Abstract: The present invention of three-stage process relates to preparing hollow particles with a buffer layer, exhibiting integrity of particle structure and uniformity of particle size, used in plastic or paper coating, and showing superior characteristics of gloss, whiteness, high opacity, high printing color density and good water resistance.

Abstract: A method for making a hindered phenolic antioxidant based on Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate uses a methanol solution containing alkali metal methoxide as a catalyst solution, wherein the catalyst solution is filtered with a filter device with a filter pore diameter of less than 50 ?m to remove insoluble matters therefrom before used in a transesterification process where methyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate and 1-Octadecanol are taken as reactants to obtain a crude product of Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate having high conversion rate and low color, and the crude product further undergoes a purification process for crystallization, filtering and drying to obtain a product of Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate having high purity and low color.

Abstract: A method for preparing esters of cyclohexane polycarboxylic acids from esters of benzene polycarboxylic acids makes improvement to hydrogenation of esters of benzene polycarboxylic acids by using a reaction tank having a gas-introducing mixer capable of extracting and exhausting air and stirring to hydrogenate an ester of a benzene polycarboxylic acids into an ester of a cyclohexane polycarboxylic acid in the presence of a hydrogenation catalyst; resulted in that the method advantageously minimizes the operational pressure for hydrogenating esters of benzene polycarboxylic acids and significantly lowers the reaction temperature for hydrogenation while effectively improving the yield of esters of cyclohexane polycarboxylic acids made from the esters of the benzene polycarboxylic acids.

Abstract: A resin composition includes solid brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0.01-20 wt %, high thermal conductivity powder of 5-85 wt % closest packed by Horsfield packing model and a processing aid of 0-10 wt %; the resin composition possesses high glass transition temperature ranged from 169° C. to 235° C. measured by DSC, high thermal conductivity ranged from 5.7 W/m·K to 14.2 W/m·K, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.

Abstract: An environmentally friendly water-based heat-expandable adhesive panel, having high adhesiveness and containing solvent-free resins, comprises a substrate layer functioning as a base layer, a primer layer coated on the substrate layer and a heat-expandable layer coated on the primer layer, which is for use in an electronic or plastic component processing process to adhesively fix electronic or plastic components in place temporarily and separate, upon completion of the processing process and commencement of a component-reactivating process, the components from the water-based heat-expandable adhesive panel by heating the water-based heat-expandable adhesive panel at a fixed temperature for a specific period of time, so as to reduce volatile organic compound (VOC) emissions and effectuate environmental protection.

Abstract: A hydrogenation process for hydrogenating bisphenol-A-based epoxy resin under low-temperature, low-pressure conditions includes using a hydrogenation reactor that has a gas-distributing agitator functional to introduce and exhaust hydrogen gas and stir liquid reactant, so that hydrogen gas introduced into the hydrogenation reactor can be evenly distributed into a liquid reactant placed into the hydrogenation reactor to make the liquid reactant contain a high level of dissolved hydrogen, which not only enhances activity of an involved hydrogenation catalyst and accelerates hydrogenation reaction, but also allows hydrogenation reaction to be performed in a low-temperature, low-pressure environment. The hydrogenation process improve yield of the hydrogenated bisphenol-A-based epoxy resin to 99.0-99.9%, while significantly reducing building and maintaining costs for the hydrogenation reactor, thus being an economic process.

Abstract: A weather-resistant crosslinked polyolefin composition is a novel formula containing a comprehensive mixture constituted by crosslinking agent, antistatic agent, TiO2 sized in nanometer and TiO2 sized in micrometer and essential components including polyolefin composition resin, lubricant auxiliary crosslinking agent, antioxidant, UV absorber and filler etc; this novel formula is particularly suited to produce a weather-resistant crosslinked polyolefin sheet with a calender machine instead of an extruder conventionally used, and the polyolefin sheets produced thereof are excellent in both heat-resistant and weather-resistant as well as in a high-quality sheet surface and capably made at a high yield rate through the calender machine.

Abstract: A slurry composition containing a cracking agent contains paste 1.5-4.0 wt %, oil 1.0-3.0 wt %, a surfactant 0.2-0.5 wt %, a softening agent 0.1-0.5 wt % and a cracking agent 0.005-5.0 wt %. As compared with the formula of known raw slurry for fiberglass yarn, this slurry composition containing the cracking agent facilitates improving desizing efficiency of fiberglass fabric, lowering the required temperature for the second desizing process, shortening desizing time, reducing the loss on ignition, and enhancing the strength of the fiberglass fabric.

Abstract: The invention provides a heat-resistant anti-static adhesive film having at least includes a top film, a silane-treated release layer on an underlying substrate layer, and a pressure-sensitive adhesive layer coated over the release layer. The pressure-sensitive adhesive layer is obtained by adding a plasticizer, an ionic compound or an anti-static agent, a cross-linking agent and aliphatic or alicyclic multi-functional isocyanate into (meth)acrylate polymer of the reactive silane compound. The composition has a long working life (pot life) of up to 24 hours and anti-static capability. A pressure-sensitive patch or surface protective film containing the abovementioned composition in the form of sheets or strips is capable of standing high temperature of 150 for up to 3 hours without leaving glue residue.

Abstract: A high-frequency copper claded laminate for use in an operational frequency of at least 1 GHz possesses properties of dielectric constant (Dk) less than 3.2, dissipation factor (Df) less than 0.005, high glass transition temperature, high thermal stability and low moisture absorption; the laminate contains a tack-free prepreg constituted by a reinforcement impregnated with an inventive resin mixture at least comprising a high-molecular-weight polybutadiene resin, a low-molecular-weight polybutadiene resin, a modified thermosetting polyphenylene ether resin and an inorganic powder; and particularly the tack-free prepreg can be processed into the copper claded laminates through automated layup processing to satisfy a long-felt but unmet needs in the filed of producing copper claded laminate.

Abstract: An adhesive composition for use in bonding of a polarizing plate is prepared from acrylic-based polymer graft-polymerized and modified by a reactive silane coupling agent with a specific grafting position and an ordinary cross-linking agent. Compared with unmodified acrylic-based copolymers, the adhesive composition thus synthesized demonstrates high adhesion property, cohesion property, elasticity property and high durability and, when used in bonding of the polarizing plate, flexibly follows dimensional changes of the polarizing plate in a high-temperature high-humidity atmosphere, alleviates the phenomenon where the polarizing plate demonstrates uneven distribution of residual stress due to dimensional changes of the polarizing plate, and prevents light leakage and uneven color which might otherwise occur to the polarizing plate due to the aging, cracking, or peeling of a conventional adhesive.

Abstract: A method for preparing esters of cyclohexane polycarboxylic acids from esters of benzene polycarboxylic acids makes improvement to hydrogenation of esters of benzene polycarboxylic acids by using a reaction tank having a gas-introducing mixer capable of extracting and exhausting air and stirring to hydrogenate an ester of a benzene polycarboxylic acids into an ester of a cyclohexane polycarboxylic acid in the presence of a hydrogenation catalyst; resulted in that the method advantageously minimizes the operational pressure for hydrogenating esters of benzene polycarboxylic acids and significantly lowers the reaction temperature for hydrogenation while effectively improving the yield of esters of cyclohexane polycarboxylic acids made from the esters of the benzene polycarboxylic acids.

Abstract: A heat-insulating transparent PVC sheet useful to replace the glass or affixed to the glass is made by a non-coating process for cutting-off infrared and ultra-violet, which production method is an improved traditional process for producing the PVC sheets, and in the production a specific formula of PVC blends containing PVC resin, plasticizer, inorganic heat-insulating particles and other additives is directly used to produce the PVC sheet to keep the properties of PVC and to provide transparency, low haze and an excellent effect for cutting-off infrared and ultra-violet.

Abstract: A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.

Abstract: A hydrogenation process for hydrogenating bisphenol-A-based epoxy resin under low-temperature, low-pressure conditions includes using a hydrogenation reactor that has a gas-distributing agitator functional to introduce and exhaust hydrogen gas and stir liquid reactant, so that hydrogen gas introduced into the hydrogenation reactor can be evenly distributed into a liquid reactant placed into the hydrogenation reactor to make the liquid reactant contain a high level of dissolved hydrogen, which not only enhances activity of an involved hydrogenation catalyst and accelerates hydrogenation reaction, but also allows hydrogenation reaction to be performed in a low-temperature, low-pressure environment. The hydrogenation process improve yield of the hydrogenated bisphenol-A-based epoxy resin to 99.0-99.9%, while significantly reducing building and maintaining costs for the hydrogenation reactor, thus being an economic process.

Abstract: A resin composition includes solid brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0.01-20 wt %, high thermal conductivity powder of 5-85 wt % closest packed by Horsfield packing model and a processing aid of 0-10 wt %; the resin composition possesses high glass transition temperature ranged from 169° C. to 235° C. measured by DSC, high thermal conductivity ranged from 5.7 W/m·K to 14.2 W/m·K, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.

Abstract: An environmentally friendly water-based hot-foam adhesive panel, having high adhesiveness and containing solvent-free resins, comprises a substrate layer functioning as a base layer, a primer layer coated on the substrate layer and a hot-foam layer coated on the primer layer, which is for use in an electronic or plastic component processing process to adhesively fix electronic or plastic components in place temporarily and separate, upon completion of the processing process and commencement of a component-reactivating process, the components from the water-based hot-foam adhesive panel by heating the water-based hot-foam adhesive panel at a fixed temperature for a specific period of time, so as to reduce volatile organic compound (VOC) emissions and effectuate environmental protection.

Abstract: A slurry composition containing a cracking agent contains paste 1.5-4.0 wt %, oil 1.0-3.0 wt %, a surfactant 0.2-0.5 wt %, a softening agent 0.1-0.5 wt % and a cracking agent 0.005-5.0 wt %. As compared with the formula of known raw slurry for fiberglass yarn, this slurry composition containing the cracking agent facilitates improving desizing efficiency of fiberglass fabric, lowering the required temperature for the second desizing process, shortening desizing time, reducing the loss on ignition, and enhancing the strength of the fiberglass fabric.

Abstract: The present invention relates to a non-PVC type calendered polyolefin sheet and the preparation process thereof, characterized in that a polyolefin material composition which is different from polyvinyl chloride (PVC) is processed by the calendering process to produce polyolefin plastic sheets; the process includes that first of all raw materials are evenly blended in a mixer, homogeneously melt-mixed in Banbury mixer, then fully gelled in a roll mill, thereafter calendered in a calender into the sheet which can be pattern-embossed with a set of embossing rolls if necessary, finally the sheet product is cooled down to fix the pattern.

Abstract: A hexahydrophthalate based compound is adapted to use as a plasticizer that contains no phthalic acid and benzoic acid, possess physical properties superior to DEHA and DINA in transparency and adhesion and is friendly to organisms and the environment; and a process for producing the hexahydrophthalate based compound includes esterifying hexahydrophthalic anhydride, a diol, and a catalyst for decarboxylation to get hexahydrophthalic alcohol, and adding a monoacid into the hexahydrophthalic alcohol for further esterification, thereby obtaining the hexahydrophthalate based compound.