Abstract: A dust collection assembly for a computer numerical control (CNC) cutting machine includes an adapter configured to couple to an arm of the CNC cutting machine and a head telescopically coupled to the adapter by a plurality of nested members. The CNC cutting machine includes the arm supporting a spindle and a tool holder coupled for co-rotation with the spindle. Each of the plurality of nested members are collapsible relative to each other. The head is movable between an extended position in which the nested members are configured to surround the tool holder and a tool bit, and a retracted position in which at least some of the nested members are telescopically received in the adapter. The head defines an inlet fluidly connected to the plurality of nested members when the head is at least in the extended position. The inlet is configured to fluidly connect to a vacuum.

Abstract: A dust collection assembly for a computer numerical control (CNC) cutting machine includes an adapter configured to couple to an arm of the CNC cutting machine and a head telescopically coupled to the adapter by a plurality of nested members. The CNC cutting machine includes the arm supporting a spindle and a tool holder coupled for co-rotation with the spindle. Each of the plurality of nested members are collapsible relative to each other. The head is movable between an extended position in which the nested members are configured to surround the tool holder and a tool bit, and a retracted position in which at least some of the nested members are telescopically received in the adapter. The head defines an inlet fluidly connected to the plurality of nested members when the head is at least in the extended position. The inlet is configured to fluidly connect to a vacuum.

Abstract: A message processing system is disclosed herein. A client computing device may receive an electronic message from a server via a network and via a forwarding operation on a condition that the electronic message is approved to be forwarded to a recipient. The client computing device may then receive from the server a message that the electronic message is unapproved, wherein the message includes a URL to view the unapproved electronic message and the electronic message is stored on the server with an indication that the electronic message is unapproved. The client computing device may then receive a list of unapproved electronic messages to display, wherein associated with the list are selectable options including to send the unapproved electronic message, to add a sender of the unapproved electronic message to an approved sender list, and to delete the unapproved electronic message.

Abstract: A message processing system is disclosed herein. A client computing device may receive an electronic message from a server via a network and via a forwarding operation on a condition that the electronic message is approved to be forwarded to a recipient. The client computing device may then receive from the server a message that the electronic message is unapproved, wherein the message includes a URL to view the unapproved electronic message and the electronic message is stored on the server with an indication that the electronic message is unapproved. The client computing device may then receive a list of unapproved electronic messages to display, wherein associated with the list are selectable options including to send the unapproved electronic message, to add a sender of the unapproved electronic message to an approved sender list, and to delete the unapproved electronic message.

Abstract: A message processing system is disclosed herein. A client computing device may receive an electronic message from a server via a network and via a forwarding operation on a condition that the electronic message is approved to be forwarded to a recipient. The client computing device may then receive from the server a message that the electronic message is unapproved, wherein the message includes a URL to view the unapproved electronic message and the electronic message is stored on the server with an indication that the electronic message is unapproved. The client computing device may then receive a list of unapproved electronic messages to display, wherein associated with the list are selectable options including to send the unapproved electronic message, to add a sender of the unapproved electronic message to an approved sender list, and to delete the unapproved electronic message.

Abstract: A message processing system, including an e-mail server for receiving and storing e-mails for a recipient, and an e-mail manager for processing e-mails for a recipient to determine if the e-mails are approved based on stored criteria, sending approved e-mails for the recipient to a location for access by the recipient, and storing and sending a notification to the recipient of unapproved messages.

Abstract: A message processing system, including an e-mail server for receiving and storing e-mails for a recipient, and an e-mail manager for processing e-mails for a recipient to determine if the e-mails are approved based on stored criteria, sending approved e-mails for the recipient to a location for access by the recipient, and storing and sending a notification to the recipient of unapproved messages.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

Abstract: A method of handling messages determines if a message is approved for a recipient of the message. If the message is approved, the method processes the message for subsequent viewing by the recipient. If the message is unapproved, the method notifies the recipient and stores the message.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

Abstract: A wafer level chip scale package (WLCSP) includes a semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

Abstract: A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

Abstract: A wafer level chip scale package (WLCSP) includes a packaged semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions, and encapsulation material surrounding the semiconductor die except for at least a portion of each of the solder bumps.

Abstract: A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.

Abstract: A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.

Abstract: A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die having a vertical power transistor, a first surface and a second surface. A ground plane proximate the second surface and distal to the first surface. A bus member covers a portion the first surface of the semiconductor die and has at least one leg that electrically couples a source region of the semiconductor die to the ground plane.

Abstract: A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die having a vertical power transistor, a first surface and a second surface. A ground plane proximate the second surface and distal to the first surface. A bus member covers a portion the first surface of the semiconductor die and has at least one leg that electrically couples a source region of the semiconductor die to the ground plane.