Patents by Inventor Dennis Lang

Dennis Lang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged semiconductor device and method of manufacture using shaped die
    Patent number: 7390698
    Abstract: A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: June 24, 2008
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Neill Thornton, Dennis Lang
  • RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE
    Publication number: 20080054461
    Abstract: A wafer level chip scale package (WLCSP) includes a packaged semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions, and encapsulation material surrounding the semiconductor die except for at least a portion of each of the solder bumps.
    Type: Application
    Filed: August 30, 2007
    Publication date: March 6, 2008
    Inventors: Dennis Lang, Sonbol Vaziri, James Naylor, Eric Woolsey, Chung-Lin Wu, Mike Gruenhagen, Neill Thornton
  • High temperature operating package and circuit design
    Publication number: 20080054496
    Abstract: The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
    Type: Application
    Filed: August 30, 2006
    Publication date: March 6, 2008
    Inventors: Neill Thornton, Dennis Lang
  • Packaged semiconductor device and method of manufacture using shaped die
    Publication number: 20060220241
    Abstract: A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.
    Type: Application
    Filed: May 31, 2006
    Publication date: October 5, 2006
    Inventors: Neill Thornton, Dennis Lang
  • Packaged semiconductor device and method of manufacture using shaped die
    Patent number: 7084488
    Abstract: A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: August 1, 2006
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Neill Thornton, Dennis Lang
  • Semiconductor package comprising vertical power transistor
    Patent number: 6674157
    Abstract: A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die having a vertical power transistor, a first surface and a second surface. A ground plane proximate the second surface and distal to the first surface. A bus member covers a portion the first surface of the semiconductor die and has at least one leg that electrically couples a source region of the semiconductor die to the ground plane.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: January 6, 2004
    Assignee: Fairchild Semiconductor Corporation
    Inventor: Dennis Lang
  • Motion-dampening fifth-wheel hitch
    Patent number: 6581951
    Abstract: The invention involves a connector apparatus for attaching a trailer to a towing vehicle. The invention has a base structure with a kingpin-receiving plate attached with respect to the top of the base structure and pivotable with respect thereto about a substantially horizontal cross-axis.
    Type: Grant
    Filed: March 6, 2001
    Date of Patent: June 24, 2003
    Inventor: Dennis Lange
  • Semiconductor packages for semiconductor devices
    Publication number: 20030085464
    Abstract: A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die having a vertical power transistor, a first surface and a second surface. A ground plane proximate the second surface and distal to the first surface. A bus member covers a portion the first surface of the semiconductor die and has at least one leg that electrically couples a source region of the semiconductor die to the ground plane.
    Type: Application
    Filed: November 2, 2001
    Publication date: May 8, 2003
    Applicant: Fairchild Semiconductor Corporation
    Inventor: Dennis Lang
  • Packaged semiconductor device and method of manufacture using shaped die
    Publication number: 20030025183
    Abstract: A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before encapsulation to move the peripheral area of the die, which is more susceptible to stress and cracking, further inside the molding compound. This results in a device that can better withstand stress as well being more resistant to corrosion and other reliability problems caused by environmental conditions.
    Type: Application
    Filed: July 31, 2002
    Publication date: February 6, 2003
    Applicant: Fairchild Semiconductor Corporation
    Inventors: Neill Thornton, Dennis Lang
  • Motion-dampening fifth-wheel hitch
    Publication number: 20020125683
    Abstract: The invention involves a connector apparatus for attaching a trailer to a towing vehicle. The invention has a base structure with a kingpin-receiving plate attached with respect to the top of the base structure and pivotable with respect thereto about a substantially horizontal cross-axis.
    Type: Application
    Filed: March 6, 2001
    Publication date: September 12, 2002
    Inventor: Dennis Lange