Abstract: A desulfurizer material for desulfurizing fuel supplied to a fuel cell system, the desulfurizer material comprising one or more manganese oxide materials having an octahedral molecular sieve (OMS) structure, and the desulfurizer material being resistant to moisture and being capable of removing organic sulfur containing compounds and H2S. The desulfurizer material is used in a desulfurizer assembly which is used as part of a fuel cell system.

Abstract: Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.

Abstract: A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.

Abstract: This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble resist coating, the water-soluble resist coating being on a surface of an initial assembly. The initial assembly may include an electronic component. The surface may be formed, at least in part, by an electrical terminal of the electronic component, the hole being aligned, at least in part, with the electrical terminal. The solder may be reflowed, wherein the solder couples, at least in part, with the electrical terminal.

Abstract: The present invention provides an inductance coil comprising a magnetic core and a coil, wherein the coil is formed by winding a flat wire, and the flat surface of the wire is perpendicular to the axis around which the coil is wound. The coil is wrapped with an insulating adhesive tape and the tape is wound on the wire around an axis which is substantially in line with the direction along which the wire forming the coil extends, so as to form an isolation layer on the surface of the coil. Additionally, the present invention provides an electromagnetic device including the above inductance coil.

Abstract: A brake torque inspection method to a device having a drive machine and a driven component operatively connected to the drive machine is disclosed. The method comprises applying a brake to the driven component, and using a torque wrench at a shaft of the drive machine to determine the brake torque.

Abstract: Systems and methods are provided for volumetric analysis of pathologies. A segmentation component is configured to determine, for each of a series of images of a region of interest containing a pathological feature, a set of segmentation boundaries within the image representing a cross-section of the pathological feature. A mesh generation component is configured to link the sets of segmentation boundaries from adjacent images in the series of images to generate a polygonal mesh representing a volumetric reconstruction of the pathological feature. A volumetric measurement component is configured to calculate volumetric parameters from the volumetric reconstruction representing the pathological feature. A user interface is configured to provide the calculated volumetric parameters to an associated display.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.

Abstract: This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble resist coating, the water-soluble resist coating being on a surface of an initial assembly. The initial assembly may include an electronic component. The surface may be formed, at least in part, by an electrical terminal of the electronic component, the hole being aligned, at least in part, with the electrical terminal. The solder may be reflowed, wherein the solder couples, at least in part, with the electrical terminal.

Abstract: A desulfurizer material for desulfurizing fuel supplied to a fuel cell system, the desulfurizer material comprising one or more manganese oxide materials having an octahedral molecular sieve (OMS) structure, and the desulfurizer material being resistant to moisture and being capable of removing organic sulfur containing compounds and H2S. The desulfurizer material is used in a desulfurizer assembly which is used as part of a fuel cell system.

Abstract: An “intelligent” UV curing assembly is disclosed. The “intelligent” assembly permits automated monitoring of performance parameters, part lifetime, and inventory control of internal parts. The “intelligent” assembly includes an on lamp microprocessor. The on lamp microprocessor may be configured to recognize the internal parts, record accumulated working time of each part, and sample and process data from the plurality of “intelligent” sensors.

Abstract: An “intelligent” UV curing assembly is disclosed. The “intelligent” assembly permits automated monitoring of performance parameters, part lifetime, and inventory control of internal parts. The “intelligent” assembly includes an on lamp microprocessor. The on lamp microprocessor may be configured to recognize the internal parts, record accumulated working time of each part, and sample and process data from the plurality of “intelligent” sensors.

Abstract: Systems and methods are provided for volumetric analysis of pathologies. A segmentation component is configured to determine, for each of a series of images of a region of interest containing a pathological feature, a set of segmentation boundaries within the image representing a cross-section of the pathological feature. A mesh generation component is configured to link the sets of segmentation boundaries from adjacent images in the series of images to generate a polygonal mesh representing a volumetric reconstruction of the pathological feature. A volumetric measurement component is configured to calculate volumetric parameters from the volumetric reconstruction representing the pathological feature. A user interface is configured to provide the calculated volumetric parameters to an associated display.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.

Abstract: A process for the production of a compound of Formula I, or a pharmaceutically acceptable salt thereof, or a pharmaceutically acceptable prodrug ester thereof, comprising cleaving a lactam of formula II wherein the symbols are as defined, with a base; and precursors therefor and processes for the preparation of the precursors. The compounds of Formula I are pharmaceutically active compounds which are selective inhibitors of Cyclooxygenase II.

Abstract: The glove can be heated by the user's breath and comprises an outer layer with a through-hole on the back of the hand, a blowing element attached to the outer layer over the through-hole, and an inner lining. A guide pocket is arranged between the outer layer and the inner lining over an area of the back of the hand which extends from the blowing element all the way to the tips of the fingers, the thumb optionally excepted. The blowing element is attached to the upper wall of said pocket. The lower wall of the pocket is perforated, at each finger, by a through-orifice for air in an area at the tip of said finger. The inner lining is air-permeable in at least the area of the through-orifice.

Abstract: A process for the production of a compound of Formula I, or a pharmaceutically acceptable salt thereof, or a pharmaceutically acceptable prodrug ester thereof, comprising cleaving a lactam of formula II wherein the symbols are as defined, with a base; and precursors therefor and processes for the preparation of the precursors. The compounds of Formula I are pharmaceutically active compounds which are selective inhibitors of Cyclooxygenase II.

Abstract: A process for the production of a compound of Formula I, or a pharmaceutically acceptable salt thereof, or a pharmaceutically acceptable prodrug ester thereof, comprising cleaving a lactam of formula II wherein the symbols are as defined, with a base; and precursors therefor and processes for the preparation of the precursors. The compounds of Formula I are pharmaceutically active compounds which are selective inhibitors of Cyclooxygenase II.

Abstract: Interference within a wireless apparatus is mitigated by adjusting one or more transmission characteristics associated with an interconnect of the apparatus. In at least one embodiment, the interconnect is a PCI Express interconnect.

Abstract: A method and apparatus are provided for broadband cancellation of interference signals. A signal transmitted on one communication path acts as an interference signal to a receiver on a second communication path in the system. In an embodiment, a signal transmitted from an antenna using one wireless standard, or protocol, acts as an interference signal for another antenna, co-located in the same system, using another wireless standard, or protocol, and operating in the same or nearby frequency bands. A time delay is applied to a signal sampled from the interference signal to provide substantially broadband cancellation of the interference signal. The sampled signal may be attenuated to match the amplitude of the interference signal on the second communication path. Coupling of the sampled signal from one communication path to the other communication path can provide an 180° phase shift to the sampled signal.