Patents by Inventor Derk Reefman

Derk Reefman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230263507
    Abstract: A wireless intraluminal imaging device and an associated system are provided. In one embodiment, the wireless intraluminal imaging device includes a flexible elongate member including a proximal portion and a distal portion; an ultrasound imaging component coupled to the distal portion of the flexible elongate member; a cable coupled to the ultrasound imaging component and extending along the flexible elongate member; and a wireless communication component coupled to the proximal portion of the flexible elongate member, the wireless communication component in communication with the ultrasound imaging component via the cable. The wireless communication component wirelessly transmits ultrasound echo signals collected by the ultrasound imaging component to an image processing system via a wireless link for image generation at the image processing component.
    Type: Application
    Filed: May 2, 2023
    Publication date: August 24, 2023
    Inventors: Alfons Wouter GROENLAND, Arjen VAN DER HORST, Derk REEFMAN, David Holt BURKETT, Cesar PEREZ, Joseph James HOFFMAN, Gerald LITZZA
  • Publication number: 20230190119
    Abstract: A wireless intraluminal device and an associated system for treating and diagnosing patients are provided. In one embodiment, the wireless intraluminal device includes a flexible elongate member including a proximal portion and a distal portion; a sensor assembly coupled to the distal portion of the flexible elongate member; a cable coupled to the sensor assembly and extending along the flexible elongate member; and a wireless transceiver positioned within the flexible elongate member, wherein the wireless transceiver is in communication with the sensor assembly via the cable. A wireless communication component wirelessly transmits a sensor measurement collected by the sensor assembly to a sensor measurement processing system via a wireless link for physiological data generation at the sensor measurement processing system.
    Type: Application
    Filed: February 20, 2023
    Publication date: June 22, 2023
    Inventors: Alfons Wouter GROENLAND, Arjen VANDER HORST, Derk REEFMAN, David Holt BURKETT
  • Patent number: 11638576
    Abstract: A wireless intraluminal imaging device and an associated system are provided. In one embodiment, the wireless intraluminal imaging device includes a flexible elongate member including a proximal portion and a distal portion; an ultrasound imaging component coupled to the distal portion of the flexible elongate member; a cable coupled to the ultrasound imaging component and extending along the flexible elongate member; and a wireless communication component coupled to the proximal portion of the flexible elongate member, the wireless communication component in communication with the ultrasound imaging component via the cable. The wireless communication component wirelessly transmits ultrasound echo signals collected by the ultrasound imaging component to an image processing system via a wireless link for image generation at the image processing component.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: May 2, 2023
    Assignee: PHILIPS IMAGE GUIDED THERAPY CORPORATION
    Inventors: Alfons Wouter Groenland, Arjen van der Horst, Derk Reefman, David Holt Burkett, Cesar Perez, Joseph James Hoffman, Gerald Litzza
  • Patent number: 11583193
    Abstract: A wireless intraluminal device (102) and an associated system for treating and diagnosing patients are provided. In one embodiment, the wireless intraluminal device (102) includes a flexible elongate member (158) including a proximal portion (106) and a distal portion (108); a sensor assembly (116) coupled to the distal portion of the flexible elongate member; a cable (117) coupled to the sensor assembly and extending along the flexible elongate member; and a wireless transceiver (252) positioned within the flexible elongate member, wherein the wireless transceiver is in communication with the sensor assembly via the cable. A wireless communication component (104) wirelessly transmits a sensor measurement collected by the sensor assembly to a sensor measurement processing system (132) via a wireless link (150) for physiological data generation at the sensor measurement processing system.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: February 21, 2023
    Assignee: PHILIPS IMAGE GUIDED THERAPY CORPORATION
    Inventors: Alfons Wouter Groenland, Arjen Van Der Horst, Derk Reefman, David Holt Burkett
  • Publication number: 20190269335
    Abstract: A wireless intraluminal device (102) and an associated system for treating and diagnosing patients are provided. In one embodiment, the wireless intraluminal device (102) includes a flexible elongate member (158) including a proximal portion (106) and a distal portion (108); a sensor assembly (116) coupled to the distal portion of the flexible elongate member; a cable (117) coupled to the sensor assembly and extending along the flexible elongate member; and a wireless transceiver (252) positioned within the flexible elongate member, wherein the wireless transceiver is in communication with the sensor assembly via the cable. A wireless communication component (104) wirelessly transmits a sensor measurement collected by the sensor assembly to a sensor measurement processing system (132) via a wireless link (150) for physiological data generation at the sensor measurement processing system.
    Type: Application
    Filed: November 9, 2017
    Publication date: September 5, 2019
    Inventors: Alfons Wouter GROENLAND, Arjen VAN DER HORST, Derk REEFMAN, David Holt BURKETT
  • Publication number: 20190261958
    Abstract: A wireless intraluminal imaging device and an associated system are provided. In one embodiment, the wireless intraluminal imaging device includes a flexible elongate member including a proximal portion and a distal portion; an ultrasound imaging component coupled to the distal portion of the flexible elongate member; a cable coupled to the ultrasound imaging component and extending along the flexible elongate member; and a wireless communication component coupled to the proximal portion of the flexible elongate member, the wireless communication component in communication with the ultrasound imaging component via the cable. The wireless communication component wirelessly transmits ultrasound echo signals collected by the ultrasound imaging component to an image processing system via a wireless link for image generation at the image processing component.
    Type: Application
    Filed: November 7, 2017
    Publication date: August 29, 2019
    Inventors: Alfons Wouter Groenland, Arjen van der Horst, Derk Reefman, David Holt Burkett, Cesar Perez, Joseph James Hoffman, Gerald Litzza
  • Patent number: 10365338
    Abstract: An apparatus includes at least a first electrically conductive coil having at least first and second coil sections which are separated and spaced apart from each other, and a support structure disposed to support the first and second coil sections. The support structure, and an associated method of supporting the electrically conductive coil, maintain relative axial positions of the first and second coil sections to be fixed when the first electrically conductive coil is energized and de-energized, and allow each of the first and second coil sections to expand radially when energized.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: July 30, 2019
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Philip Alexander Jonas, Johannes Adrianus Overweg, Matthew Voss, Derk Reefman, James Howard Kralick, Xianrui Huang, Gerardus Bernardus Jozef Mulder, Joshua Kent Hilderbrand
  • Publication number: 20170097397
    Abstract: An apparatus includes at least a first electrically conductive coil having at least first and second coil sections which are separated and spaced apart from each other, and a support structure disposed to support the first and second coil sections. The support structure, and an associated method of supporting the electrically conductive coil, maintain relative axial positions of the first and second coil sections to be fixed when the first electrically conductive coil is energized and de-energized, and allow each of the first and second coil sections to expand radially when energized.
    Type: Application
    Filed: May 5, 2015
    Publication date: April 6, 2017
    Inventors: PHILIP ALEXANDER JONAS, JOHANNES ADRIANUS OVERWEG, MATTHEW VOSS, DERK REEFMAN, JAMES HOWARD KRALICK, XIANRUI HUANG, GERARDUS BERNARDUS JOZEF MULDER, JOSHUA KENT HILDERBRAND
  • Patent number: 8866480
    Abstract: The invention relates to a nuclear magnetic resonance imaging apparatus comprising: a main magnet (122) adapted for generating a main magnetic field; at least one radio frequency receiver coil unit (144) for acquiring magnetic resonance signals in a receiver coil radio frequency band (202) from an examined object (124); means (140) for inductively (wirelessly) supplying electric power to an electric component of the apparatus, wherein the electric component is adapted to be powered by inductively supplied electric power, wherein the power transfer frequency (200) and the higher-harmonics (206) of the power transfer frequency (200) for inductively supplying the electric power are located outside the receiver coil radio frequency band (202).
    Type: Grant
    Filed: June 15, 2009
    Date of Patent: October 21, 2014
    Assignee: Koninklijke Philips N.V.
    Inventors: Eberhard Waffenschmidt, Achim Hilgers, Lambertus De Vries, Bjoern Weissler, Derk Reefman, Marinus Johannes Adrianus Maria Van Helvoort, Pieter Gerrit Blanden
  • Patent number: 8729665
    Abstract: An integration substrate for a system in package comprises a through-substrate via and a trench capacitor wherein with a trench filling that includes at least four electrically conductive capacitor-electrode layers in an alternating arrangement with dielectric layers. —The capacitor-electrode layers are alternatingly connected to a respective one of two capacitor terminals provided on the first or second substrate side. The trench capacitor and the through-substrate via are formed in respective trench openings and via openings in the semiconductor substrate, which have an equal lateral extension exceeding 10 micrometer. This structure allows, among other advantages, a particularly cost-effective fabrication of the integration substrate because the via openings and the trench openings in the substrate can be fabricated simultaneously.
    Type: Grant
    Filed: May 8, 2008
    Date of Patent: May 20, 2014
    Assignee: IPDIA
    Inventors: Johan H. Klootwijk, Freddy Roozeboom, Jaap Ruigrok, Derk Reefman
  • Patent number: 8634445
    Abstract: In a wireless communications system, such as a multiband Ultra Wideband communications system, data is transmitted by means of the phases of pulses in multiple frequency bands. A signal is transmitted with a predetermined phase in at least one of the frequency bands for at least a part of the time, and can be used to allow accurate detection of the phases of the signals transmitted in the other frequency bands. One of the frequency bands can be designated as a reference band, and pulses can be transmitted with constant phase in the reference band. More generally, pulses can be transmitted in the other frequency bands with phases which have a known relationship with the phases of the pulses in the reference band.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: January 21, 2014
    Assignee: NXP B.V.
    Inventors: Derk Reefman, Raf L. J. Roovers
  • Patent number: 8610404
    Abstract: An electronic device is provided which comprises a DC-DC converter. The DC-DC converter comprises at least one solid-state rechargeable battery (B1, B2) for storing energy for the DC-DC conversion and an output capacitor (C2).
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: December 17, 2013
    Assignee: NXP B.V.
    Inventors: Derk Reefman, Freddy Roozeboom, Petrus H. L. Notten, Johan H. Klootwijk
  • Patent number: 8395472
    Abstract: The present invention provides a means to integrate planar coils on silicon, while providing a high inductance. This high inductance is achieved through a special back- and front sided shielding of a material. In many applications, high-value inductors are a necessity. In particular, this holds for applications in power management. In these applications, the inductors are at least 5 of the order of 1 ?H, and must have an equivalent series resistance of less than 0.1?. For this reason, those inductors are always bulky components, of a typical size of 2×2×1 mm 3, which make a fully integrated solution impossible. On the other hand, integrated inductors, which can monolithically be integrated, do exist. However, these inductors suffer either from low inductance values, or 10 very-high DC resistance values.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: March 12, 2013
    Assignee: NXP B.V.
    Inventors: Freddy Roozeboom, Derk Reefman, Johan Hendrik Klootwijk, Lukas Frederik Tiemeijer, Jaap Ruigrok
  • Patent number: 8395914
    Abstract: The present invention relates to a configurable trench multi-capacitor device comprising a trench in a semiconductor substrate. The trench has a lateral extension exceeding 10 micrometer and a trench filling includes a number of at least four electrically conductive capacitor-electrode layers. A switching unit is provided that comprises a plurality of switching elements electrically interconnected between different capacitor-electrode layers of the trench filling. A control unit is connected with the switching unit and configured to generate and provide to the switching unit respective control signals for forming a respective one of a plurality of multi-capacitor configurations using the capacitor-electrode layers of the trench filling.
    Type: Grant
    Filed: May 8, 2008
    Date of Patent: March 12, 2013
    Assignee: NXP B.V.
    Inventors: Johan H. Klootwijk, Hendrik J. Bergveld, Freddy Roozeboom, Derk Reefman, Jaap Ruigrok
  • Patent number: 8310024
    Abstract: The chip comprises a network of trench capacitors and an inductor, wherein the trench capacitors are coupled in parallel with a pattern of interconnects that is designed so as to limit generation of eddy current induced by the inductor in the interconnects. This allows the use of the chip as a portion of a DC-DC converter, that is integrated in an assembly of a first chip and this—second chip. The inductor of this integrated DC-DC converter may be defined elsewhere within the assembly.
    Type: Grant
    Filed: May 14, 2007
    Date of Patent: November 13, 2012
    Assignee: NXP B.V.
    Inventors: Derk Reefman, Freddy Roozeboom, Johan H. Klootwijk
  • Patent number: 8193685
    Abstract: A transducer (800) is provided where a membrane (830) is formed over a front substrate (615); and a piezoelectric layer (820) is formed over the membrane (830) at an active portion (821) and peripheral portions located adjacent the active portion (821). A patterned conductive layer including first and second electrodes (840, 845) is formed over the piezoelectric layer (820). Further, a back substrate structure is provided having supports (822, 824) located at the peripheral portions adjacent the active portion (821). The height (826) of the supports (822, 824) is greater than a combined height (828) of the patterned piezoelectric layer and the patterned conductive layer. Many transducers may be connected to form an array, where a controller may be provided for controlling the array, such as steering a beam of the array, and processing signals received by the array, for presence or motion detection and/or imaging, for example.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: June 5, 2012
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Mareike Klee, Ronald Dekker, Harry Van Esch, Marco De Wild, Ruediger Mauczok, Chris Van Heesch, Willem Franke Pasveer, Engel Johannes Knibbe, Remco Alphonsus Hendrikus Breen, Klaus Reimann, Biju Kumar Sreedharan Nair, Roger Peter Anna Delnoij, Henri Marie Joseph Boots, Christina Adriana Renders, Olaf Wunnicke, Derk Reefman, Peter Dirksen
  • Patent number: 8085524
    Abstract: An electronic device includes at least one trench capacitor that can also take the form of an inverse structure, a pillar capacitor. An alternating layer sequence of at least two dielectric layers and at least two electrically conductive layers is provided in the trench capacitor or on the pillar capacitor, such that the at least two electrically conductive layers are electrically isolated from each other and from the substrate by respective ones of the at least two dielectric layers. A set of internal contact pads is provided, and each internal contact pad is connected with a respective one of the electrically conductive layers or with the substrate. A range of switching opportunities is opened up that allows tuning the specific capacitance of the capacitor to a desired value.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: December 27, 2011
    Assignee: IPDIA
    Inventors: Freddy Roozeboom, Johan H. Klootwijk, Antonius L. A. M. Kemmeren, Derk Reefman, Johannes F. C. M. Verhoeven
  • Publication number: 20110128111
    Abstract: The present invention provides a means to integrate planar coils on silicon, while providing a high inductance. This high inductance is achieved through a special back- and front sided shielding of a material. In many applications, high-value inductors are a necessity. In particular, this holds for applications in power management. In these applications, the inductors are at least 5 of the order of 1 ?H, and must have an equivalent series resistance of less than 0.1 ?. For this reason, those inductors are always bulky components, of a typical size of 2×2×1 mm 3, which make a fully integrated solution impossible. On the other hand, integrated inductors, which can monolithically be integrated, do exist. However, these inductors suffer either from low inductance values, or 10 very-high DC resistance values.
    Type: Application
    Filed: June 30, 2009
    Publication date: June 2, 2011
    Applicant: NXP B.V.
    Inventors: Freddy Roozeboom, Derk Reefman, Johan Hendrik Klootwijk, Lukas Frederik Tiemeijer, Jaap Ruigrok
  • Publication number: 20110084694
    Abstract: The invention relates to a nuclear magnetic resonance imaging apparatus comprising: a main magnet (122) adapted for generating a main magnetic field; at least one radio frequency receiver coil unit (144) for acquiring magnetic resonance signals in a receiver coil radio frequency band (202) from an examined object (124); means (140) for inductively (wirelessly) supplying electric power to an electric component of the apparatus, wherein the electric component is adapted to be powered by inductively supplied electric power, wherein the power transfer frequency (200) and the higher-harmonics (206) of the power transfer frequency (200) for inductively supplying the electric power are located outside the receiver coil radio frequency band (202).
    Type: Application
    Filed: June 15, 2009
    Publication date: April 14, 2011
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Eberhard Waffenschmidt, Achim Hilgers, Lambertus De Vries, Bjoern Weissler, Derk Reefman, Marinus Johannes Adrianus Maria Van Helvoort, Pieter Gerrit Blanden
  • Publication number: 20100277040
    Abstract: A transducer (800) is provided where a membrane (830) is formed over a front substrate (615); and a piezoelectric layer (820) is formed over the membrane (830) at an active portion (821) and peripheral portions located adjacent the active portion (821). A patterned conductive layer including first and second electrodes (840, 845) is formed over the piezoelectric layer (820). Further, a back substrate structure is provided having supports (822, 824) located at the peripheral portions adjacent the active portion (821). The height (826) of the supports (822, 824) is greater than a combined height (828) of the patterned piezoelectric layer and the patterned conductive layer. Many transducers may be connected to form an array, where a controller may be provided for controlling the array, such as steering a beam of the array, and processing signals received by the array, for presence or motion detection and/or imaging, for example.
    Type: Application
    Filed: June 30, 2008
    Publication date: November 4, 2010
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Mareike Klee, Klaus Reimann, Biju K. Sreedharan Nair, Roger Peter Anna Delnoij, Henri M. J. Boots, Christina A. Renders, Olaf Wunnicke, Derk Reefman, Peter Dirksen, Ronald Dekker, Harry Van Esch, Marco De Wild, Ruediger Mauczok, Chris Van Heesch, Willem F. Pasveer, Engel Johannes Knibbe, Remco A.H. Breen