Abstract: An ignition apparatus for a spark gap arrangement containing at least a first and a second ignition capacitor for voltage division of a voltage between a first and a second electrode of the spark gap arrangement. A first trigger spark gap is arranged in a first parallel branch with respect to the first ignition capacitor, and a second trigger spark gap is arranged in a second parallel branch with respect to the second ignition capacitor. A first ignition resistor is disposed in the first parallel branch, wherein a first potential point between the first ignition resistor and the first trigger spark gap is connected to an ignition electrode of the second trigger spark gap. Furthermore, a spark gap arrangement containing the ignition apparatus, an arrangement containing a high-voltage device and the spark gap arrangement for protecting the high-voltage device, and a method for igniting the spark gap arrangement are disclosed.

Abstract: A dust collection assembly for a computer numerical control (CNC) cutting machine includes an adapter configured to couple to an arm of the CNC cutting machine and a head telescopically coupled to the adapter by a plurality of nested members. The CNC cutting machine includes the arm supporting a spindle and a tool holder coupled for co-rotation with the spindle. Each of the plurality of nested members are collapsible relative to each other. The head is movable between an extended position in which the nested members are configured to surround the tool holder and a tool bit, and a retracted position in which at least some of the nested members are telescopically received in the adapter. The head defines an inlet fluidly connected to the plurality of nested members when the head is at least in the extended position. The inlet is configured to fluidly connect to a vacuum.

Abstract: An ignition apparatus for a spark gap arrangement containing at least a first and a second ignition capacitor for voltage division of a voltage between a first and a second electrode of the spark gap arrangement. A first trigger spark gap is arranged in a first parallel branch with respect to the first ignition capacitor, and a second trigger spark gap is arranged in a second parallel branch with respect to the second ignition capacitor. A first ignition resistor is disposed in the first parallel branch, wherein a first potential point between the first ignition resistor and the first trigger spark gap is connected to an ignition electrode of the second trigger spark gap. Furthermore, a spark gap arrangement containing the ignition apparatus, an arrangement containing a high-voltage device and the spark gap arrangement for protecting the high-voltage device, and a method for igniting the spark gap arrangement are disclosed.

Abstract: A heating device has a combustion chamber and a gas flue configured to guide hot exhaust gas generated in the combustion chamber, the flue having an inlet region and an outlet region and is configured connected to the combustion chamber via the inlet region. Heat transfer ribs having a wall thickness are arranged spaced from each other in the gas flue for the heat transfer from hot exhaust gas to the gas flue. The wall thickness of the heat transfer ribs and/or the distances of the heat transfer ribs to one another are optionally configured to be larger on the sides of the inlet region than on the sides of the outlet region.

Abstract: A dust collection assembly for a computer numerical control (CNC) cutting machine includes an adapter configured to couple to an arm of the CNC cutting machine and a head telescopically coupled to the adapter by a plurality of nested members. The CNC cutting machine includes the arm supporting a spindle and a tool holder coupled for co-rotation with the spindle. Each of the plurality of nested members are collapsible relative to each other. The head is movable between an extended position in which the nested members are configured to surround the tool holder and a tool bit, and a retracted position in which at least some of the nested members are telescopically received in the adapter. The head defines an inlet fluidly connected to the plurality of nested members when the head is at least in the extended position. The inlet is configured to fluidly connect to a vacuum.

Abstract: The invention relates to an arrangement and a method for the galvanically separated energy transmission, in which the energy is transmitted via a dielectric waveguide.

Abstract: The invention relates to an arrangement and a method for the galvanically separated energy transmission, in which the energy is transmitted via a dielectric waveguide.

Abstract: A message processing system is disclosed herein. A client computing device may receive an electronic message from a server via a network and via a forwarding operation on a condition that the electronic message is approved to be forwarded to a recipient. The client computing device may then receive from the server a message that the electronic message is unapproved, wherein the message includes a URL to view the unapproved electronic message and the electronic message is stored on the server with an indication that the electronic message is unapproved. The client computing device may then receive a list of unapproved electronic messages to display, wherein associated with the list are selectable options including to send the unapproved electronic message, to add a sender of the unapproved electronic message to an approved sender list, and to delete the unapproved electronic message.

Abstract: A message processing system is disclosed herein. A client computing device may receive an electronic message from a server via a network and via a forwarding operation on a condition that the electronic message is approved to be forwarded to a recipient. The client computing device may then receive from the server a message that the electronic message is unapproved, wherein the message includes a URL to view the unapproved electronic message and the electronic message is stored on the server with an indication that the electronic message is unapproved. The client computing device may then receive a list of unapproved electronic messages to display, wherein associated with the list are selectable options including to send the unapproved electronic message, to add a sender of the unapproved electronic message to an approved sender list, and to delete the unapproved electronic message.

Abstract: A message processing system is disclosed herein. A client computing device may receive an electronic message from a server via a network and via a forwarding operation on a condition that the electronic message is approved to be forwarded to a recipient. The client computing device may then receive from the server a message that the electronic message is unapproved, wherein the message includes a URL to view the unapproved electronic message and the electronic message is stored on the server with an indication that the electronic message is unapproved. The client computing device may then receive a list of unapproved electronic messages to display, wherein associated with the list are selectable options including to send the unapproved electronic message, to add a sender of the unapproved electronic message to an approved sender list, and to delete the unapproved electronic message.

Abstract: A message processing system, including an e-mail server for receiving and storing e-mails for a recipient, and an e-mail manager for processing e-mails for a recipient to determine if the e-mails are approved based on stored criteria, sending approved e-mails for the recipient to a location for access by the recipient, and storing and sending a notification to the recipient of unapproved messages.

Abstract: In order to provide a spark gap configuration for overvoltage protection, the spark gap configuration has electrodes that face each other and exhibit a short deionization time. The electrodes have, on at least a portion thereof, a current-path bounding device for forcing a desired current path in the electrodes themselves resulting in improved spark behavior.

Abstract: A message processing system, including an e-mail server for receiving and storing e-mails for a recipient, and an e-mail manager for processing e-mails for a recipient to determine if the e-mails are approved based on stored criteria, sending approved e-mails for the recipient to a location for access by the recipient, and storing and sending a notification to the recipient of unapproved messages.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

Abstract: In order to provide a spark gap configuration for overvoltage protection, the spark gap configuration has electrodes that face each other and exhibit a short deionization time. The electrodes have, on at least a portion thereof, a current-path bounding device for forcing a desired current path in the electrodes themselves resulting in improved spark behavior.

Abstract: A method of handling messages determines if a message is approved for a recipient of the message. If the message is approved, the method processes the message for subsequent viewing by the recipient. If the message is unapproved, the method notifies the recipient and stores the message.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.

Abstract: A wafer level chip scale package (WLCSP) includes a semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions.

Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.