Patents by Inventor Dennis Lee

Dennis Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11602175
    Abstract: The present invention provides a conductive substrate useful for Joule heating, such as in an electronic smoking article. Particularly, the invention provides a resistive heating element formed of a conductive substrate. The conductive substrate comprises an electrically conductive material and a carbonaceous additive, such as a binder material. The conductive substrate is carbonized in that it is subjected to calcining conditions to effectively reduce the carbonaceous additive to its carbon skeleton. It has been found that such carbonized substrate has surprisingly improved resistance properties in relation a substrate of the same formulation that is not carbonized. The carbonized substrate can include an aerosol precursor material. The formed resistive heating element can be included in an electronic smoking article to simultaneously provide resistive heating and aerosol formation with a single, unitary component.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: March 14, 2023
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: David William Griffith, Jr., Yi-Ping Chang, Calvin W. Henderson, Ricky Lee Montgomery, Walter Charles Liebscher, II, Chandra Kumar Banerjee, Paul E. Braxton, Stephen Benson Sears, Kenneth Allen Beard, Timothy Brian Nestor, Balager Ademe, Frederic Philippe Ampolini, Dennis Lee Potter
  • Patent number: 11561220
    Abstract: An electrochemical electrode for use in a biosensor. The electrode comprises a substrate, a palladium metal layer manufactured on the substrate, and a palladium oxide-containing layer manufactured on the palladium metal layer. The palladium metal layer has a thickness of no more than 90 nm, and the palladium oxide-containing layer has a thickness of no more than 40 nm.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: January 24, 2023
    Assignee: Eastman Chemical Company
    Inventors: Dennis Lee Ashford, II, Spencer Erich Hochstetler
  • Publication number: 20220401669
    Abstract: The present disclosure relates to aerosol delivery devices. The aerosol delivery devices include mechanisms configured to deliver an aerosol precursor composition from a reservoir to an atomizer including a vaporization heating element to produce a vapor. For example, a bubble jet head may be configured to dispense the aerosol precursor composition to the atomizer. The bubble jet head may be fixedly coupled to the atomizer. The bubble jet head may include a precursor inlet, an ejection heating element, and a precursor nozzle. The atomizer may include a vaporization heating element.
    Type: Application
    Filed: August 25, 2022
    Publication date: December 22, 2022
    Applicant: RAI Strategic Holdings, Inc.
    Inventors: David Allan Brammer, David Jackson, Nigel Flynn, Eric T. Hunt, Stephen Benson Sears, Dennis Lee Potter
  • Publication number: 20220322495
    Abstract: The present disclosure relates to an electronic smoking article that provides for improved aerosol delivery. Particularly, the article comprises one or more microheaters. In various embodiments, the microheaters provide for improved control of vaporization of an aerosol precursor composition and provide for reduced power requirements to achieve consistent aerosolization. The present disclosure further relates to methods of forming an aerosol in a smoking article.
    Type: Application
    Filed: June 17, 2022
    Publication date: October 6, 2022
    Inventors: William Robert Collett, Stephen Benson Sears, Dennis Lee Potter, Steven Lee Alderman, Mo Kebaili
  • Patent number: 11458265
    Abstract: Aerosol delivery devices including mechanisms configured to deliver an aerosol precursor composition from a reservoir to an atomizer including a vaporization heating element to produce a vapor are disclosed. For example, a bubble jet head may be configured to dispense the aerosol precursor composition to the atomizer. The bubble jet head may be fixedly coupled to the atomizer. The bubble jet head may include a precursor inlet, an ejection heating element, and a precursor nozzle. The atomizer may include a vaporization heating element.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: October 4, 2022
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: David Allan Brammer, David Jackson, Nigel John Flynn, Eric T. Hunt, Stephen Benson Sears, Dennis Lee Potter
  • Publication number: 20220252003
    Abstract: A mounting system for retrofitting a vibration sensor to a machine component is provided. The mounting system includes an elongate fastener, a washer, and a mounting boss. The elongate fastener includes a fastener head and an elongated body defining a longitudinal top end and a longitudinal bottom end. The longitudinal bottom end defines a fastening end configured to engage with a corresponding fastening receptacle of the machine component. The washer defines an external surface and includes a central cavity for engaging the elongated body of the elongate fastener therein. The mounting boss includes a first portion and a second portion. The first portion includes an internal cavity defining a first cavity section configured to engage with the external surface of the washer, and a second cavity section to engage with the fastener head of the elongate fastener. The second portion defines a receiving port for receiving the vibration sensor.
    Type: Application
    Filed: February 5, 2021
    Publication date: August 11, 2022
    Applicant: Caterpillar Inc.
    Inventors: Raghuandana H. Madhava, Ryan David Funk, Yuanhong Guan, Nathan Stephen Pauli, Daniel Gregory Wear, David Charles Hoots, Dennis Lee Kroeger
  • Publication number: 20220145606
    Abstract: The present invention provides for an apparatus and a method for automating the dispensing a liquid agent into a toilet.
    Type: Application
    Filed: November 12, 2021
    Publication date: May 12, 2022
    Inventor: Dennis Lee Sternitzky
  • Publication number: 20220084920
    Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.
    Type: Application
    Filed: December 1, 2021
    Publication date: March 17, 2022
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Stephen ST. GERMAIN, Jay A. YODER, Dennis Lee CONNER, Frank Robert CERVANTES, Andrew Celaya
  • Publication number: 20220047696
    Abstract: The invention provides stable coronavirus spike proteins. Immunogenic compositions comprising same and the methods of using these immunogenic compositions are also provided.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 17, 2022
    Inventors: Eric Todd Baima, Yulia Burakova, Paul Joseph Dominowski, Steven Alan Dunham, Nicole Lynn Hainer, John Morgan Hardham, Mahesh Kumar, Jason John Millership, Duncan M. Mwangi, Sharath K. Rai, Sharon Marie Wappel, Dennis Lee Foss
  • Patent number: 11246344
    Abstract: The present invention provides a conductive substrate useful for Joule heating, such as in an electronic smoking article. Particularly, the invention provides a resistive heating element formed of a conductive substrate. The conductive substrate comprises an electrically conductive material and a carbonaceous additive, such as a binder material. The conductive substrate is carbonized in that it is subjected to calcining conditions to effectively reduce the carbonaceous additive to its carbon skeleton. It has been found that such carbonized substrate has surprisingly improved resistance properties in relation a substrate of the same formulation that is not carbonized. The carbonized substrate can include an aerosol precursor material. The formed resistive heating element can be included in an electronic smoking article to simultaneously provide resistive heating and aerosol formation with a single, unitary component.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: February 15, 2022
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: David William Griffith, Jr., Yi-Ping Chang, Calvin W. Henderson, Ricky Lee Montgomery, Walter Charles Liebscher, II, Chandra Kumar Banerjee, Paul E. Braxton, Stephen Benson Sears, Kenneth Allen Beard, Timothy Brian Nestor, Balager Ademe, Frederic Philippe Ampolini, Dennis Lee Potter
  • Patent number: 11217515
    Abstract: Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: January 4, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Stephen St. Germain, Jay A. Yoder, Dennis Lee Conner, Frank Robert Cervantes, Andrew Celaya
  • Publication number: 20210282232
    Abstract: The present disclosure relates to an electronic smoking article that provides for improved aerosol delivery. Particularly, the article comprises one or more microheaters. In various embodiments, the microheaters provide for improved control of vaporization of an aerosol precursor composition and provide for reduced power requirements to achieve consistent aerosolization. The present disclosure further relates to methods of forming an aerosol in a smoking article.
    Type: Application
    Filed: May 21, 2021
    Publication date: September 9, 2021
    Inventors: William Robert Collett, Stephen Benson Sears, Dennis Lee Potter, Steven Lee Alderman, Mo Kebaili
  • Publication number: 20210227884
    Abstract: The present invention describes articles, such as smoking articles, that can provide an inhalable substance in a form suitable for inhalation by a consumer. The article comprises a cartridge with an inhalable substance medium therein, control housing that includes an electrical energy source and an electrical power source, and a heating member that may be located in either the cartridge or the control housing. The control housing further may include puff-actuated current actuation components and current regulation components.
    Type: Application
    Filed: April 15, 2021
    Publication date: July 29, 2021
    Inventors: Steven L. Worm, David Glen Christopherson, Stephen Benson Sears, Dennis Lee Potter, Frederic Philippe Ampolini, Balager Ademe
  • Patent number: D925371
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: July 20, 2021
    Assignee: The Procter & Gamble Company
    Inventors: Dennis Lee Maclam, Leigh Mahoney, Richard Michael Girardot, Luis Peraza
  • Patent number: D933484
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: October 19, 2021
    Assignee: The Procter & Gamble Company
    Inventors: Dennis Lee Maclam, Tracy Renae Murchison, Luis Peraza
  • Patent number: D948344
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 12, 2022
    Assignee: The Procter & Gamble Company
    Inventors: Dennis Lee Maclam, Leigh Mahoney, Richard Michael Girardot, Luis Peraza
  • Patent number: D948345
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 12, 2022
    Assignee: The Procter & Gamble Company
    Inventors: Dennis Lee Maclam, Leigh Mahoney, Richard Michael Girardot, Luis Peraza
  • Patent number: D959724
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: August 2, 2022
    Assignee: KOHLER CO.
    Inventors: Erin Leigh Hoover, Nicholas Robert Rindt, Dennis Lee Snyder, Seth M. Stevens, Maxwell Wasscher, Luke James Worth, Jovello Tijano Gomez, Jr.
  • Patent number: D961834
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: August 23, 2022
    Inventors: Erin Leigh Hoover, Nicholas Robert Rindt, Dennis Lee Snyder, Seth M. Stevens, Maxwell Wasscher, Luke James Worth, Jovello Tijano Gomez, Jr.
  • Patent number: D970085
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: November 15, 2022
    Inventors: Erin Leigh Hoover, Nicholas Robert Rindt, Dennis Lee Snyder, Seth M. Stevens, Maxwell Wasscher, Luke James Worth, Jovello Tijano Gomez, Jr.