Abstract: According to one or more aspects of the present disclosure, a piezoelectric pump may include a hydraulic fluid path between a low pressure source and a high pressure tool port; a fluid disposed in the hydraulic fluid path; a piston in communication with the fluid; and a piezoelectric material connected to the piston to pump the fluid through the high pressure tool port.

Abstract: The disclosed subject matter relates to an architecture that can provide contextual role awareness. For example, rather than focusing on features and functionality at the device level, features and functionality can be controlled based upon various roles that can be related to various personas of a user. Thus, in a business or enterprise setting, the enterprise can manage a business role in accordance with that enterprise's security objectives, which might dramatically limit certain features for the user. However, the user can quickly switch roles, away from the business role in order to again access desired features, yet without compromising the security objectives of the enterprise.

Abstract: Certain embodiments of a cable sense mode for intelligent power saving in the absence of a link pulse may include detecting an energy level of an Ethernet link. The Ethernet link may couple a network adapter chip to a network. The power supplied to the network adapter chip may be adjusted based on the detected energy level. Power may be supplied to the network adapter chip if the detected energy level of the Ethernet link is greater than or equal to a particular energy level. Power may be reduced to the network adapter chip if the detected energy level of the Ethernet link is less than a particular energy level. An output signal and/or an interrupt signal may be generated that indicates a change in the detected energy level of the Ethernet link. Power may be provided to the circuitry that generates the output signal and the interrupt signal.

Abstract: An automated banking machine operates responsive to data read from data bearing records, such as user cards, to cause machine user authorization and financial transfers. Account data read from a user card is associated in a data store with instructions for displaying a customer interface uniquely associated with the particular bank where the user holds the account. The customer interface includes user-selectable financial transaction options. The arrangement enables the customer interface of the user's home bank, with which the user is familiar, to also be automatically displayed when the user operates automated banking machines of other banks.

Abstract: An automated banking machine operates responsive to data read from data bearing records, such as user cards, to cause machine user authorization and financial transfers. Account data read from a user card is associated in a data store with instructions for displaying a customer interface uniquely associated with the particular bank where the user holds the account. The customer interface includes user-selectable financial transaction options. The arrangement enables the customer interface of the user's home bank, with which the user is familiar, to also be automatically displayed when the user operates automated banking machines of other banks.

Abstract: A method for visual programming an automated transaction machine (12). The method includes the creation of terminal directors (225) that generally correspond to transactions performed by the automated transaction machine. The terminal directors are programmed by visually creating associations (238) between a plurality of ATM objects (230, 232) in a work space (224). Exemplary ATM objects include an authorization object (260), a back stage control object (262), a card reader object (264), a customer profile object (266), a depositor object (268), a dispenser object (270), keypad object (272), a logic object (274), a OCS object (276), a presenter object (278), a PIN entry object (280), a printer object (282), a sync object (284), and a transaction data object (286). The customer profile object is operative to retrieve customer profile information responsive to a determined customer of a person using the ATM.

Abstract: An automated banking machine operates responsive to data read from data bearing records, such as user cards, to cause machine user authorization and financial transfers. Account data read from a user card is associated in a data store with instructions for displaying a customer interface uniquely associated with the particular bank where the user holds the account. The customer interface includes user-selectable financial transaction options. The arrangement enables the customer interface of the user's home bank, with which the user is familiar, to also be automatically displayed when the user operates automated banking machines of other banks.

Abstract: The disclosed subject matter relates to various architectures that can facilitate establishing a remote user interface (UI) by way of a secure connection session. The remote UI can reflect one or more interfaces extant on a mobile device (e.g., a smartphone with a Linux-based operating system (OS)), yet can be implemented on a remote device, typically of a higher form factor and/or equipped with superior computing, interface, and presentation resources. In particular, the remote UI can access all or a subset of the data or services extant on the mobile device.

Abstract: A multi-chip stack package structure comprises a substrate, which has a chip placement area defined on its upper surface and a plurality of contacts disposed outside the chip placement area; a first chip is disposed in the chip placement area with the rear surface, a plurality of first pads being disposed on the active surface and a plurality of first bumps each being formed on one of the first pads; a plurality of metal wires connect the first bumps to the contacts; a second chip with a plurality of second pads being disposed on the active surface and a plurality of second bumps each being formed on one of the second pads, the second chip being mounted to the first chip with its active surface facing the active surface of the first chip, wherein the second bumps correspondingly connect the metal wires and the first bumps respectively.

Abstract: A multi-chip stack package structure comprises a substrate, which has a chip placement area defined on its upper surface and a plurality of contacts disposed outside the chip placement area; a first chip is disposed in the chip placement area with the rear surface, a plurality of first pads being disposed on the active surface and a plurality of first bumps each being formed on one of the first pads; a plurality of metal wires connect the first bumps to the contacts; a second chip with a plurality of second pads being disposed on the active surface and a plurality of second bumps each being formed on one of the second pads, the second chip being mounted to the first chip with its active surface facing the active surface of the first chip, wherein the second bumps correspondingly connect the metal wires and the first bumps respectively.

Abstract: A multi-chip stack package structure comprises a substrate, which has a chip placement area defined on its upper surface and a plurality of contacts disposed outside the chip placement area; a first chip is disposed in the chip placement area with the rear surface, a plurality of first pads being disposed on the active surface and a plurality of first bumps each being formed on one of the first pads; a plurality of metal wires connect the first bumps to the contacts; a second chip with a plurality of second pads being disposed on the active surface and a plurality of second bumps each being formed on one of the second pads, the second chip being mounted to the first chip with its active surface facing the active surface of the first chip, wherein the second bumps correspondingly connect the metal wires and the first bumps respectively.

Abstract: A thermally enhanced electronic package comprises a chip, a substrate, an adhesive, and an encapsulation. The adhesive or the encapsulation is mixed with carbon nanocapsules. The substrate includes an insulation layer and a wiring layer formed on the substrate. The adhesive covers the chip and the substrate. The chip is electrically connected to the wiring layer. The encapsulation covers the chip and the substrate.

Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Abstract: A semiconductor wafer structure comprises a first surface and a second surface opposite to the first surface, a plurality of chip areas formed on the first surface, a plurality of through-silicon holes formed in each of the plurality of chip areas connecting the first surface and the second surface, and a through-silicon-via (TSV) electrode structure formed in each through-silicon hole. Each through-silicon-via electrode structure comprises a dielectric layer formed on the inner wall of the through-silicon hole, a barrier layer formed on the inner wall of the dielectric layer and defining a vacancy therein, a filling metal layer filled into the vacancy, a first end of the filling metal layer being lower than the first surface forming a recess, and a soft metal cap connecting to and overlaying the first end of the filling metal layer, wherein a portion of the soft metal cap is formed in the recess and the soft metal cap protrudes out of the first surface.

Abstract: A semiconductor wafer structure comprises a first surface and a second surface opposite to the first surface, a plurality of chip areas formed on the first surface, a plurality of through-silicon holes formed in each of the plurality of chip areas connecting the first surface and the second surface, and a through-silicon-via (TSV) electrode structure formed in each through-silicon hole. Each through-silicon-via electrode structure comprises a dielectric layer formed on the inner wall of the through-silicon hole, a barrier layer formed on the inner wall of the dielectric layer and defining a vacancy therein, a filling metal layer filled into the vacancy, a first end of the filling metal layer being lower than the first surface forming a recess, and a soft metal cap connecting to and overlaying the first end of the filling metal layer, wherein a portion of the soft metal cap is formed in the recess and the soft metal cap protrudes out of the first surface.

Abstract: An automated banking machine operates responsive to data read from data bearing records, such as user cards, to cause machine user authorization and financial transfers. Account data read from a user card is associated in a data store with instructions for displaying a customer interface uniquely associated with the particular bank where the user holds the account. The customer interface includes user-selectable financial transaction options. The arrangement enables the customer interface of the user's home bank, with which the user is familiar, to also be automatically displayed when the user operates automated banking machines of other banks.

Abstract: An automated banking machine operates to carry out financial transactions for authorized machine users responsive to user data read from data bearing records. The machine includes an input devices including a card reader which operates to read card data that is usable to identify a user or a user account. The machine also includes a cash dispenser that is selectively operative to dispense currency notes to authorized machine users. A computer causes financial accounts read by the card reader to be assessed a value for cash dispensed. The computer causes operation of the cash dispenser in response to receiving cash dispense instructions. The computer includes software that prevents cash dispenser operation in response to cash dispense instructions being received in communications from at least one remote address.

Abstract: An apparatus and method for plugging a wellbore completion. The apparatus includes a body and a variable diameter ring. The body includes a first portion having a first diameter, and a second portion having a second diameter that is smaller than the first diameter. The variable diameter ring is disposed around the body and slidable on the first and second portions. The ring is configured to engage a flow path reduction device when located on the first portion, and to move past the flow path reduction device when located on the second portion.

Abstract: A fabricating process of a chip package structure is provided. First, a first substrate having a plurality of first bonding pads and a second substrate having a plurality of second bonding pads are provided, wherein bumps are formed on the first bonding pads of the first substrate. A first two-stage adhesive layer is formed on the first substrate and is B-stagized to form a first B-staged adhesive layer. A second two-stage adhesive layer is formed on the second substrate and is B-stagized to form a second B-staged adhesive layer. Then, the first substrate and the second substrate are bonded via the first and second B-staged adhesive layer such that the bumps pierce through the second B-staged adhesive layer and are electrically connected to the second bonding pads, wherein each of the first bonding pads is respectively electrically connected to one of the second bonding pads via one of the bumps.