Abstract: Embodiments disclosed herein include passive electrical components with thickness modifications. In an embodiment, such an apparatus may comprise a first substrate with a first material composition, where the first substrate comprises a passive electrical device. In an embodiment, a second substrate is coupled to the first substrate, where the second substrate has a second material composition. In an embodiment, a layer is over a surface of the second substrate opposite from the first substrate, and the layer is electrically insulating.

Abstract: Embodiments disclosed herein include apparatuses with assemblies comprising passive electrical devices that are embedded in a core of a package substrate. In an embodiment, such an apparatus may comprise a substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface coupling the first surface to the second surface. In an embodiment the substrate comprises a passive electrical device. In an embodiment, a pad is on the first surface of the substrate, and a layer contacts the substrate. In an embodiment, the layer directly contacts the first surface and the sidewall surface of the substrate.

Abstract: Embodiments disclosed herein include an apparatus with a component embedded in a core. Apparatuses disclosed herein may comprise a first component with a first surface and a second surface opposite from the first surface, where a pad is provided on the first surface. In an embodiment, a layer is over the second surface of the first component, and a second component is over the layer. In an embodiment, the second component comprises a hole that passes through at least a partial thickness of the second component.

Abstract: Embodiments disclosed herein include an apparatus that comprises a first substrate and a second substrate over the first substrate. In an embodiment, an array of interconnects is provided between the first substrate and the second substrate. The array of interconnects comprises a first interconnect with a first material composition, and a second interconnect with a second material composition that is different than the first material composition.

Abstract: Embodiments disclosed herein include bridge structures for package substrates. In an embodiment, a package substrate comprises a substrate that is a dielectric material. In an embodiment, a cavity is formed into the substrate. A first pad is on a bottom surface of the cavity, and a die is at least partially in the cavity. In an embodiment, a via passes through at least a portion of a thickness of the die, and a second pad is on the die. In an embodiment, the second pad directly contacts the first pad, and the first pad is the only electrically conductive structure between the via and the second pad.

Abstract: Embodiments disclosed herein include package substrates with bridge dies. In an embodiment, an apparatus comprises a first layer that is a glass layer. A via is provided through the first layer, where the via is electrically conductive. In an embodiment, a second layer is over the first layer, and the second layer comprises an organic dielectric material. In an embodiment, a cavity is provided in the second layer, where the via is within a footprint of the cavity. In an embodiment, a die is in the cavity. In an embodiment, the die is electrically coupled to the via.

Abstract: Embodiments disclosed herein include an interconnect structure. In an embodiment, the interconnect structure is an apparatus that comprises a substrate with a well through a thickness of the substrate. In an embodiment, the substrate comprises a polymer foam. In an embodiment, a liquid metal is in the opening, and the liquid metal comprises voids.

Abstract: A package substrate and package assembly including a package substrate including a substrate body including electrical routing features therein and a surface layer and a plurality of first and second contact points on the surface layer including a first pitch and a second pitch, respectively, wherein the plurality of first contact points and the plurality of second contact points are continuous posts to the respective ones of the electrical routing features. A method including forming first conductive vias in a package assembly, wherein the first conductive vias include substrate conductive vias to electrical routing features in a package substrate and bridge conductive vias to bridge surface routing features of a bridge substrate; forming a first surface layer and a second surface layer on the package substrate; and forming second conductive vias through each of the first surface layer and the second surface layer to the bridge conductive vias.

Abstract: Disclosed herein is a waste detection system. The waste detection system includes a pad configured to acquire a fluid sample excreted from a patient. The pad includes one or more layers and at least one microfluidic channel configured to receive therein the fluid sample. The waste detection system further includes an intake manifold in fluid communication with the at least one microfluidic channel, the intake manifold configured to receive the fluid sample, the intake manifold having one or more reagents configured to detect the presence of waste within the fluid sample excreted from the patient.

Abstract: Disclosed here are methods of evaluating resistance to a tyrosine kinase inhibitor (TKI) therapy of acute myeloid leukemia (AML) in a subject that include detecting the status of CD33, CD44, and phosphorylated BCL2 associated agonist of cell death (pBAD) expression. Also disclosed herein are methods of treating AML in a subject by administering a TKI and one or more inhibitors targeting a TKI-activated compensation pathway to the subject.

Abstract: A device comprises a substrate comprising a plurality of build-up layers and a cavity. A bridge die is located within the cavity and a plurality of cavity side bumps are on one side of the bridge die. A plurality of interconnect pads with variable heights are on one of the build-up layers of the substrate coupled to the plurality of the cavity side bumps to bond the bridge die to the substrate.

Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.

Abstract: Embodiments disclosed herein include glass core package substrates with a stiffener. In an embodiment, an apparatus comprises a substrate with a first layer with a first width, where the first layer is a glass layer, a second layer under the first layer, where the second layer has a second width that is smaller than the first width, and a third layer over the first layer, where the third layer has a third width that is smaller than the first width. In an embodiment, the apparatus further comprises a metallic structure with a first portion and a second portion, where the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.

Abstract: A package substrate and package assembly including a package substrate including a substrate body including electrical routing features therein and a surface layer and a plurality of first and second contact points on the surface layer including a first pitch and a second pitch, respectively, wherein the plurality of first contact points and the plurality of second contact points are continuous posts to the respective ones of the electrical routing features. A method including forming first conductive vias in a package assembly, wherein the first conductive vias include substrate conductive vias to electrical routing features in a package substrate and bridge conductive vias to bridge surface routing features of a bridge substrate; forming a first surface layer and a second surface layer on the package substrate; and forming second conductive vias through each of the first surface layer and the second surface layer to the bridge conductive vias.

Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a substrate with a layer on the substrate. In an embodiment, the layer comprises a plurality of wells. In an embodiment, a liquid metal is in the plurality of wells. In an embodiment, a cap is on the layer to seal the plurality of wells, where the cap comprises a polymer, and fibers within the polymer.

Abstract: Embodiments disclosed herein include multi-die modules. In an embodiment, the multi-die module comprises a first die and a second die coupled to the first die. In an embodiment, the second die comprises a keep out zone that at least partially overlaps the first die. The multi-die module may further comprise an underfill between the first die and the second die. In an embodiment, the underfill is entirely outside the keep out zone, and an edge of the underfill facing the keep out zone is non-vertical.

Abstract: An augmented reality apparatus includes a plurality of transmission lines, plural signal-generating circuits, at least one additional transmission line, at least one signal-processing circuit, a multiplexer having a plurality of inputs and at least one output, a plurality of matching networks, and an additional matching network coupling the additional transmission line to the output of the multiplexer. Example AR/VR devices include a camera configured to receive light from the external environment of the device and to provide a camera signal. The camera may include a surface variable lens including a support layer, an optical layer, a membrane layer, and an actuator. A computer-implemented method for anatomical electromyography test design includes identifying a wearable device having a frame including a plurality of electrodes, and calibrating the plurality of electrodes.

Abstract: Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core, where the core comprises glass. In an embodiment, a first layer is under the core, a second layer is over the core, and a via is through the core, the first layer, and the second layer. In an embodiment a width of the via through the core is equal to a width of the via through the first layer and the second layer. In an embodiment, the package substrate further comprises a first pad under the via, and a second pad over the via.

Abstract: Disclosed here are methods of treatment of cancers by administering autologous tumor infiltrating lymphocytes optionally in combination with chemotherapeutic and immunotherapeutic agents. Methods include treating acute myeloid leukemia with a combination of autologous TILs-based adoptive cell therapy and agents, such as a PD-1 inhibitor and a hypomethylating agent. The TILs can be bioengineered to modify the expression of function of a gene or a molecule of interest.

Abstract: The present invention provides an inductance coil comprising a magnetic core and a coil, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound. The coil is wrapped with an insulating adhesive tape and the tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. Additionally, the present invention provides an electromagnetic device including the above inductance coil.