Abstract: A method for lithium aluminum film packaging materials, with water, high temperature and corrosion resistance, the substrate layer, and then layer, aluminum foil layer, anti-corrosion layer, adhesive layer and the inner layer together constitute from the outermost to innermost layer laminate structure in which one side of the aluminum foil layer, or both side surface of the conductive coating material to said coating and curing anticorrosive layer, and the use of fluorine-containing polyurethane resin constituting the laminated rubber layer and the inner layer of corrosion between the adhesive layer, used lithium batteries as plastic film packaging applications, it can promote lithium battery with Merit water resistance, high temperature resistance and corrosion resistance, and enhance the use of lithium batteries in years.

Abstract: A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.

Abstract: A modified polyester resin composition comprises a combination of a PET polyester, a PCT polyester, a CHDM modified copolyester comprising PCTA, PCTG or PETG, and a modified polymer at least comprising TPU or EPDM, wherein the modified polymer accounts for 3-25 wt % and the rest accounts for 97-75 wt %, based on the total weight of the resin; and the modified polyester resin composition is suited for use in a halogen-free, heavy metal-free, and volatile organic compound-free polyester-based plastic floor tile excellent in higher resistance to wear and tear, better tensile strength, more preferable resistance to both lit cigarette e and solvents, and particularly being friendliness to environment and not hazardous to health.

Abstract: A modified polyester resin composition comprises a combination of a PET polyester, a PCT polyester, a CHDM modified copolyester comprising PCTA, PCTG or PETG, and a modified polymer at least comprising TPU or EPDM, wherein the modified polymer accounts for 3-25 wt % and the rest accounts for 97-75 wt %, based on the total weight of the resin; and the modified polyester resin composition is suited for use in a halogen-free, heavy metal-free, and volatile organic compound-free polyester-based plastic floor tile excellent in higher resistance to wear and tear, better tensile strength, more preferable resistance to both lit cigarette e and solvents, and particularly being friendliness to environment and not hazardous to health.

Abstract: A modified bismaleimide resin is made by modify bismaleimide with aromatic diamine that contains fluoro substituents through chain-growth polymerization; and modified bismaleimide resin is excellent in physical properties including a low dielectric constant Dk (3 GHz) less than 3.0, a dissipation factors (3 GHz) less than 0.02, a low resin water absorptivity ranging from 0.21% to 0.33% and an excellent processability, and is particularly suited for producing a copper clad laminate that is required to have dielectric constant Dk (3 GHz) less than 3.

Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).

Abstract: A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.

Abstract: A modified polyester resin composition comprises a combination of a PET polyester, a PCT polyester, a CHDM modified copolyester comprising PCTA, PCTG or PETG, and a modified polymer at least comprising TPU or EPDM, wherein the modified polymer accounts for 3-25 wt % and the rest accounts for 97-75 wt %, based on the total weight of the resin; and the modified polyester resin composition is suited for use in a halogen-free, heavy metal-free, and volatile organic compound-free polyester-based plastic floor tile excellent in higher resistance to wear and tear, better tensile strength, more preferable resistance to both lit cigarette e and solvents, and particularly being friendliness to environment and not hazardous to health.

Abstract: A modified bismaleimide resin is made by modify bismaleimide with aromatic diamine that contains fluoro substituents through chain-growth polymerization; and modified bismaleimide resin is excellent in physical properties including a low dielectric constant Dk (3 GHz) less than 3.0, a dissipation factors (3 GHz) less than 0.02, a low resin water absorptivity ranging from 0.21% to 0.33% and an excellent processability, and is particularly suited for producing a copper clad laminate that is required to have dielectric constant Dk (3 GHz) less than 3.

Abstract: A high-frequency copper claded laminate for use in an operational frequency of at least 1 GHz possesses properties of dielectric constant (Dk) less than 3.2, dissipation factor (Df) less than 0.005, high glass transition temperature, high thermal stability and low moisture absorption; the laminate contains a tack-free prepreg constituted by a reinforcement impregnated with an inventive resin mixture at least comprising a high-molecular-weight polybutadiene resin, a low-molecular-weight polybutadiene resin, a modified thermosetting polyphenylene ether resin and an inorganic powder; and particularly the tack-free prepreg can be processed into the copper claded laminates through automated layup processing to satisfy a long-felt but unmet needs in the filed of producing copper claded laminate.

Abstract: A process for producing polyphenylene ether involves to keep a combustible solvent at a gaseous concentration below the minimums of explosion, to keep oxygen gas supplied at a gaseous concentration below the limiting oxygen concentration (LOC) of the solvent, and to make use of a reactor having a rotary-sealed mixer sealed with magnetic rotary feedthroughs to prevent static electricity generated, and then to improve safety and yield thereof.

Abstract: A weather-resistant crosslinked polyolefin composition is a novel formula containing a comprehensive mixture constituted by crosslinking agent, antistatic agent, TiO2 sized in nanometer and TiO2 sized in micrometer and essential components including polyolefin composition resin, lubricant auxiliary crosslinking agent, antioxidant, UV absorber and filler etc; this novel formula is particularly suited to produce a weather-resistant crosslinked polyolefin sheet with a calender machine instead of an extruder conventionally used, and the polyolefin sheets produced thereof are excellent in both heat-resistant and weather-resistant as well as in a high-quality sheet surface and capably made at a high yield rate through the calender machine.

Abstract: A process for producing polyphenylene ether involves to keep a combustible solvent at a gaseous concentration below the minimums of explosion, to keep oxygen gas supplied at a gaseous concentration below the limiting oxygen concentration (LOC) of the solvent, and to make use of a reactor having a rotary-sealed mixer sealed with magnetic rotary feedthroughs to prevent static electricity generated, and then to improve safety and yield thereof.

Abstract: An inorganic filler coated with molybdenum compound used as an additive is added into a resin mixture in an amount of 20 to 80 wt % of the resin mixture, resulted in that printed circuit boards if made from a laminate or a prepreg containing the resin mixture have properties of a low coefficient of thermal expansion, good heat tolerance and excellent drilling processability.

Abstract: A method for lithium aluminum film packaging materials, with water, high temperature and corrosion resistance, the substrate layer, and then layer, aluminum foil layer, anti-corrosion layer, adhesive layer and the inner layer together constitute from the outermost to innermost layer laminate structure in which one side of the aluminum foil layer, or both side surface of the conductive coating material to said coating and curing anticorrosive layer, and the use of fluorine-containing polyurethane resin constituting the laminated rubber layer and the inner layer of corrosion between the adhesive layer, used lithium batteries as plastic film packaging applications, it can promote lithium battery with Merit water resistance, high temperature resistance and corrosion resistance, and enhance the use of lithium batteries in years.

Abstract: The present invention of three-stage process relates to preparing hollow particles with a buffer layer, exhibiting integrity of particle structure and uniformity of particle size, used in plastic or paper coating, and showing superior characteristics of gloss, whiteness, high opacity, high printing color density and good water resistance.

Abstract: A transparent heat-shielding material having a chemical formula CsXNYWO3-ZClC, characterized by being co-doped with elements of different groups in the periodic table, wherein Cs is cesium; N is tin (Sn) or antimony (Sb) or bismuth (Bi); W is tungsten; O is oxygen; and X, Y, Z, and C are positive numbers satisfying the following conditions: X?1.0, Y?1.0, Y/X?1.0, Z?0.6, and C?0.1; the transparent heat-shielding material is used to make a highly transparent and highly effective heat-shielding film which can be adhered to glass panels of buildings and automobiles to block infrared radiation in the wavelength range of 800-2000 nm, thereby insulating heat and saving energy; and the film is also applicable as a composite substrate for electronic components.

Abstract: A peelable protective film having perfect adhesion for providing temporary protection to objects is disclosed, which protective film having a peel strength ranging between 35 and 100 g/cm is capable of being easily peeled off from an adhered object and without leaving any residual adhesive; a composition containing a vinyl chloride-vinyl acetate copolymer, a high-molecular-weight emulsified, polymerized PVC powder, a low-molecular-weight emulsified, polymerized PVC powder, a trimellitate plasticizer, a diisobutyrate-based plasticizer, a phenol-free Ca—Zn stabilizer, fumed silica, aluminum hydroxide, barium sulfate and calcium carbonate is so suited for making the peelable protective film having a thixotropic index ranging between 2.00 and 2.20.

Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).

Abstract: A peelable protective film having perfect adhesion for providing temporary protection to objects is disclosed, which protective film having a peel strength ranging between 35 and 100 g/cm is capable of being easily peeled off from an adhered object and without leaving any residual adhesive; a composition containing a vinyl chloride-vinyl acetate copolymer, a high-molecular-weight emulsified, polymerized PVC powder, a low-molecular-weight emulsified, polymerized PVC powder, a trimellitate plasticizer, a diisobutyrate-based plasticizer, a phenol-free Ca—Zn stabilizer, fumed silica, aluminum hydroxide, barium sulfate and calcium carbonate is so suited for making the peelable protective film having a thixotropic index ranging between 2.00 and 2.20.