Abstract: Implementations relate to determining a rendering type for an application that is executing automatically. Based on user interactions with an application that is associated with specified input from the user while the user is interacting with the application, a confidence metric is generated for each specified input and a rendering type is determined based on the confidence metrics. Subsequently, when the user requests that a sequence of actions be performed, the application will be displayed according to the rendering type.

Abstract: Implementations relate to determining a rendering type for an application that is executing automatically. Based on user interactions with an application that is associated with specified input from the user while the user is interacting with the application, a confidence metric is generated for each specified input and a rendering type is determined based on the confidence metrics. Subsequently, when the user requests that a sequence of actions be performed, the application will be displayed according to the rendering type.

Abstract: A method include receiving a natural language prompt from a user comprising a command to generate a code script for an automated assistant to perform a routine. The routine includes multiple discrete actions specified by the natural language prompt. The method further includes processing, by a pre-trained large language model (LLM), the natural language prompt to generate the code script as an LLM output, and processing the code script to determine the code script is incomplete, thereby rendering the code script unsuitable for the automated assistant to fulfill performance of the routine. Based on determining the code script is incomplete, the method includes issuing a user prompt soliciting the user to provide additional information needed to complete the code script and receiving user input of the additional information needed to complete the code script. The method includes supplementing the code script with the additional information to render completed code script.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes first and second bottom dies on a package substrate, first top dies on the first bottom die, and second top dies on the second bottom die. The semiconductor package includes thermally conductive slugs on the first bottom die and the second bottom die. The thermally conductive slugs are comprised of a high thermal conductive material. The thermally conductive slugs are positioned directly on outer edges of top surfaces of the first and second bottom dies, inner edges of the top surfaces of the first and second bottom dies, and/or a top surface of the package substrate. The high thermal conductive material of the thermally conductive slugs is comprised of copper, silver, boron nitride, or graphene. The thermally conductive slugs may have two different thicknesses. The semiconductor package may include an active die and/or an integrated heat spreader with the pedestals.

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

Abstract: According to the various examples, a fully integrated system and method for failure analysis using RF-based thermometry enable the detection and location of defects and failures in complex semiconductor packaging architectures. The system provides synchronous amplified RF signals to generate unique thermal signatures at defect locations based on dielectric relaxation loss and heating.

Abstract: Embodiments may relate an x-ray filter. The x-ray filter may be configured to be positioned between an x-ray source output and a device under test (DUT) that is to be x-rayed. The x-ray filter may include at least 80% titanium (Ti) by weight. Other embodiments may be described or claimed.

Abstract: Systems and methods of sample preparation using dual ion beam trenching are described. In an example, an inside of a semiconductor package is non-destructively imaged to determine a region of interest (ROI). A mask is positioned over the semiconductor package, and a mask window is aligned with the ROI. A first ion beam and a second ion beam are swept, simultaneously or sequentially, along an edge of the mask window to trench the semiconductor package and to expose the ROI for analysis.

Abstract: Embodiments disclosed herein include thermoelectric cooling (TEC) dies for multi-chip packages. In an embodiment, a TEC die comprises a glass substrate and an array of N-type semiconductor vias and P-type semiconductor vias through the glass substrate. In an embodiment, conductive traces are over the glass substrate, and individual ones of the conductive traces connect an individual one of the N-type semiconductor vias to an individual one of the P-type semiconductor vias.

Abstract: According to various examples, a method for non-destructive detection of defects in a semiconductor die is described. The method may include positioning an emitter above the semiconductor die. The method may include generating an emitted wave using the emitter that is directed to a focal point on a surface of the die. The method may include generating a reflected wave from the focal point. The focal point may act as a point source reflecting the emitted wave. The method may include positioning a receiver above the die to receive the reflected wave. The method may also include measuring the reflected wave to detect modulations in amplitude in the reflected wave.

Abstract: A distributed system including multiple processing nodes. The distributed system can perform certain acts. The acts can include receiving a first conflation event identifying a first node and a second node. The first node can be part of a first set. The first set can include a sole parent node stored at a first processing node of the multiple processing nodes. The second node can be part of a second set. The second set can include a sole parent node stored at a second processing node of the multiple processing nodes. The first and second sets can be disjoint sets. The first conflation event can be received at an event-driven stream application at one of the multiple processing nodes. The acts also can include conflating the first set and the second set into a conflated set. The conflated set can include the first and second nodes. The conflated set can include a sole parent node.

Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.

Abstract: According to the various examples, a fully integrated system and method for failure analysis using RF-based thermometry enable the detection and location of defects and failures in complex semiconductor packaging architectures. The system provides synchronous amplified RF signals to generate unique thermal signatures at defect locations based on dielectric relaxation loss and heating.

Abstract: According to various examples, a method for non-destructive detection of defects in a semiconductor die is described. The method may include positioning an emitter above the semiconductor die. The method may include generating an emitted wave using the emitter that is directed to a focal point on a surface of the die. The method may include generating a reflected wave from the focal point. The focal point may act as a point source reflecting the emitted wave. The method may include positioning a receiver above the die to receive the reflected wave. The method may also include measuring the reflected wave to detect modulations in amplitude in the reflected wave.

Abstract: A system and method of bootstrapping replicas from existing partitions is disclosed. A distributed database is maintained by a system. The distributed database includes a first partition copy and a second partition copy each containing a database. A failure of the first partition copy is detected and a third partition copy including an empty database is generated. The database of the second partition copy is copied to the empty database of the third partition copy and the third partition copy is designated as one of an active partition copy or a replica partition copy.

Abstract: A distributed system including multiple processing nodes. The distributed system can perform certain acts. The acts can include receiving a first conflation event identifying a first node and a second node. The first node can be part of a first set. The first set can include a sole parent node stored at a first processing node of the multiple processing nodes. The second node can be part of a second set. The second set can include a sole parent node stored at a second processing node of the multiple processing nodes. The first and second sets can be disjoint sets. The first conflation event can be received at an event-driven stream application at one of the multiple processing nodes. The acts also can include conflating the first set and the second set into a conflated set. The conflated set can include the first and second nodes. The conflated set can include a sole parent node.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes first and second bottom dies on a package substrate, first top dies on the first bottom die, and second top dies on the second bottom die. The semiconductor package includes thermally conductive slugs on the first bottom die and the second bottom die. The thermally conductive slugs are comprised of a high thermal conductive material. The thermally conductive slugs are positioned directly on outer edges of top surfaces of the first and second bottom dies, inner edges of the top surfaces of the first and second bottom dies, and/or a top surface of the package substrate. The high thermal conductive material of the thermally conductive slugs is comprised of copper, silver, boron nitride, or graphene. The thermally conductive slugs may have two different thicknesses. The semiconductor package may include an active die and/or an integrated heat spreader with the pedestals.

Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.

Abstract: This application relates to apparatus and methods for automatically determining and providing digital advertisements to targeted users. In some examples, a computing device receives campaign data identifying items to advertise on a website, and generates campaign user data identifying a user that has engaged all of the items on the website. The computing device may then determine a portion of the users based on a relationship between each user and the campaign user data, and may determine user-item values for each of the items for each user of the portion of users, where each user-item value identifies a relational value between the corresponding user and item. The computing device may then identify one or more of the items to advertise to each user of the portion of users based on the user-item values, and may transmit to a web server an indication of the items to advertise for each user.