Abstract: The present invention provides for an apparatus and a method for automating the dispensing a liquid agent into a toilet.

Abstract: A global shutter image sensor with improved pixel failure coverage detects failures caused by the pixel chip of the image sensor. The global shutter image sensor includes a pixel chip including an array of photodiodes and associated logic, and a logic chip, bonded to the pixel chip, including an array of logic blocks for processing the images detected by the photodiodes. A failure detection circuit coupled to a reference voltage node of the image sensor detects a failure in the pixel chip by capturing a first level of pixel bias current and a second level of pixel bias current wherein a difference between the first level and the second level drives an output of the failure detection circuit either as logic high or as logic low.

Abstract: A cleaning device for cleaning a dispensing nozzle assembly of a beverage dispenser is disclosed. The dispensing nozzle assembly may include a macro-ingredient/diluent outlet and a number of micro-ingredient outlets surrounding the macro-ingredient/diluent outlet. The cleaning device may include a handle, a head end rotatably attached to the handle, a guidance protrusion extending from the head end, a first set of bristles extending from the head end and surrounding the guidance protrusion, and a second set of bristles extending from the head end adjacent to the first set of bristles.

Abstract: An electrochemical electrode and method for making same that provides enhanced characteristics for use in biosensors, such as blood glucose sensors. The electrode comprises a substrate, a conductive layer deposited on the substrate, and a resistive material layer deposited on the conductive layer. The conductive layer comprises nickel and chromium, and the resistive material layer comprises carbon and a carbon-nitrogen species.

Abstract: A biosensor component is provided that provides enhanced characteristics for use in biosensors, such as blood glucose sensors. The biosensor component comprises a substrate and a conductive layer coated on the substrate. The conductive layer includes nickel, chromium, and iron, such that a combined weight percent of the nickel and chromium in the conductive layer is in the range of 80 to less than 95 weight percent, and the weight percent of iron in the conductive layer is greater than 5 weight percent and less than 12 weight percent.

Abstract: The present disclosure relates to an electronic smoking article that provides for improved aerosol delivery. Particularly, the article comprises one or more microheaters. In various embodiments, the microheaters provide for improved control of vaporization of an aerosol precursor composition and provide for reduced power requirements to achieve consistent aerosolization. The present disclosure further relates to methods of forming an aerosol in a smoking article.

Abstract: The present invention describes articles, such as smoking articles, that can provide an inhalable substance in a form suitable for inhalation by a consumer. The article comprises a cartridge with an inhalable substance medium therein, control housing that includes an electrical energy source and an electrical power source, and a heating member that may be located in either the cartridge or the control housing. The control housing further may include puff-actuated current actuation components and current regulation components.

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

Abstract: A vapor-enhancing apparatus is provided for an electronic vapor smoking article. Such an apparatus includes a filter material and a tubular housing defining a lumen. The lumen has a mouth-engaging end and a longitudinally-opposed component-engaging end, and is configured to receive the filter material therein. The component-engaging end is adapted to operably engage a control body portion associated with the electronic vapor smoking article and to receive a vapor therethrough. A vapor-enhancing element is operably engaged with the filter material and is configured to enhance the vapor drawn through the filter material within the lumen, and through the mouth-engaging end, by application of suction to the mouth-engaging end of the housing. An associated method is also provided.

Abstract: A transport mechanism for engaging a pouch in an erect configuration at a first station of a packaging machine and transferring the pouch to a second station of the packaging machine includes a carriage and a grip assembly. The carriage is moveable between the first station and the second station. The grip assembly is coupled to the carriage and is at least partially moveable relative to the carriage between an engaged position for clamping the pouch in the erect configuration within the grip assembly, and a released position.

Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

Abstract: A biosensor component is provided that provides enhanced characteristics for use in biosensors, such as blood glucose sensors. The biosensor component comprises a substrate, a conductive layer deposited on the substrate, and a resistive material layer deposited on the conductive layer. The conductive layer includes nickel, chromium, and iron, such that a combined weight percent of the nickel and chromium in the conductive layer is in the range of 25 to less than 95 weight percent, the weight percent of nickel in the conductive layer is at least 4 weight percent, the weight percent of chromium in the conductive layer is at least 10 weight percent, the weight percent of iron in the conductive layer at least 2 weight percent, and such that the conductive layer comprises 0 to 20 weight percent molybdenum.

Abstract: A biosensor component is provided that provides enhanced characteristics for use in biosensors, such as blood glucose sensors. The biosensor component comprises a substrate, a conductive layer deposited on the substrate, and a resistive material layer deposited on the conductive layer. The conductive layer includes nickel, chromium, and iron, such that a combined weight percent of the nickel and chromium in the conductive layer is in the range of 25 to less than 95 weight percent, the weight percent of nickel in the conductive layer is at least 8 weight percent, the weight percent of chromium in the conductive layer is at least 10 weight percent, the weight percent of iron in the conductive layer at least 2 weight percent, and such that the conductive layer comprises 0 to 20 weight percent molybdenum.

Abstract: A mounting system for retrofitting a vibration sensor to a machine component is provided. The mounting system includes an elongate fastener, a washer, and a mounting boss. The elongate fastener includes a fastener head and an elongated body defining a longitudinal top end and a longitudinal bottom end. The longitudinal bottom end defines a fastening end configured to engage with a corresponding fastening receptacle of the machine component. The washer defines an external surface and includes a central cavity for engaging the elongated body of the elongate fastener therein. The mounting boss includes a first portion and a second portion. The first portion includes an internal cavity defining a first cavity section configured to engage with the external surface of the washer, and a second cavity section to engage with the fastener head of the elongate fastener. The second portion defines a receiving port for receiving the vibration sensor.

Abstract: A biosensor component that provides enhanced characteristics for use in biosensors, such as blood glucose sensors. The biosensor component comprises a substrate, and a composite layer deposited on the substrate. The composite layer includes a conductive metal component and a resistive material component, where the conductive metal component comprises one or more non-noble metals, and where the resistive material component in the composite layer is present in an amount greater than 20 atomic percent.

Abstract: The present invention provides a conductive substrate useful for Joule heating, such as in an electronic smoking article. Particularly, the invention provides a resistive heating element formed of a conductive substrate. The conductive substrate comprises an electrically conductive material and a carbonaceous additive, such as a binder material. The conductive substrate is carbonized in that it is subjected to calcining conditions to effectively reduce the carbonaceous additive to its carbon skeleton. It has been found that such carbonized substrate has surprisingly improved resistance properties in relation a substrate of the same formulation that is not carbonized. The carbonized substrate can include an aerosol precursor material. The formed resistive heating element can be included in an electronic smoking article to simultaneously provide resistive heating and aerosol formation with a single, unitary component.