Abstract: A photoresist apparatus and a method are provided. The photoresist apparatus includes a pre-baking apparatus. The pre-baking apparatus includes: a hot-plate, a first cover over the hot-plate, a second cover over the first cover, a first heating element extending along a topmost surface of the first cover, and a second heating element extending along a topmost surface of the second cover.

Abstract: A method includes the following steps. A seed layer is formed over a structure having at least one semiconductor die. A first patterned photoresist layer is formed over the seed layer, wherein the first patterned photoresist layer includes a first opening exposing a portion of the seed layer. A metallic wiring is formed in the first opening and on the exposed portion of the seed layer. A second patterned photoresist layer is formed on the first patterned photoresist layer and covers the metallic wiring, wherein the second patterned photoresist layer includes a second opening exposing a portion of the metallic wiring. A conductive via is formed in the second opening and on the exposed portion of the metallic wiring. The first patterned photoresist layer and the second patterned photoresist layer are removed. The metallic wiring and the conductive via are laterally wrapped around with an encapsulant.

Abstract: A photoresist apparatus and a method are provided. The photoresist apparatus includes a pre-baking apparatus. The pre-baking apparatus includes: a hot-plate, a first cover over the hot-plate, a second cover over the first cover, a first heating element extending along a topmost surface of the first cover, and a second heating element extending along a topmost surface of the second cover.

Abstract: A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically coupling to the first plurality of through-vias. The first plurality of through-vias include an array. The second plurality of through-vias are outside of the first array, and the second plurality of through-vias are larger than the first plurality of through-vias.

Abstract: A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically coupling to the first plurality of through-vias. The first plurality of through-vias include an array. The second plurality of through-vias are outside of the first array, and the second plurality of through-vias are larger than the first plurality of through-vias.

Abstract: The display substrate includes a driving structure layer disposed on a base substrate, a light emitting structure layer disposed on the side of the driving structure layer away from the base substrate, and a modulation structure layer disposed on the side of the light emitting structure layer away from the base substrate; the modulation structure layer includes a light extraction layer and a light block layer, the light extraction layer is disposed on the side of a cathode in the light emitting structure layer away from the base substrate, the light block layer is disposed on the side of the light extraction layer away from the base substrate, the refractive index of the light extraction layer is greater than the refractive indexes of the cathode and the light block layer, and the light block layer is configured to block ultraviolet rays from being incident on a pixel definition layer.

Abstract: An organic-light-emitting-diode device and a fabricating method thereof, a displaying base plate and a displaying device, wherein the organic-light-emitting-diode device includes a substrate, and an anode layer, an organic functional layer and a cathode layer that are provided in stacking on one side of the substrate, wherein the organic functional layer includes a first functional layer, a second functional layer and a light emitting layer that are provided in stacking, and the first functional layer is provided closer to the anode layer; and a HOMO energy level of the second functional layer is deeper than both of a HOMO energy level of the first functional layer and a HOMO energy level of a host material of the light emitting layer.

Abstract: A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically coupling to the first plurality of through-vias. The first plurality of through-vias include an array. The second plurality of through-vias are outside of the first array, and the second plurality of through-vias are larger than the first plurality of through-vias.

Abstract: An array substrate (100) includes a first type of electroluminescent diode (110). The first type of electroluminescent diode (110) includes a first electrode (111), alight emitting structure layer (112) comprising nanoparticles (114), and a second electrode (113) disposed in a stacked manner. The nanoparticles (114) may be configured to increase luminous efficiency of the first type of electroluminescent diode (110).

Abstract: A package includes a device die, an encapsulant encapsulating the device die therein, a first plurality of through-vias penetrating through the encapsulant, a second plurality of through-vias penetrating through the encapsulant, and redistribution lines over and electrically coupling to the first plurality of through-vias. The first plurality of through-vias include an array. The second plurality of through-vias are outside of the first array, and the second plurality of through-vias are larger than the first plurality of through-vias.

Abstract: The disclosure discloses an apparatus for detecting an electromagnetic touch.

Abstract: A method includes the following steps. A seed layer is formed over a structure having at least one semiconductor die. A first patterned photoresist layer is formed over the seed layer, wherein the first patterned photoresist layer includes a first opening exposing a portion of the seed layer. A metallic wiring is formed in the first opening and on the exposed portion of the seed layer. A second patterned photoresist layer is formed on the first patterned photoresist layer and covers the metallic wiring, wherein the second patterned photoresist layer includes a second opening exposing a portion of the metallic wiring. A conductive via is formed in the second opening and on the exposed portion of the metallic wiring. The first patterned photoresist layer and the second patterned photoresist layer are removed. The metallic wiring and the conductive via are laterally wrapped around with an encapsulant.

Abstract: The present disclosure provides a manufacturing method and a processing device for a display substrate. The display substrate includes a light emitting device. The manufacturing method includes: applying an electrical signal to the display substrate to generate aging current flowing through the light emitting device; and applying a magnetic field to the display substrate for at least part of a time, during which the electrical signal is applied to the display substrate. The magnetic field is used to increase the aging current.

Abstract: Provided is a method for manufacturing a display panel. First, the method includes sequentially preparing an anode layer and a first pixel define layer on a side of a substrate layer, then coating an organic light-induced material on a first surface, distal from the anode layer, of the first pixel define layer, and forming a polymer film layer by reacting the first pixel define layer with the organic light-induced material under a predetermined condition, and then preparing an organic functional layer and a cathode layer on a surface, distal from the first pixel define layer, of the organic light-induced material. The organic light-induced material at least contains a hydroxyl group and an unsaturated carbon-carbon double bond.

Abstract: A photoresist apparatus and a method are provided. The photoresist apparatus includes a pre-baking apparatus. The pre-baking apparatus includes: a hot-plate, a first cover over the hot-plate, a second cover over the first cover, a first heating element extending along a topmost surface of the first cover, and a second heating element extending along a topmost surface of the second cover.

Abstract: A method includes the following steps. A seed layer is formed over a structure having at least one semiconductor die. A first patterned photoresist layer is formed over the seed layer, wherein the first patterned photoresist layer includes a first opening exposing a portion of the seed layer. A metallic wiring is formed in the first opening and on the exposed portion of the seed layer. A second patterned photoresist layer is formed on the first patterned photoresist layer and covers the metallic wiring, wherein the second patterned photoresist layer includes a second opening exposing a portion of the metallic wiring. A conductive via is formed in the second opening and on the exposed portion of the metallic wiring. The first patterned photoresist layer and the second patterned photoresist layer are removed. The metallic wiring and the conductive via are laterally wrapped around with an encapsulant.

Abstract: An organic-light-emitting-diode device and a fabricating method thereof, a displaying base plate and a displaying device, wherein the organic-light-emitting-diode device includes a substrate, and an anode layer, an organic functional layer and a cathode layer that are provided in stacking on one side of the substrate, wherein the organic functional layer includes a first functional layer, a second functional layer and a light emitting layer that are provided in stacking, and the first functional layer is provided closer to the anode layer; and a HOMO energy level of the second functional layer is deeper than both of a HOMO energy level of the first functional layer and a HOMO energy level of a host material of the light emitting layer.

Abstract: A photoresist apparatus and a method are provided. The photoresist apparatus includes a pre-baking apparatus. The pre-baking apparatus includes: a hot-plate, a first cover over the hot-plate, a second cover over the first cover, a first heating element extending along a topmost surface of the first cover, and a second heating element extending along a topmost surface of the second cover.

Abstract: The present disclosure provides a manufacturing method and a processing device for a display substrate. The display substrate includes a light emitting device. The manufacturing method includes: applying an electrical signal to the display substrate to generate aging current flowing through the light emitting device; and applying a magnetic field to the display substrate for at least part of a time, during which the electrical signal is applied to the display substrate. The magnetic field is used to increase the aging current.

Abstract: The disclosure discloses an apparatus for detecting an electromagnetic touch.