Group IIIB elements, for example La, Y, Sc or Ac, is used to modify a silicon substrate to produce a universal substrate on which a range of target materials, for example GaN, may be deposited to produce semiconductor devices for electronic and optical applications. The resulting lattice parameter L varies with thickness T through the structure.Type: ApplicationFiled: February 16, 2004Publication date: July 6, 2006Inventor: David Wallis
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Publication number: 20060121257Abstract: The invention relates to a method for producing a rewiring printed circuit board with a substrate wafer having passage connections between a first and a second surface. One embodiment of the method comprises applying and patterning masking layers on the first and the second surfaces, thereby uncovering a first contact location on the first surface and a second contact location on the second surface; applying a protective layer to the second surface in order to protect the corresponding masking layer and the second contact location during subsequent method steps; applying a first conductor structure to the first surface, the first conductor structure on the first surface covering the first contact location; removing the protective layer on the second surface; and applying a second conductor structure to the second surface, the second conductor structure on the second surface covering the second contact location.Type: ApplicationFiled: October 14, 2005Publication date: June 8, 2006Inventors: Axel Brintzinger, Stefan Ruckmich, Octavio Trovarelli, David Wallis
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Publication number: 20060056645Abstract: A method for the construction of useful signals, Q (the Hilbert transform) and I? (the derivative) from a (Nyquist) sequence of samples of I, a given signal, which signal may or may not be available in its continuous, band-limited form. The signal Q is constructed using the continuous function cos ? ? ? x - 1 x in place of the previously and well-known function sin ? ? ? x x used to reconstruct I from (Nyquist) samples of I. It is also possible to substitute the continuous function cos ? ? ? x - sin ? ? ? x x x for sin ? ? ? x x to produce the derivative I?. These are particularly advantageous with audio CD players and the like in which the numerical data stream is fed into a construction or reconstruction process using a digital to analog converter.Type: ApplicationFiled: September 1, 2004Publication date: March 16, 2006Inventor: David Wallis
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Publication number: 20050275085Abstract: An arrangement reduces the electrical crosstalk on a chip, in particular between adjacent conductors of the redistribution routing and/or between the redistribution routing on the first passivation on the chip and the metallization of the chip. In one aspect, the arrangement reduces the crosstalk between the redistribution wiring on a chip and its metallization and can be realized simply and independently at the front end. This is achieved by at least an additional conductor (10) being respectively arranged between adjacent conductors of the redistribution routing (1) and/or at least a second passivation (7) with a lower dielectric constant of a preferred “cold dielectric” being arranged between the redistribution routing (1) and the first passivation (2) on the active region of the chip (3).Type: ApplicationFiled: May 27, 2005Publication date: December 15, 2005Inventors: Axel Brintzinger, Octavio Trovarelli, Ingo Uhlendorf, Stefan Ruckmich, David Wallis, Fritz Uhlendorf, Helga Uhlendorf
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Publication number: 20050258506Abstract: An arrangement for protecting fuses/anti-fuses on chips which serve to activate redundant circuits or chip functions includes a passivation layer (e.g., hard passivation) arranged on a fully processed chip with the exception of metal contacts of a metallization level and the fuses. The chip is provided with a redistribution layer that is electrically contact-connected to the metallization level, and to a process for protecting such fuses/anti-fuses. The invention is now based on the object of ensuring sufficient protection of fuses/anti-fuses on integrated circuits. This is achieved by virtue of the fact that a dielectric (3.1, 3.2), which covers at least the region of the fuses/anti-fuses (4) and to which the redistribution layer (2) comprising the combination of materials Cu/Ni/Au is applied, is arranged on the passivation layer (5).Type: ApplicationFiled: October 1, 2004Publication date: November 24, 2005Inventors: Axel Brintzinger, Octavio Trovarelli, David Wallis, Wolfgang Leiberg
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Publication number: 20050219044Abstract: A software system and associated method implements real-time management of events such as emergencies, contingencies and incidents by responding to user inputs and environmental detectors, carrying out defined and custom procedures, establishing communications channels with key personnel and emergency services, maintaining an audit trail of events, broadcasting appropriate instructions, tasks and graphical information to personnel, and providing monitoring, recording and communication facilities for local and/or remote coordinators and command centers.Type: ApplicationFiled: March 16, 2005Publication date: October 6, 2005Applicants: Science Traveller International Inc, Science Traveller International Pty. Ltd.Inventors: John Douglass, David Wallis, Nathan Martyn, Aaron Pearse