Abstract: A circuit carrier for at least one electrical component, including: a metal substrate layer, a first electrical insulation layer arranged on the metal substrate layer, a second electrical insulation layer arranged on the first insulation layer, and an electrically conductive layer, arranged on the second electrical insulation layer, having at least one conductor track for electrically connecting the at least one electrical component, wherein at least one of the two electrical insulation layers is colored in such a way that the two electrical insulation layers have different colors.

Abstract: A power semiconductor component includes at least one power semiconductor device disposed within a housing and a heat sink having an area a exposed on a first surface of the housing. A wiring substrate has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is disposed on the second main surface. The heat dissipation region has an area A on the second main surface, and a<A. The housing with the power semiconductor device is disposed on the second main surface of the wiring substrate in such a way that the heat sink is disposed completely on the heat dissipation region and is connected thereto by way of a solder layer. A method for producing a power semiconductor component is also provided.

Abstract: A heat dissipation device for soldering onto a printed circuit board for a semiconductor component arrangement. The device includes a semiconductor component a first electrical connector and at least one further electrical connector and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.

Abstract: A circuit board (1) for a power semiconductor module (13), having at least one top side (2) and one bottom side (3), wherein at least one mounting area (4) for a power semiconductor component (12) is provided on the top side (2), wherein on the mounting area (4), at least one solder layer (8) is provided for connecting at least one power semiconductor component (12) to the mounting area (4), which layer is divided into regions (9) that are separated from one another by means of intermediate spaces (11), and wherein multiple thermal vias (5) are provided in the circuit board (1) and extend from the top side (2) to the bottom side (3) of the circuit board (2) in the region of the mounting area (4), wherein each upper opening (6) of the thermal vias (5) is directly surrounded by a respective region (9) of the solder layer (8) and each lower opening (7) of the vias (5) is covered by a layer (10) of electrically insulating material.

Abstract: A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.

Abstract: A power semiconductor component is specified, having a power semiconductor device arranged within a housing, wherein a heat sink is exposed on a first surface of the housing; a wiring substrate which receives the housing with the power semiconductor device and which has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is arranged on the second main surface. The housing is arranged on the wiring substrate in such a way that the heat sink is connected to the heat dissipation region via a solder layer. A number of spacers which are arranged between the heat sink and the heat dissipation region are embedded in the solder layer. Furthermore, a method for producing a power semiconductor component is specified.

Abstract: A power semiconductor component includes at least one power semiconductor device disposed within a housing and a heat sink having an area a exposed on a first surface of the housing. A wiring substrate has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is disposed on the second main surface. The heat dissipation region has an area A on the second main surface, and a<A. The housing with the power semiconductor device is disposed on the second main surface of the wiring substrate in such a way that the heat sink is disposed completely on the heat dissipation region and is connected thereto by way of a solder layer. A method for producing a power semiconductor component is also provided.

Abstract: A charging device module for installation in an electrically driveable vehicle, including a charging device and an internal cooling circuit for cooling the charging device, wherein the internal cooling circuit has connections for connection to a superordinate cooling circuit of the vehicle, wherein the connections comprise at least one inlet and at least one outlet, and a bypass line connects the at least one inlet to the at least one outlet while bypassing the internal cooling circuit, wherein an actuable valve is associated with the at least one inlet, by which valve the flow of coolant through the internal cooling circuit and the bypass line can be controlled.

Abstract: A semiconductor assembly includes a semiconductor component having a redistribution substrate with a top side, an underside and a semiconductor chip on the top side. Contact connection pads for connection to contact pads of the chip are on the top side of the substrate. External contact pads on the underside are electrically connected to the contact connection pads by conductor tracks. The external contact pads are at a greater distance from one another in a first region than a second region of the underside. The semiconductor component is on a printed circuit board. Contact pads corresponding to the external contacts are on a top side of the printed circuit board and are at a greater distance from one another in a first region than a second region of the top side. Through holes are formed between the contact pads in the first region of the printed circuit board.

Abstract: A housing has electrically conductive top and bottom parts which together form an accommodation chamber. A circuit board is arranged in the accommodation chamber. A bottom side of the circuit board is connected electrically to the top side via conductive bores. The circuit board has circuit components and electromechanical plug components for connecting to components outside the housing. A first electrically conductive separating wall electrically connects the housing top part to the top side of the circuit board. A second electrically conductive separating wall electrically connects the housing bottom part to the bottom side of the circuit board. The first and second separating walls subdivide the accommodation chamber into first and second accommodation-chamber sections that are disposed on opposite sides of the first and second separating walls.

Abstract: A housing has electrically conductive top and bottom parts which together form an accommodation chamber. A circuit board is arranged in the accommodation chamber. A bottom side of the circuit board is connected electrically to the top side via conductive bores. The circuit board has circuit components and electromechanical plug components for connecting to components outside the housing. A first electrically conductive separating wall electrically connects the housing top part to the top side of the circuit board. A second electrically conductive separating wall electrically connects the housing bottom part to the bottom side of the circuit board. The first and second separating walls subdivide the accommodation chamber into first and second accommodation-chamber sections that are disposed on opposite sides of the first and second separating walls.

Abstract: A contact assembly for an electronic component includes a wiring substrate having an upper face, a lower face and at least one contact connection surface on the upper face. At least one bonding strip is provided for connection to the at least one contact connection surface. The at least one contact connection surface is disposed on at least one metal-filled recess in the volume of the wiring substrate. A semiconductor component, an electronic component and a method for producing an electronic component are also provided.

Abstract: An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.

Abstract: A power semiconductor component is specified, having a power semiconductor device arranged within a housing, wherein a heat sink is exposed on a first surface of the housing; a wiring substrate which receives the housing with the power semiconductor device and which has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is arranged on the second main surface. The housing is arranged on the wiring substrate in such a way that the heat sink is connected to the heat dissipation region via a solder layer. A number of spacers which are arranged between the heat sink and the heat dissipation region are embedded in the solder layer. Furthermore, a method for producing a power semiconductor component is specified.

Abstract: An electronic assembly, has at least one circuit board with conductor tracks, at least one current-limiting arrangement in the form of a thermal predetermined breaking point in at least one of the conductor tracks, and a fire-containment device in the region of the current-limiting arrangement.

Abstract: A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.

Abstract: A printed circuit board has first, second, and third printed circuit board sections extending along a longitudinal direction between two transverse edge outer sides of the printed circuit board. The printed circuit board has at each of its two longitudinal ends a respective transverse edge strip, which has regions of the first, second, and third printed circuit board sections and extends continuously transversely with respect to the longitudinal direction along a transverse edge outer side. A depression is formed in the third printed circuit board section on the first printed circuit board side between the two transverse edge strips. The first and/or second printed circuit board sections has a first metallic conductor track section that extends electrically conductively right into one or both of the two transverse edge strips.

Abstract: A charging device module for installation in an electrically driveable vehicle, including a charging device and an internal cooling circuit for cooling the charging device, wherein the internal cooling circuit has connections for connection to a superordinate cooling circuit of the vehicle, wherein the connections comprise at least one inlet and at least one outlet, and a bypass line connects the at least one inlet to the at least one outlet while bypassing the internal cooling circuit, wherein an actuable valve is associated with the at least one inlet, by which valve the flow of coolant through the internal cooling circuit and the bypass line can be controlled.

Abstract: A method for testing a printed circuit board includes providing a printed circuit board having a first main section, a second main section, a bent connecting section and at least one monitoring conductor track. The connecting section is disposed between the first main section and the second main section. The monitoring conductor track runs from the first main section, in a curved manner through the connecting section, to the second main section. At least one electrical measurement value which is representative of the integrity of the at least one monitoring conductor track is detected. A printed circuit board, a control unit and methods for producing the printed circuit board and for operating the control unit are also provided.

Abstract: A semiconductor assembly includes a semiconductor component having a redistribution substrate with a top side, an underside and a semiconductor chip on the top side. Contact connection pads for connection to contact pads of the chip are on the top side of the substrate. External contact pads on the underside are electrically connected to the contact connection pads by conductor tracks. The external contact pads are at a greater distance from one another in a first region than a second region of the underside. The semiconductor component is on a printed circuit board. Contact pads corresponding to the external contacts are on a top side of the printed circuit board and are at a greater distance from one another in a first region than a second region of the top side. Through holes are formed between the contact pads in the first region of the printed circuit board.