Abstract: A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.

Abstract: A method for producing a lateral connection of an electro-optical interface is specified. In the method, a printed circuit board having a non-curved center plane is provided. An electro-optical component and an electrical component are arranged and oriented with respect to one another in a connection region. A first section of the printed circuit board is deformed in such a way that the center plane encloses an angle with the non-deformed layer in the region of the first section. An electro-optical interface and a control device are also specified.

Abstract: A circuit board assembly for a control unit of a motor vehicle has a multi-layer circuit board and a plug connector with a housing faceplate. The circuit board, which includes conductor paths for conducting signals, has a first section, a second section, and a flexible third section with a lower stiffness between the first and second sections. The first section encloses an angle ? with the second section. The plug connector has a multiplicity of connection elements, each with an attachment part and a contact pin. The housing faceplate has first and second side panels each enclosing an angle ? with the first panel central plane and an angle ? with the second panel central plane. A first detent element prevents a change in the angle ? in a first direction of rotation. A second detent element prevents a change in the angle ? in a second direction of rotation.

Abstract: A method for producing a lateral connection of an electro-optical interface is specified. In the method, a printed circuit board having a non-curved center plane is provided. An electro-optical component and an electrical component are arranged and oriented with respect to one another in a connection region. A first section of the printed circuit board is deformed in such a way that the center plane encloses an angle with the non-deformed layer in the region of the first section. An electro-optical interface and a control device are also specified.

Abstract: A plug contact is provided for the provision of a press contact with a mating contact. The plug contact is composed of an electrically conductive material. The plug contact has a first contact section for the provision of the press contact. The first contact section has, at least in places, an electrically conductive organic coating, and the organic coating contains a metal, an alloy, and/or an electrically conductive polymer. A printed circuit board arrangement is also provided.

Abstract: A method for manufacturing a circuit carrier for electronic components includes making available a carrier material layer made of an electrically insulating material and having at least one connecting layer which is applied at least to a first and/or second surface of the carrier material layer and has in each case a predefined layer thickness. Each connecting layer has a number of electrically conductive connections with a predefined conductor track width. At least some of the connections are strengthened by plasma spraying, at least in certain sections, with additional electrically conductive material. As a result, a greater layer thickness than the predefined layer thickness and/or a larger conductor track width than the predefined conductor track width is obtained. Furthermore, a circuit carrier for electronic components is specified.

Abstract: A plug contact is provided for the provision of a press contact with a mating contact. The plug contact is composed of an electrically conductive material. The plug contact has a first contact section for the provision of the press contact. The first contact section has, at least in places, an electrically conductive organic coating, and the organic coating contains a metal, an alloy, and/or an electrically conductive polymer. A printed circuit board arrangement is also provided.

Abstract: A printed circuit board includes at least two rigid printed circuit board parts which are connected to one another by at least one flexible connecting part which is thinner than the rigid printed circuit board parts. The at least two rigid printed circuit board parts can be moved toward one another by bending the flexible connecting part. A groove, which is produced by the different thickness of the rigid printed circuit board parts relative to the flexible connecting part, is filled with an elastic material.

Abstract: A module housing has a housing component for securing an electronic assembly and a plug connector for electrically connecting to the assembly. The plug connector has a main part with a plurality of receiving areas for electric plug contacts and a plug frame which surrounds the receiving areas. The module housing has a locking arrangement in order to mechanically secure the plug connector to the housing component, the locking arrangement has a locking element of the plug connector and a locking element of the housing component. The locking element of the plug connector has a hook element, and the locking element of the housing component has a corresponding recess for receiving the hook element.

Abstract: A printed circuit board includes at least two rigid printed circuit board parts which are connected to one another by at least one flexible connecting part which is thinner than the rigid printed circuit board parts. The at least two rigid printed circuit board parts can be moved toward one another by bending the flexible connecting part. A groove, which is produced by the different thickness of the rigid printed circuit board parts relative to the flexible connecting part, is filled with an elastic material.

Abstract: A circuit board has a grown metal layer in a flexible zone. A circuit board has a first part, a second part and a recess in the circuit board that is arranged between the first part and the second part. A thickness of the circuit board reduced in the region of the recess. The first part can be pivoted relative to the second part as a result of the recess. The flexibility of the circuit board is improved in the range of the recess by a metal layer applied on a surface section of the circuit board in the recess by deposition. Furthermore, EMC problems can be reduced by the metal layer on a side wall of the recess and electrical contacts to conductor path metallization layers can be created.

Abstract: A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.

Abstract: A printed circuit board has a first main side and a second main side disposed opposite the first main side. A first and a second rigid zone are linked to each other by way of a flexible zone and the flexible zone is embodied thinner than the first and second rigid zones perpendicular to the first and second main sides. The flexible zone has at least one metallization layer and at least one substrate layer formed of an insulating material and connected to the at least one metallization layer. The substrate layer is formed with a plurality of trenches which in each case extend at the most up to one of the one or more metallization layers.

Abstract: A circuit board has a grown metal layer in a flexible zone. A circuit board has a first part, a second part and a recess in the circuit board that is arranged between the first part and the second part. A thickness of the circuit board reduced in the region of the recess. The first part can be pivoted relative to the second part as a result of the recess. The flexibility of the circuit board is improved in the range of the recess by a metal layer applied on a surface section of the circuit board in the recess by deposition. Furthermore, EMC problems can be reduced by the metal layer on a side wall of the recess and electrical contacts to conductor path metallization layers can be created.

Abstract: A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.

Abstract: A printed circuit board has a first main side and a second main side disposed opposite the first main side. A first and a second rigid zone are linked to each other by way of a flexible zone and the flexible zone is embodied thinner than the first and second rigid zones perpendicular to the first and second main sides. The flexible zone has at least one metallization layer and at least one substrate layer formed of an insulating material and connected to the at least one metallization layer. The substrate layer is formed with a plurality of trenches which in each case extend at the most up to one of the one or more metallization layers.

Abstract: A printed circuit board has a first elongated face and a second elongated face opposite the first face. The printed circuit board has at least one first, second and third rigid region in addition to at least one first and second flexible region. The flexible regions are perpendicular to the faces and are thinner than the rigid regions. The first rigid region is only coupled to the second rigid region by way of the first flexible region and the second rigid region is only coupled to the third rigid region by way of the second flexible region. The first flexible region lies flush against the first face and the second flexible region lies flush against the second face of the printed circuit board.

Abstract: A housing configuration for a printed circuit board equipped with components, includes a housing with at least partially metallic housing walls as well as at least one metallic spring profile element. The spring profile element has a first and a second profile leg, which are connected to one another forming an essentially V-shaped profile cross section, and is inserted into a gap region between an edge of the printed circuit board and the housing wall. The first profile leg is connected to a ground terminal of the printed circuit board, and the second profile leg exerts an elastic spreading force as it bears against the housing wall and makes electrical contact with the latter.