Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.

Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract: Systems and methods of interconnecting devices may include a connector assembly having a substrate, a set of input/output (IO) contacts, an antenna structure and transceiver logic. In one example, the transceiver logic may process one or more IO signals associated with the antenna structure and process one or more IO signals associated with the set of IO contacts.

Abstract: Embodiments of a folded meta-inspired antenna for dual-band operation and user equipment for dual-band operation in a wireless network are generally described herein. In some embodiments, the folded meta-inspired antenna may include first and second conductive layers disposed on opposite sides of a substrate to provide a wideband distributed structure comprising a plurality of high-Q resonances resulting from, at least in part, metamaterial-based loading. Conductive material on the first side of the substrate is arranged around a central longitudinal slot coupled with a plurality of perpendicular slots. For dual-band operation, the folded meta-inspired antenna may operate as a folded monopole at a higher frequency band and operate as a slot-type radiator at a lower frequency band. The plurality of resonances may cause the folded meta-inspired antenna to achieve broader bandwidth at both lower and higher frequency bands.

Abstract: According to various aspects of the present disclosure, devices and methods are disclosed that include communication platform including a small form factor platform having a system-on-package architecture. The system-on-package architecture may be arranged as a stack of layers including: a first layer of the stack of layers having a first conformable material; a second layer of the stack of layers having a second conformable material; a third layer of the stack of layers having a third material, wherein the first conformable material and the second conformable material are more flexible than the third material; and one or more electronic components embedded within the stack of layers, wherein the one or more electronic components are configured to process a received wireless signal.

Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.

Abstract: Systems and methods to generate maps or models of structures are disclosed. Features of the structure to be mapped may be determined for the purposes of generating the map or model based at least in part on images associated with the structure, sensor measurements associated with the structure, and phase data of communications signals that interact with the structure. The mapping or modeling processes may be performed at a mapping server that receives images, sensor data, and/or communications signal phase information from one or more user devices, such as mobile devices. The mapping servers may perform a simultaneous localization and mapping (SLAM) process and may enhance the generated maps using sensor and/or communications phase data to map one or more hidden features of the structure.

Abstract: According to various aspects of the present disclosure, devices and methods are disclosed that include communication platform including a small form factor platform having a system-on-package architecture. The system-on-package architecture may be arranged as a stack of layers including: a first layer of the stack of layers having a first conformable material; a second layer of the stack of layers having a second conformable material; a third layer of the stack of layers having a third material, wherein the first conformable material and the second conformable material are more flexible than the third material; and one or more electronic components embedded within the stack of layers, wherein the one or more electronic components are configured to process a received wireless signal.

Abstract: Systems and methods of interconnecting devices may include a connector assembly having a substrate, a set of input/output (IO) contacts, an antenna structure and transceiver logic. In one example, the transceiver logic may process one or more IO signals associated with the antenna structure and process one or more IO signals associated with the set of IO contacts.

Abstract: Embodiments of a folded meta-inspired antenna for dual-band operation and user equipment for dual-band operation in a wireless network are generally described herein. In some embodiments, the folded meta-inspired antenna may include first and second conductive layers disposed on opposite sides of a substrate to provide a wideband distributed structure comprising a plurality of high-Q resonances resulting from, at least in part, metamaterial-based loading. Conductive material on the first side of the substrate is arranged around a central longitudinal slot coupled with a plurality of perpendicular slots. For dual-band operation, the folded meta-inspired antenna may operate as a folded monopole at a higher frequency band and operate as a slot-type radiator at a lower frequency band. The plurality of resonances may cause the folded meta-inspired antenna to achieve broader bandwidth at both lower and higher frequency bands.

Abstract: Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.

Abstract: Disclosed are integration approaches for mm-wave array type architectures using multilayer substrate technologies. For instance, an apparatus may include a first substrate layer, a second substrate layer, and a third substrate layer. The first substrate layer has a first plurality of array elements, and the second substrate layer has a second plurality of array elements. The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements. The first and second substrate layers are separated by approximately a half wavelength (?/2) corresponding to the one or more RF signals.

Abstract: A device and a method for manufacturing it are disclosed. The device contains a plurality of transistors, a plurality of transmission mediums connected to the transistors; and a substrate having a first portion supporting the transistors and the transmission mediums thereon, and further having a plurality of discrete second portions extending from the first portion. The method disclosed teaches how to manufacture the device.

Abstract: A wireless device using natural higher order harmonics on multi-band reconfigurable antenna designs where the antenna higher order resonance is used to build a multi-band to multi-band frequency reconfigurable antenna.

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including a first layer having a first conformable material; a second layer having a second conformable material; one or more electronic components embedded within the stack of layers; and a heat dissipating element configured dissipating heat generating from the one or more electronic components, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract: An embodiment of the present invention provides an apparatus, comprising a multi-band highly isolated planar antenna directly integrated with a front-end module (FEM).

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including: a first layer having a first conformable material; a second layer having a second conformable material; a third layer having a third material; and one or more electronic components embedded within the stack of layers, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.