Abstract: This disclosure describes systems, methods, and devices related to enhanced memory integration. The device may include a compute chiplet configured as a System-on-a-Chip (SoC). The device may include a logic die circuitry coupled to the compute chiplet through a high-speed link. The device may include a memory interface that connects the logic die circuitry to on-package memory. The device may include control circuitry within the logic die circuitry configured to treat the on-package memory as a memory-side cache for an off-package memory. The device may dynamically migrate memory pages between the on-package memory and the off-package memory based on memory access patterns. The device may facilitate efficient data management, optimize memory utilization, and support scalable memory architectures for improved performance.

Abstract: This disclosure describes systems, methods, and devices related to priority packet optimization. For example, a system is described for sideband communication in a universal chiplet interconnect express (UCIe) environment. The system may include a sideband link may include a clock pin and a data pin configured to transmit auxiliary signals between chiplets. The system may include an encoding module configured to generate level-based encodings representing global event notifications. The system may include a notification propagation module configured to distribute global event notifications across a network topology interconnecting the chiplets.

Abstract: A shared memory controller receives, from a computing node, a request associated with a memory transaction involving a particular line in a memory pool. The request includes a node address according to an address map of the computing node. An address translation structure is used to translate the first address into a corresponding second address according to a global address map for the memory pool, and the shared memory controller determines that a particular one of a plurality of shared memory controllers is associated with the second address in the global address map and causes the particular shared memory controller to handle the request.

Abstract: An apparatus may comprise multiplexing circuitry to select an ingress lane from among a plurality of ingress lanes to couple to an egress lane; and retiming circuitry to retime a signal received on the selected ingress lane and transmit the retimed signal on the egress lane.

Abstract: Systems and devices can include a physical layer (PHY) that includes a logical PHY to support multiple interconnect protocols. The logical PHY can include a first set of cyclic redundancy check (CRC) encoders corresponding to a first interconnect protocol, and a second set of CRC encoders corresponding to a second interconnect protocol. A multiplexer can direct data to the first set or the second set of CRC encoders based on a selected interconnect protocol. The logical PHY can include a first set of error correcting code (ECC) encoders corresponding to the first interconnect protocol and a second set of ECC encoders corresponding to the second interconnect protocol. The multiplexer can direct data to the first set or the second set of ECC encoders based on the selected interconnect protocol. In embodiments, different CRC/ECC combinations can be used based on the interconnect protocol and the link operational conditions.

Abstract: A FEC codec for generating a check byte for a message. The FEC codec includes a port encoder having a storage unit, a Galois field multiplier, and a sum unit. The storage unit stores a first staged result, which is accumulated based on previous sets of input byte of the message for all clock cycles from a first clock cycle to a clock cycle immediately prior to the current clock cycle. The Galois field multiplier performs a Galois field multiplication of the first staged result and a power of the alpha to generate a Galois field product. The sum unit performs a Galois field addition on an internal input based on a consolidated byte for the current clock cycle and the Galois field product to generate a second staged result for subsequent use to generate the check byte. Other embodiments may be described and/or claimed.

Abstract: The present disclosure describes a number of embodiments related to devices and techniques for implementing an interconnect switch to provide a switchable low-latency bypass between node resources such as CPUs and accelerator resources for caching. A resource manager may be used to receive an indication of a node of a plurality of nodes and an indication of an accelerator resource of a plurality of accelerator resources to connect to the node. If the indicated accelerator resource is connected to another node of the plurality of nodes, then transmit, to a interconnect switch, one or more hot-remove commands. The resource manager may then transmit to the interconnect switch one or more hot-add commands to connect the node resource and the accelerator resource.

Abstract: In one embodiment, an apparatus includes: a first link layer circuit to perform link layer functionality for a first communication protocol; and a logical physical (logPHY) circuit coupled to the first link layer circuit via a logical PHY interface (LPIF) link, the logPHY circuit to communicate with the first link layer circuit in a flit mode in which the first information is communicated in a fixed width size and to communicate with another link layer circuit in a non-flit mode. Other embodiments are described and claimed.

Abstract: A port of a computing device is to communicate with another device over a link, the port including physical layer logic of a first protocol, link layer logic of each of a plurality of different protocols, and protocol negotiation logic to determine which of the plurality of different protocols to apply on the link. The protocol negotiation logic is to send and receive ordered sets in a configuration state of a link training state machine of the first protocol, where the ordered sets include an identifier of a particular one of the plurality of different protocols. The protocol negotiation logic is to determine from the ordered sets that a link layer of the particular protocol is to be applied on the link.

Abstract: In one embodiment, an apparatus includes a port to transmit and receive data over a link; and protocol stack circuitry to implement one or more layers of a load-store input/output (I/O)-based protocol (e.g., PCIe or CXL) across the link. The protocol stack circuitry constructs memory write request transaction layer packets (TLPs) for memory write transactions, wherein fields of the memory write request TLPs indicate a virtual channel (VC) other than VC0, that a completion is required in response to the memory write transaction, and a stream identifier associated with the memory write transaction. The memory write request TLP is transmitted over the link and a completion TLP is received over the link in response, indicating a completion for the memory write request TLP.

Abstract: A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration. The PHY utilizes the serial, differential link during the duration for a PHY associated task selected from a group including an in-band reset, an entry into low power state, and an entry into partial width state.

Abstract: Systems and devices can include an error injection register comprising error injection parameter information. The systems and devices can also include error injection logic circuit to read error injection parameter information from the error injection register, and inject an error into a flow control unit (Flit); and protocol stack circuitry to transmit the Flit comprising the error on a multilane link. The injected error can be detected by a receiver and used to test and characterize various aspects of a link, such as bit error rate, error correcting code, cyclic redundancy check, replay capabilities, error logging, and other characteristics of the link.

Abstract: A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration. The PHY utilizes the serial, differential link during the duration for a PHY associated task selected from a group including an in-band reset, an entry into low power state, and an entry into partial width state.

Abstract: Systems, methods, and apparatuses can include transmission-side protocol stack circuitry comprising first cyclic redundancy check (CRC) circuitry to determine first CRC code for a first set of information and to determine second CRC code for a second set of information; and Flit encoding circuitry to encode a first portion of a Flit with the first set of information and the first CRC code, the Flit encoding circuitry to encode a second portion of the Flit with the second set of information and the second CRC code. Receiver-side protocol stack circuitry can include a low-latency path comprising first CRC check circuitry to perform a CRC check on a first portion of a received Flit. Receiver-side protocol stack circuitry can include a non-low-latency path comprising forward error correction (FEC) decoder circuitry to perform FEC on received Flits, and second CRC check circuitry to perform CRC check on received Flits that pass FEC.

Abstract: Aspects of the embodiments are directed to a port comprising hardware to support the multi-lane link, the link comprising a lane that comprises a first differential signal pair and a second differential signal pair. Link configuration logic, implemented at least in part in hardware circuitry, can determine that the port comprises hardware to support one or both of receiving data on the first differential signal pair or transmitting data on the second differential signal pair, and reconfigure the first differential signal pair to receive data with the second differential signal pair or reconfigure the second differential signal pair to transmit data with the first differential signal pair; and wherein the port is to transmit data or receive data based on reconfiguration of one or both the first differential signal pair and the second differential signal pair.

Abstract: Systems and apparatuses can include a receiver that includes port to receive a flow control unit (Flit) across a link, the link comprising a plurality of lanes. The receiver can also include error detection circuitry to determine an error in the Flit, an error counter to count a number of errors received, the error counter to increment based on an error detected in the Flit by the error detection circuitry, a Flit counter to count a number of Flits received, the Flit counter to increment based on receiving a Flit, and bit error rate logic to determine a bit error rate based on a count recorded by the error counter and a number of bits received as indicated by the Flit counter. The systems and apparatuses can apply processes to perform direct BER measurements at the receiver.

Abstract: Aspects of the embodiments are directed to systems, methods, and computer program products that facilitate a downstream port to operate in Separate Reference Clocks with Independent Spread Spectrum Clocking (SSC) (SRIS) mode. The system can determine that the downstream port supports one or more SRIS selection mechanisms; determine a system clock configuration from the downstream port to a corresponding upstream port connected to the downstream port by the PCIe-compliant link; set an SRIS mode in the downstream port; and transmit data across the link from the downstream port using the determined system clock configuration.

Abstract: For example, an Integrated Circuit, e.g., a chiplet, may include Physical layer (PHY) circuitry to communicate with another IC, e.g., chiplet, over a Universal Chiplet Interconnect Express (UCIe) link. For example, the IC may include a System on Chip (SoC) bridge, which may be configured to transport a plurality of Management Transport Packets (MTPs) over a plurality of connection links of the UCIe link. For example, the SoC bridge may be configured to transport the plurality of MTPs according to a predefined interleaving scheme. For example, the predefined interleaving scheme may define a predefined order of assignment of a plurality of credit-path MTPs to a plurality of Receive (R×) Queue Identifiers (R×Q-IDs) corresponding to the plurality of connection links.

Abstract: For example, an electronic system may include interconnect circuitry to communicate over an electrical interconnect; and a Physical layer (PHY) controller configured to access a plurality of optical-capability registers to identify optical-training control information and optical-capability information. For example, the optical-training control information may include a start-training bit. For example, based on a determination that the start-training bit is set to a predefined value, the PHY controller may initiate an optical-based link training procedure via the electrical interconnect to train a link between the electronic system and a partner electronic system over a redriver-based optical interconnect. For example, the optical-based link training procedure may be based on the optical-capability information.

Abstract: Technologies for a unified debug and test architecture in chiplets is disclosed. In an illustrative embodiment, several chiplets are integrated on an integrated circuit package. The chiplets are connected by a package interconnect, such as a universal chiplet interconnect express (UCIe) interconnect. Each chiplet includes several debug nodes, which are connected by an on-chiplet network. One of the chiplets, referred to as a package debug endpoint, acts as a link endpoint for an off-package link, such as a peripheral component interconnect express (PCIe) link. In use, debug messages can be sent to the package debug endpoint over a PCIe link. The debug messages can be routed within the chiplets and between chiplets, allowing for the debug functionality at each debug node to be probed using a common protocol. In this manner, chiplets from different vendors can be integrated into the same package and tested using common software.