Abstract: An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

Abstract: Systems, methods and devices directed to transformers are disclosed. One transformer system includes a set of transformer cells and a controller. The set of transformer cells is coupled in series to form a series coupling, where each transformer cell includes at least one first coil and at least one second coil. The second coil is configured to receive electrical energy from the first coil through magnetic interaction. The controller is configured to modify electrical aspects at ends of the series coupling by independently driving the transformer cells such that at least one of the transformer cells is driven differently from at least one other transformer cell in the set.

Abstract: Techniques for electrical power transfer in photovoltaic systems are provided. In one aspect, a photovoltaic system includes an array of photovoltaic power producing elements (e.g., concentrator photovoltaic cells); a power receiving unit; and at least one ratiometric DC to DC converter connected to both the array of photovoltaic power producing elements and the power receiving unit. The array of photovoltaic power producing elements can include a plurality of the photovoltaic power producing elements connected in series or in parallel. In another aspect, a method of transferring electrical power from an array of photovoltaic power producing elements to a power receiving unit includes the following step. At least one ratiometric DC to DC converter is connected to both the array of photovoltaic power producing elements and the power receiving unit. The at least one ratiometric DC to DC converter is configured to alter a voltage output from the array.

Abstract: An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

Abstract: An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

Abstract: A self-pumping liquid and gas cooling system for the cooling of solar cells and heat generating elements. A method for the self-pumping of liquid and gas coolants utilizes the cooling system. The essentially closed coolant system incorporates a heat exchanger having a length meandering tubing passing therethrough the opposite ends of which are, respectively, in communication with a driving pump and a return pump that are interconnected by a shaft. Hereby, tubing intermediate the circuit formed by the pumps extends through an evaporator structure containing the chip or heat-generating solar cell or cells.

Abstract: A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

Abstract: A cooling system for a heat-generating device includes: coolant fluid; an evaporator for holding the coolant fluid and for heating the coolant fluid; said evaporator in close proximity to the heat-generating device for removing unwanted heat. The cooling system also includes a plurality of tubes for providing a flow path for the coolant fluid and gases produced by the evaporator; a heat exchanger through which the tubes pass for cooling the coolant fluid. The heat exchanger includes: a reservoir, a coolant, and a heating element for heating the gas so that it expands and pushes cool coolant fluid back to the evaporator. The heating element may be located inside the reservoir.

Abstract: An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative movement over the mold plate; and a control mechanism configured for controlling positions of the solder fill head relative to the mold plate.

Abstract: A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

Abstract: An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.

Abstract: Embodiments of the present invention provide an approach in the time domain, instead of the frequency domain, for analyzing and correcting for radial propagation instability in servo-writing. In one embodiment, a system for controlling a read/write head of a disk drive to correct propagation errors during self-servo writing on a disk comprises a time-domain based controller to provide closed-loop feedback control to an actuator for moving the read/write head, the controller including a state observer. The controller is configured to measure read head position information of the read/write head on the disk; provide the measured read head position information to the state observer which produces feedback variables for feedback control of the read/write head, the feedback variables being weighted by feedback gains which have been determined a prior; and apply the weighted feedback variables to provide the closed-loop feedback control to the actuator for moving the read/write head.

Abstract: An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative movement over the mold plate; and a control mechanism configured for controlling positions of the solder fill head relative to the mold plate.

Abstract: A cooling system for a heat-generating device includes: coolant fluid; an evaporator for holding the coolant fluid and for heating the coolant fluid; said evaporator in close proximity to the heat-generating device for removing unwanted heat. The cooling system also includes a plurality of tubes for providing a flow path for the coolant fluid and gases produced by the evaporator; a heat exchanger through which the tubes pass for cooling the coolant fluid. The heat exchanger includes: a reservoir, a coolant, and a heating element for heating the gas so that it expands and pushes cool coolant fluid back to the evaporator. The heating element may be located inside the reservoir.

Abstract: An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.

Abstract: Using as an actuator a stepper motor operated in a position-sensed closed loop mode via an electronic commutator by position and anomaly corrected motion control signals provided by a programmable logic array and by a microprocessor, provides a precision power positioner. The correct enabling of the motor coils, based on position sensing of the motor phase, using electronic commutation for the stepper motor, transforms the problem of enabling coil selection to the programmable logic array, which by its logic provides a simplified operating control as a function of present armature position feedback, and by a microprocessor corrects for anomalies such as temperature rise, square-law, and phase increase as a function of position desired and present armature position feedback signals, and thus provides high positional accuracy, high speed and force (torque) control independent of the motor cardinal step positions.