Patents by Inventor Dean Pan

Dean Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150225813
    Abstract: The invention belongs to the field of recycling of resources, in particular to a method for waste rare earth luminescent material by dual hydrochloric acid. First hydrochloric acid was used to dissolve the red phosphor powder (Y2O3:Eu) priority, and yttrium-rich rare earth chloride solution and residue were obtained after filtered. Residue's major components were green and blue phosphor powder, and the removal of Ca2+ in filtrate was conducted by using Na2SO4, and CaSO4 precipitation separation was conducted to get rich rare earth chloride solution, europium and yttrium. Residue was mixed with alkali to perform alkaline fusion at high temperature to decompose green and blue powder, then sodium aluminate, magnesium, barium and rare earth oxides were obtained. Alkaline fusion products were washed with water, and filtered, and then sodium aluminate solution and residues containing rare earth oxides were obtained.
    Type: Application
    Filed: January 17, 2013
    Publication date: August 13, 2015
    Applicant: UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING
    Inventors: Shengen Zhang, Hu Liu, Dean Pan, Jianjun Tian, Min Yang
  • Publication number: 20130091987
    Abstract: The invention provides a pollution-free reuse method for iron-based grinding waste, involving the technology of recycling economy, with special reference to the metallurgical industry, iron-based grinding waste green recycling technology. The present invention of the iron grinding waste recycling and reuse methods includes degreasing, heat treatment, sieving, matching, and obtains iron-based alloyed powders, which can be used in SHS lined steel pipe, powder metallurgy structural component, magnetic grinding, thermal spray. More than 95% iron-based alloyed powders can be recycled from wide source of iron-based grinding waste. The invention has the advantage of low cost, no secondary pollution and wide application.
    Type: Application
    Filed: August 16, 2012
    Publication date: April 18, 2013
    Applicant: UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING
    Inventors: Shengen ZHANG, Bo LIU, Jianjun TIAN, Dean PAN, Bin LI
  • Publication number: 20120318681
    Abstract: The invention related to the recycling field of waste printed circuit boards (WPCB), and especially involved a complete non-cyanogens wet process for green recycling of WPCB, which belonged to the field of recycle economy. In the invention, the process included that WPCB were broken by the jaw crusher, and then mixed copper powders and nonmetallic powders were separated by the method of air classification, the mixed copper powders were smelted and casted to get copper anode plates, the copper was purified by electrolytion, the valuable metals (such as copper, gold, silver, platinum and palladium, lead and tin) were recycled from the copper anode slime, and the waste water was recycled. The recovery ratio of all-metal was above 98%. The purity of the cathode copper was up to 4N level. The ratio of de-coppering was above 96%. The recovery ratio of gold was above 98.
    Type: Application
    Filed: August 29, 2012
    Publication date: December 20, 2012
    Applicant: UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING
    Inventors: Shengen ZHANG, Bin LI, Dean PAN, Jianjun TIAN, Bo LIU
  • Publication number: 20040043536
    Abstract: A method of producing individual integrated circuit package units includes the steps of: providing a base which includes a leadframe, a plurality of package precursors, and a continuous encapsulating epoxy layer bonded integrally with the leadframe; and singulating the package precursors. The leadframe has a plurality of metallic connection bars and extension parts formed integrally with the connection bars. The package precursors are singulated by cutting the leadframe and the epoxy layer along first and second cutting streets. The cutting of the base is performed by cutting into the first and second cutting streets with a cutting tool, which can be a single-blade or dual-blade, thereby separating the connection bars from the inner leads.
    Type: Application
    Filed: August 22, 2003
    Publication date: March 4, 2004
    Applicant: Uni-Tek System, Inc.
    Inventors: Dick Hong, Dean Pan, Ching-Yi Tsai